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Facts about "Package FT3 - AMD"
designerAMD +
first launchedMay 2013 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitectureJaguar +
nameFT3 +
packageBGA-769 +
package contacts769 +
package length24.5 mm (2.45 cm, 0.965 in) +
package pitch0.65 mm (0.0256 in) +
package typeOrganic Micro Ball Grid Array +
package width24.5 mm (2.45 cm, 0.965 in) +
tdp25 W (25,000 mW, 0.0335 hp, 0.025 kW) +