Editing amd/ryzen 9/5900hx

{{amd title|Ryzen 9 5900HX}}
{{chip
|name=Ryzen 9 5900HX
|no image=Yes
|designer=AMD
|manufacturer=TSMC
|model number=5900HX
|part number=100-000000300
|market=Mobile
|first announced=January 12, 2021
|first launched=January 12, 2021
|family=Ryzen 9
|series=5000
|locked=
|frequency=3,300 MHz
|turbo frequency=4,600 MHz
|clock multiplier=33
|isa=x86-64
|isa family=x86
|microarch=Zen 3
|core name=Cezanne
|core family=25
|core model=80
|process=7 nm
|technology=CMOS
|word size=64 bit
|core count=8
|thread count=16
|max memory=
|max cpus=1
|tdp=45 W
|ctdp down=35 W
|ctdp up=54 W
|tcase min=0 °C
|tcase max=105 °C
|package name 1=amd,socket_fp6
}}
'''Ryzen 9 5900HX''' is a {{arch|64}} [[octa-core]] high-end performance [[x86]] mobile microprocessor introduced by [[AMD]] in early [[2021]]. Fabricated on a [[TSMC]] [[7-nanometer process]] and based on AMD's {{amd|Zen 3|Zen 3 microarchitecture|l=arch}}, the 5900HX operates at a base frequency of 3.3 GHz with a [[TDP]] of 45 W and a {{amd|Precision Boost|boost}} frequency of up to 4.6 GHz. This APU supports a configurable TDP-down of 35 W and TDP-up of 54 W, DDR4-3200 or LPDDR4-4266 memory, and integrates a {{amd|Radeon Vega 8}} GPU operating at up to 2.1 GHz. 

== Cache ==
{{main|amd/microarchitectures/zen 3#Memory_Hierarchy|l1=Zen 3 § Cache}}
{{cache size
|l1 cache=512 KiB
|l1i cache=256 KiB
|l1i break=8x32 KiB
|l1i desc=8-way set associative
|l1d cache=256 KiB
|l1d break=8x32 KiB
|l1d desc=8-way set associative
|l1d policy=write-back
|l2 cache=4 MiB
|l2 break=8x512 KiB
|l2 desc=8-way set associative
|l2 policy=write-back
|l3 cache=16 MiB
|l3 break=1x16 MiB
|l3 desc=16-way set associative
|l3 policy=write-back
}}

== Memory controller ==
{{memory controller
|type=DDR4-3200
|type 2=LPDDR4-4266
}}

== Expansions ==
{{expansions main
|
{{expansions entry
|type=PCIe
|pcie revision=3.0
}}
}}

== Graphics ==
{{integrated graphics
| gpu                 = Radeon Vega 8
| device id           =
| designer            = AMD
| execution units     = 8
| unified shaders     =
| max displays        =
| max memory          =
| frequency           =
| max frequency       = 2,100 MHz
| output crt          =
| output sdvo         =
| output dsi          =
| output edp          =
| output dp           =
| output hdmi         =
| output vga          =
| output dvi          =
| directx ver         =
| opengl ver          =
| opencl ver          =
| hdmi ver            =
| dp ver              =
| edp ver             =
| max res hdmi        =
| max res hdmi freq   =
| max res dp          =
| max res dp freq     =
| max res edp         =
| max res edp freq    =
| max res vga         =
| max res vga freq    =
}}

== Features == 
{{x86 features
|real=Yes
|protected=Yes
|smm=Yes
|fpu=Yes
|x8616=Yes
|x8632=Yes
|x8664=Yes
|nx=Yes
|mmx=Yes
|emmx=Yes
|sse=Yes
|sse2=Yes
|sse3=Yes
|ssse3=Yes
|sse41=Yes
|sse42=Yes
|sse4a=Yes
|sse_gfni=No
|avx=Yes
|avx_gfni=No
|avx2=Yes
|avx512f=No
|avx512cd=No
|avx512er=No
|avx512pf=No
|avx512bw=No
|avx512dq=No
|avx512vl=No
|avx512ifma=No
|avx512vbmi=No
|avx5124fmaps=No
|avx512vnni=No
|avx5124vnniw=No
|avx512vpopcntdq=No
|avx512gfni=No
|avx512vaes=No
|avx512vbmi2=No
|avx512bitalg=No
|avx512vpclmulqdq=No
|abm=Yes
|tbm=No
|bmi1=Yes
|bmi2=Yes
|fma3=Yes
|fma4=No
|aes=Yes
|rdrand=Yes
|sha=Yes
|xop=No
|adx=Yes
|clmul=Yes
|f16c=Yes
|bfloat16=No
|tbt1=No
|tbt2=No
|tbmt3=No
|tvb=No
|bpt=No
|eist=No
|sst=No
|flex=No
|fastmem=No
|ivmd=No
|intelnodecontroller=No
|intelnode=No
|kpt=No
|ptt=No
|intelrunsure=No
|mbe=No
|isrt=No
|sba=No
|mwt=No
|sipp=No
|att=No
|ipt=No
|tsx=No
|txt=No
|ht=No
|vpro=No
|vtx=No
|vtd=No
|ept=No
|mpx=No
|sgx=No
|securekey=No
|osguard=No
|intqat=No
|dlboost=No
|3dnow=No
|e3dnow=No
|smartmp=No
|powernow=No
|amdvi=Yes
|amdv=Yes
|amdsme=
|amdtsme=
|amdsev=
|rvi=
|smt=Yes
|sensemi=Yes
|xfr=
|xfr2=
|mxfr=
|amdpb=
|amdpb2=
|amdpbod=
}}

== References ==
* [https://ir.amd.com/news-events/press-releases/detail/986/amd-announces-worlds-best-mobile-processors-in-ces "AMD Announces World’s Best Mobile Processors In CES 2021 Keynote"] (Press release). AMD.com. January 12, 2021. Retrieved May 2021.
* [https://www.amd.com/en/products/apu/amd-ryzen-9-5900hx "AMD Ryzen™ 9 5900HX"]. AMD.com. Retrieved May 2021.
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Ryzen 9 5900HX - AMD#pcie +
base frequency	3,300 MHz (3.3 GHz, 3,300,000 kHz) +
clock multiplier	33 +
core count	8 +
core family	25 +
core model	80 +
core name	Cezanne +
designer	AMD +
family	Ryzen 9 +
first announced	January 12, 2021 +
first launched	January 12, 2021 +
full page name	amd/ryzen 9/5900hx +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has amd amd-v technology	true +
has amd amd-vi technology	true +
has amd sensemi technology	true +
has ecc memory support	false +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension + and SenseMI Technology +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	Radeon Vega 8 +
integrated gpu designer	AMD +
integrated gpu execution units	8 +
integrated gpu max frequency	2,100 MHz (2.1 GHz, 2,100,000 KHz) +
isa	x86-64 +
isa family	x86 +
l1$ size	512 KiB (524,288 B, 0.5 MiB) +
l1d$ description	8-way set associative +
l1d$ size	256 KiB (262,144 B, 0.25 MiB) +
l1i$ description	8-way set associative +
l1i$ size	256 KiB (262,144 B, 0.25 MiB) +
l2$ description	8-way set associative +
l2$ size	4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
l3$ description	16-way set associative +
l3$ size	16 MiB (16,384 KiB, 16,777,216 B, 0.0156 GiB) +
ldate	January 12, 2021 +
manufacturer	TSMC +
market segment	Mobile +
max case temperature	378.15 K (105 °C, 221 °F, 680.67 °R) +
max cpu count	1 +
microarchitecture	Zen 3 +
min case temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
model number	5900HX +
name	Ryzen 9 5900HX +
package	FP6 +
part number	100-000000300 +
process	7 nm (0.007 μm, 7.0e-6 mm) +
series	5000 +
smp max ways	1 +
supported memory type	DDR4-3200 + and LPDDR4-4266 +
tdp	45 W (45,000 mW, 0.0603 hp, 0.045 kW) +
tdp down	35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
tdp up	54 W (54,000 mW, 0.0724 hp, 0.054 kW) +
technology	CMOS +
thread count	16 +
turbo frequency	4,600 MHz (4.6 GHz, 4,600,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +