Revision history of "hisilicon/kunpeng/hi1616"

Diff selection: Mark the radio boxes of the revisions to compare and hit enter or the button at the bottom.
Legend: (cur) = difference with latest revision, (prev) = difference with preceding revision, m = minor edit.

(cur | prev) 09:12, 8 May 2019‎ David (talk | contribs)‎ . . (2,419 bytes) (+34)‎ . . (undo)
(cur | prev) 19:49, 5 May 2019‎ David (talk | contribs)‎ m . . (2,385 bytes) (0)‎ . . (David moved page hisilicon/hi16xx/hi1616 to hisilicon/kunpeng/hi1616) (undo)
(cur | prev) 02:26, 16 December 2018‎ David (talk | contribs)‎ . . (2,385 bytes) (+94)‎ . . (undo)
(cur | prev) 02:24, 16 December 2018‎ David (talk | contribs)‎ . . (2,291 bytes) (-3)‎ . . (undo)
(cur | prev) 02:23, 16 December 2018‎ David (talk | contribs)‎ . . (2,294 bytes) (+165)‎ . . (undo)
(cur | prev) 02:22, 16 December 2018‎ David (talk | contribs)‎ . . (2,129 bytes) (+10)‎ . . (undo)
(cur | prev) 02:21, 16 December 2018‎ David (talk | contribs)‎ . . (2,119 bytes) (+167)‎ . . (undo)
(cur | prev) 02:08, 16 December 2018‎ David (talk | contribs)‎ . . (1,952 bytes) (+12)‎ . . (undo)
(cur | prev) 03:13, 22 November 2018‎ 212.91.166.163 (talk)‎ . . (1,940 bytes) (+35)‎ . . (undo)
(cur | prev) 01:35, 1 August 2018‎ David (talk | contribs)‎ . . (1,905 bytes) (+298)‎ . . (undo)
(cur | prev) 01:19, 1 August 2018‎ David (talk | contribs)‎ . . (1,607 bytes) (0)‎ . . (→‎Cache) (undo)
(cur | prev) 00:57, 1 August 2018‎ David (talk | contribs)‎ . . (1,607 bytes) (0)‎ . . (→‎Cache) (undo)
(cur | prev) 00:55, 1 August 2018‎ David (talk | contribs)‎ . . (1,607 bytes) (0)‎ . . (undo)
(cur | prev) 00:50, 1 August 2018‎ David (talk | contribs)‎ . . (1,607 bytes) (+70)‎ . . (undo)
(cur | prev) 00:49, 1 August 2018‎ David (talk | contribs)‎ . . (1,537 bytes) (+1,537)‎ . . (1616)

Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Kunpeng 916 (Hi1616) - HiSilicon#pcie +
base frequency	2,400 MHz (2.4 GHz, 2,400,000 kHz) +
core count	32 +
core name	Cortex-A72 +
designer	HiSilicon + and ARM Holdings +
family	Hi16xx +
first announced	August 2017 +
first launched	August 2017 +
full page name	hisilicon/kunpeng/hi1616 +
has ecc memory support	true +
instance of	microprocessor +
isa	ARMv8 +
isa family	ARM +
l1$ size	2,560 KiB (2,621,440 B, 2.5 MiB) +
l1d$ description	8-way set associative +
l1d$ size	1,024 KiB (1,048,576 B, 1 MiB) +
l1i$ description	8-way set associative +
l1i$ size	1,536 KiB (1,572,864 B, 1.5 MiB) +
l2$ description	8-way set associative +
l2$ size	8 MiB (8,192 KiB, 8,388,608 B, 0.00781 GiB) +
l3$ description	16-way set associative +
l3$ size	32 MiB (32,768 KiB, 33,554,432 B, 0.0313 GiB) +
ldate	August 2017 +
main image	+
manufacturer	TSMC +
market segment	Server +
max cpu count	2 +
max memory	524,288 MiB (536,870,912 KiB, 549,755,813,888 B, 512 GiB, 0.5 TiB) +
max memory bandwidth	71.53 GiB/s (73,246.72 MiB/s, 76.805 GB/s, 76,804.753 MB/s, 0.0699 TiB/s, 0.0768 TB/s) +
max memory channels	4 +
max sata ports	8 +
max usb ports	2 +
microarchitecture	Cortex-A72 +
model number	Hi1616 +
name	Hi1616 +
process	16 nm (0.016 μm, 1.6e-5 mm) +
smp max ways	2 +
supported memory type	DDR4-2400 +
tdp	85 W (85,000 mW, 0.114 hp, 0.085 kW) +
technology	CMOS +
thread count	32 +
used by	HiSilicon D05 + and Huawei TaiShan 2280 +
word size	64 bit (8 octets, 16 nibbles) +

WikiChip

The Fuse Coverage

Social Media

Companies

Microarchitectures

Technology Nodes

Intel

AMD

ARM

Cavium

Samsung

Intel

AMD

Ampere

Apple

Cavium

HiSilicon

MediaTek

NXP

Qualcomm

Renesas

Samsung