Editing amd/packages/socket 754

{{amd title|Socket 754}}
{{package
|name=Socket 754
|designer=AMD
|first launched=September 23, 2003
|market=Desktop
|microarch=K8
|tdp=89 W
|package name=OPGA-754
|package type=Organic Pin Grid Array
|package contacts=754
|package dimension=40.0 mm
|package dimension 2=40.0 mm
|package pitch=1.27 mm
|socket name=Socket 754
|socket type=PGA
}}
'''Socket 754''' was the socket for '''µOPGA-754'''-packaged [[AMD]] microprocessors, successor to {{\\|Socket A}} and the original socket for AMD's [[amd/athlon_64|Athlon 64]] family, i.e. [[amd/microarchitectures/k8|K8 microarchitecture]] processors. With the introduction of the dual memory channel {{\\|Socket 939}} in mid-2004 this socket was relegated to the budget/value segment. Server processors progressed to {{\\|Socket 940}}. Socket 754 was used in AMD's first mobile platform and superseded in this role by {{\\|Socket S1}}.

== Features ==
* 754-pin micro pin grid array, 1.27 mm pitch, 29 × 29 pins, 40 × 40 mm organic substrate
* Lidded and lidless (mobile processors) packages
* 0.8 - 1.55 V supply voltage, 89 W TDP
* 16 bit [[HyperTransport]] interface up to 800 MHz, 1600 MT/s, 3.2 Gbyte/s in each direction
* 64/72 bit DDR SDRAM interface up to 200 MHz, PC-3200 (DDR-400), 3.2 Gbyte/s, SEC-DED ECC
** Up to 3 UDIMMs or 4 RDIMMs (Athlon 64), up to 1 Gbyte per UDIMM, 4 Gbyte per RDIMM
** Up to 2 SO-UDIMMs (Turion 64)
** Up to 3 UDIMMs (other models)
* P-States, ACPI C1 (Halt), C2, C3/S1 (Stop Grant), S3 (Core & HT power down), S5 (all power off)
* Thermal diode, overtemperature protection

== Chipsets ==
* ATI 380, 480 series
* SiS 750, 760 series
* Nvidia nForce3, nForce4, nForce 410/430
* VIA K8T800, K8M800

== Processors using Socket 754 ==
* AMD Athlon 64 codename "ClawHammer", "Newcastle", "Venice"
* AMD Mobile Athlon 64 "ClawHammer", "Odessa", "Oakville", "Newark"
* AMD Sempron "Paris", "Palermo"
* AMD Mobile Sempron "Dublin", "Georgetown", "Sonora", "Albany", "Roma"
* AMD Turion 64 "Lancaster"
* AMD Athlon XP-M "ClawHammer", "Odessa", "Dublin"
<!-- ClawHammer, Newcastle, Odessa, Paris, Dublin: 130 nm, others 90 nm.
  Mobile Athlon 64, Mobile Sempron, Turion 64, Athlon XP-M lidless, others lidded.
  Sempron, Mobile Sempron, and Athlon XP-M 32 bit only, i.e. x86-64 disabled.
  All processors single core.
  Various sources claim all these Athlon XP-M models use Dublin Rev. C0/CG
  which seems dubious. Based on chip area and part number suffix they seem to use
  ClawHammer Rev. C0 (AHN3000BIXAP), ClawHammer CG (-AR), Odessa CG (-AX), Dublin CG (-AY). -->

<!-- NOTE:
           This table is generated automatically from the data in the actual articles.
           If a microprocessor is missing from the list, an appropriate article for it needs to be
           created and tagged accordingly.

           Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
-->
{{comp table start}}
<table class="comptable sortable tc13 tc14 tc15 tc16 tc17 tc18 tc19">
<tr class="comptable-header"><th>&nbsp;</th><th colspan="19">List of all Socket 754-based Processors</th></tr>
{{comp table header 1|cols=Price, Process, Launched, µarch, Family, Core, C, T, Freq, Turbo, TDP}}
{{#ask: [[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[socket::Socket 754]]
 |?full page name
 |?model number
 |?release price
 |?process
 |?first launched
 |?microarchitecture
 |?microprocessor family
 |?core name
 |?core count
 |?thread count
 |?base frequency#GHz
 |?turbo frequency (1 core)#GHz
 |?tdp
 |format=template
 |template=proc table 3
 |userparam=13
 |mainlabel=-
}}
{{comp table count|ask=[[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[socket::Socket 754]]}}
</table>
{{comp table end}}

== Package Diagram ==
:[[File:OPGA-754 lidded diag.svg|725px]]

OPGA-754 lidded package. All dimensions in millimeters.

:[[File:OPGA-754 lidless B1 diag.svg|831px]]

OPGA-754 lidless B1 package (Mobile Athlon 64 and Athlon XP-M "ClawHammer"). All dimensions in millimeters.

:[[File:OPGA-754 lidless B2 diag.svg|831px]]

OPGA-754 lidless B2 package (Mobile Athlon 64 and Athlon XP-M "Odessa"). All dimensions in millimeters.

:[[File:OPGA-754 lidless B3 diag.svg|831px]]

OPGA-754 lidless B3 package (Mobile Sempron and Athlon XP-M "Dublin"). All dimensions in millimeters.

== Socket Outline ==
:[[File:Socket 754 diag.svg|537px]]

All dimensions in millimeters.

== Pin Map ==
:[[File:OPGA-754 lidded pinmap.svg|531px]]

OPGA-754 lidded package. Pin AG10 MEMRESET_L is NC on lidless packages.

== References ==
* "AMD Functional Data Sheet, 754 Pin Package", AMD Publ. #31410
* "Socket 754 Design and Qualification Requirements", AMD Publ. #24850
* "AMD Athlon™ 64 Processor Product Data Sheet", AMD Publ. #24659
* "AMD Sempron™ Processor Product Data Sheet", AMD Publ. #31805
* "AMD Turion™ 64 Mobile Technology Product Data Sheet", AMD Publ. #32816

== See also ==
* {{\\|Socket A}}
* {{\\|Socket 939}}
* {{\\|Socket 940}}
* {{\\|Socket S1}}

[[Category:amd]]
designer	AMD +
first launched	September 23, 2003 +
instance of	package +
market segment	Desktop +
microarchitecture	K8 +
name	Socket 754 +
package	OPGA-754 +
package contacts	754 +
package length	40 mm (4 cm, 1.575 in) +
package pitch	1.27 mm (0.05 in) +
package type	Organic Pin Grid Array +
package width	40 mm (4 cm, 1.575 in) +
socket	Socket 754 +
tdp	89 W (89,000 mW, 0.119 hp, 0.089 kW) +