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Revision history of "amd/packages/cbga-360"
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Retrieved from "https://en.wikichip.org/wiki/amd/packages/cbga-360"
Facts about "Package CBGA-360 - AMD"
designer | AMD + |
first launched | March 5, 1998 + |
instance of | package + |
market segment | Mobile + |
microarchitecture | K6 + |
name | Package CBGA-360 + |
package | CBGA-360 + |
package contacts | 360 + |
package length | 25 mm (2.5 cm, 0.984 in) + |
package pitch | 1.27 mm (0.05 in) + |
package type | Ceramic Ball Grid Array + |
package width | 25 mm (2.5 cm, 0.984 in) + |
tdp | 11 W (11,000 mW, 0.0148 hp, 0.011 kW) + |