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  • (cur | prev) 16:41, 25 July 2020QuietRub (talk | contribs). . (2,283 bytes) (+2,283). . (Created page with "{{amd title|Package CBGA-360}} {{package |name=Package CBGA-360 |designer=AMD |first launched=March 5, 1998 |market=Mobile |microarch=K6 |tdp=11 W |package name=CBGA-360 |pack...")
designerAMD +
first launchedMarch 5, 1998 +
instance ofpackage +
market segmentMobile +
microarchitectureK6 +
namePackage CBGA-360 +
packageCBGA-360 +
package contacts360 +
package length25 mm (2.5 cm, 0.984 in) +
package pitch1.27 mm (0.05 in) +
package typeCeramic Ball Grid Array +
package width25 mm (2.5 cm, 0.984 in) +
tdp11 W (11,000 mW, 0.0148 hp, 0.011 kW) +