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Retrieved from "https://en.wikichip.org/wiki/amd/packages/ft1"
Facts about "Package FT1 - AMD"
designer | AMD + |
first launched | January 4, 2011 + |
instance of | package + |
market segment | Mobile + and Embedded + |
microarchitecture | Bobcat + |
name | FT1 + |
package | FT1 + and UOB413 + |
package contacts | 413 + |
package height | 1.92 mm (0.0756 in) + |
package length | 19 mm (1.9 cm, 0.748 in) + |
package pitch | 0.8 mm (0.0315 in) + |
package type | FC-OBGA + |
package width | 19 mm (1.9 cm, 0.748 in) + |
tdp | 18 W (18,000 mW, 0.0241 hp, 0.018 kW) + |