-
WikiChip
WikiChip
-
Architectures
Popular x86
-
Intel
- Client
- Server
- Big Cores
- Small Cores
-
AMD
Popular ARM
-
ARM
- Server
- Big
- Little
-
Cavium
-
Samsung
-
-
Chips
Popular Families
-
Ampere
-
Apple
-
Cavium
-
HiSilicon
-
MediaTek
-
NXP
-
Qualcomm
-
Renesas
-
Samsung
-
From WikiChip
Revision history of "amd/packages/sp4"
Diff selection: Mark the radio boxes of the revisions to compare and hit enter or the button at the bottom.
Legend: (cur) = difference with latest revision, (prev) = difference with preceding revision, m = minor edit.
Retrieved from "https://en.wikichip.org/wiki/amd/packages/sp4"
Facts about "Package SP4 - AMD"
| designer | AMD + |
| first launched | February 21, 2018 + |
| instance of | package + |
| market segment | Embedded + |
| microarchitecture | Zen + |
| name | Package SP4 + |
| package | BGA-2028 + |
| package contacts | 2,028 + |
| package length | 45 mm (4.5 cm, 1.772 in) + |
| package pitch | 0.8 mm (0.0315 in) + |
| package type | FC-OBGA + |
| package width | 45 mm (4.5 cm, 1.772 in) + |
| tdp | 100 W (100,000 mW, 0.134 hp, 0.1 kW) + |