Editing amd/packages/ft3

{{amd title|Package FT3}}
{{package
|name=FT3
|designer=AMD
|market=Mobile
|market 2=Embedded
|first launched=May 2013
|microarch=Jaguar
|tdp=25 W
|package name=BGA-769
|package type=Organic Micro Ball Grid Array
|package contacts=769
|package dimension=24.5 mm
|package dimension 2=24.5 mm
|package pitch=0.65-1.1 mm
}}

'''FT3''' is a '''BGA-769''' package for low power [[AMD]] mobile and embedded microprocessors with an integrated north bridge, graphics processor, and controller hub. Its counterpart for desktop processors is the PGA-721 package for {{\\|Socket AM1}}. FT3 succeeded the {{\\|FT1}} package and was superseded by the {{\\|FT3b}} package.

All processors for package FT3, codename "Kabini", "Temash", and "Kyoto", are members of AMD's Family 16h with CPU cores based on the {{amd|Jaguar|l=arch}} microarchitecture, and are fabricated on a 28 nm SOI process.


=== Features ===
* 769-pin lidless micro ball grid array package, 0.65-1.1 mm multi-pitch, 24.5 × 24.5 mm, organic substrate

* 64/72 bit DDR3 SDRAM interface up to 800 MHz, PC3-12800 (DDR3-1600), 12.8 GB/s
** Up to 2 SR/DR UDIMMs or SODIMMs, ECC supported
** JEDEC 1.5V, 1.35V, 1.25V
** AMD Memory Controller PowerCap

* PCIe Gen 1.0 and 2.0 (5 GT/s)
** One x4 external graphics card link
** Configurable x4 General Purpose Ports (1x4, 2x2, 1x2 + 2x1, 4x1)

* Two independent display controllers
** Two single link digital display interfaces
** DisplayPort 1.2 up to 4096 × 2160 at 30 Hz, 30 bpp
** Single link DVI up to 1920 × 1200 at 60 Hz, 24 bpp
** LVDS interface
** HDMI, HDCP, eDP, DP++, 3D video, DP audio, Aux Channel
** VGA/DAC interface up to 2048 × 1536 at 60 Hz
** Miracast-certified, one wireless display up to 1920 × 1080, HDCP 2

* Integrated Controller Hub 
** 2 × USB 1.1, 2.0, 3.0 (5 Gb/s)
** 8 × USB 1.1, 2.0
** 2 × SATA 1.0, 2.0, 3.0 (6 Gb/s)
** 2 × 1 Gigabit Ethernet, multiplexed with GPP
** SD 3.0 interface, SMBus, LPC, HD audio, 4 × UART, Serial IRQ, SPI, GPIO

* Power Management
** AMD AllDay power technology
** ACPI P-states, processor power states C0, C1, CC6, PC6, sleep states S0, S3, S4, S5
** PCIe power gating
** PCIe speed power policy
** AMD Turbo CORE technology 3.0 with per core power gating

* Thermal Controls
** Sideband temperature control
** Hardware thermal control
** Local hardware thermal control
** DRAM thermal protection
** Fan control

== Processors using FT3 ==
* AMD A-Series "Kabini", "Temash"
* AMD E-Series "Kabini"
* AMD Opteron "Kyoto"
* AMD G-Series 1st Gen

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           If a microprocessor is missing from the list, an appropriate article for it needs to be
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           Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
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{{comp table start}}
<table class="comptable sortable tc13 tc14 tc15 tc16 tc17 tc18 tc19">
<tr class="comptable-header"><th>&nbsp;</th><th colspan="19">List of all FT3-based Processors</th></tr>
{{comp table header 1|cols=Price, Process, Launched, µarch, Family, Core, C, T, Freq, Turbo, TDP}}
{{#ask: [[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::FT3]]
 |?full page name
 |?model number
 |?release price
 |?process
 |?first launched
 |?microarchitecture
 |?microprocessor family
 |?core name
 |?core count
 |?thread count
 |?base frequency#GHz
 |?turbo frequency (1 core)#GHz
 |?tdp
 |format=template
 |template=proc table 3
 |userparam=13
 |mainlabel=-
}}
{{comp table count|ask=[[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::FT3]]}}
</table>
{{comp table end}}

== Package Diagram ==
:[[File:BGA-769 FT3 diag.svg]]

Approximate dimensions of the Kabini package. All dimensions in millimeters.

:[[File:BGA-769 FT3 pn.svg|800px]]

FT3 package ball numbers.

== Pin Map ==
:[[File:BGA-769 FT3 pinmap.svg|800px]]

== References ==
* "Family 16h Models 00h-0Fh AMD A-Series Mobile Accelerated Processor Product Data Sheet", AMD Publ. #52169, Rev. 3.03, February 13, 2014
* "Family 16h Models 00h-0Fh AMD E-Series Mobile Processor Product Data Sheet", AMD Publ. #53509, Rev. 3.02, February 13, 2014
* "Family 16h Models 00h - 0Fh AMD Opteron™ Processor Product Data Sheet", AMD Publ. #53102, Rev. 3.02, February 13, 2014
* "AMD Embedded G-Series SOC (Family 16h Models 00h-0Fh) Product Data Sheet", AMD Publ. #52259, Rev. 3.04, February 13, 2014
* "BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 16h Models 00h-0Fh Processors", AMD Publ. #48751, Rev. 3.03, February 23, 2015
* "Product Brief: 1st and 2nd Generation AMD Embedded G-Series System-on-Chip (SOC)", PID 169776-A, 2015

== See also ==
* {{\\|Socket AM1}}
* {{\\|FT1|Package FT1}}
* {{\\|FT3b|Package FT3b}}

[[Category:amd]]
designer	AMD +
first launched	May 2013 +
instance of	package +
market segment	Mobile + and Embedded +
microarchitecture	Jaguar +
name	FT3 +
package	BGA-769 +
package contacts	769 +
package length	24.5 mm (2.45 cm, 0.965 in) +
package pitch	0.65 mm (0.0256 in) +
package type	Organic Micro Ball Grid Array +
package width	24.5 mm (2.45 cm, 0.965 in) +
tdp	25 W (25,000 mW, 0.0335 hp, 0.025 kW) +