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Facts about "Ryzen 9 5900HX - AMD"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Ryzen 9 5900HX - AMD#pcie + |
base frequency | 3,300 MHz (3.3 GHz, 3,300,000 kHz) + |
clock multiplier | 33 + |
core count | 8 + |
core family | 25 + |
core model | 80 + |
core name | Cezanne + |
designer | AMD + |
family | Ryzen 9 + |
first announced | January 12, 2021 + |
first launched | January 12, 2021 + |
full page name | amd/ryzen 9/5900hx + |
has advanced vector extensions | true + |
has advanced vector extensions 2 | true + |
has amd amd-v technology | true + |
has amd amd-vi technology | true + |
has amd sensemi technology | true + |
has ecc memory support | false + |
has feature | Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology + |
has simultaneous multithreading | true + |
has x86 advanced encryption standard instruction set extension | true + |
instance of | microprocessor + |
integrated gpu | Radeon Vega 8 + |
integrated gpu designer | AMD + |
integrated gpu execution units | 8 + |
integrated gpu max frequency | 2,100 MHz (2.1 GHz, 2,100,000 KHz) + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 512 KiB (524,288 B, 0.5 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l2$ description | 8-way set associative + |
l2$ size | 4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) + |
l3$ description | 16-way set associative + |
l3$ size | 16 MiB (16,384 KiB, 16,777,216 B, 0.0156 GiB) + |
ldate | January 12, 2021 + |
manufacturer | TSMC + |
market segment | Mobile + |
max case temperature | 378.15 K (105 °C, 221 °F, 680.67 °R) + |
max cpu count | 1 + |
microarchitecture | Zen 3 + |
min case temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
model number | 5900HX + |
name | Ryzen 9 5900HX + |
package | FP6 + |
part number | 100-000000300 + |
process | 7 nm (0.007 μm, 7.0e-6 mm) + |
series | 5000 + |
smp max ways | 1 + |
supported memory type | DDR4-3200 + and LPDDR4-4266 + |
tdp | 45 W (45,000 mW, 0.0603 hp, 0.045 kW) + |
tdp down | 35 W (35,000 mW, 0.0469 hp, 0.035 kW) + |
tdp up | 54 W (54,000 mW, 0.0724 hp, 0.054 kW) + |
technology | CMOS + |
thread count | 16 + |
turbo frequency | 4,600 MHz (4.6 GHz, 4,600,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |