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designer	AMD +
first launched	February 21, 2018 +
instance of	package +
market segment	Embedded +
microarchitecture	Zen +
name	SP4r2 +
package	SP4r2 +
package length	45 mm (4.5 cm, 1.772 in) +
package pitch	0.8 mm (0.0315 in) +
package type	FC-OBGA +
package width	45 mm (4.5 cm, 1.772 in) +
tdp	55 W (55,000 mW, 0.0738 hp, 0.055 kW) +

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