Editing amd/packages/ft1

{{amd title|Package FT1}}
{{package
|name=FT1
|designer=AMD
|market=Mobile
|first launched=January 4, 2011
|microarch=Bobcat
|tdp=18 W
|package name=FT1
|package type=Organic Micro Ball Grid Array
|package contacts=413
|package dimension=19.0 mm
|package dimension 2=19.0 mm
|package pitch=0.8-2.0 mm
}}

'''FT1''' was a BGA-413 package for low power [[AMD]] microprocessors with integrated
graphics targeting the client, embedded and tablet market, the successor to the {{\\|ASB2}} package. 
Its counterparts for the mainstream mobile and desktop markets are 
{{\\|Socket FS1}} and {{\\|Socket FM1}}, respectively. FT1 was superseded by the {{\\|FT3}} package.

Package FT1 was used in AMD's "Brazos" platform for ultrathin notebooks. All FT1 processors belong to AMD's Family 14h 
based on the [[amd/microarchitectures/bobcat|Bobcat]] microarchitecture and were manufactured in a 40 nm SOI process.

=== Features ===
* 413-pin lidless micro ball grid array package, 0.8-2.0 mm multi-pitch, 23 × 23 pins, 19 × 19 mm, organic substrate
* 4-lane Unified Media Interface up to 2.5 GT/s
* 64 bit DDR3 SDRAM interface up to 667 MHz, PC3-10600 (DDR3-1333), 10.7 Gbyte/s

== Chipsets ==
* AMD A50M FCH codename "Hudson"

== Processors using package FT1 ==
<!-- AMD-47534-3.18; CPUID 00500F10h (ON-B0), 00500F20h (ON-C0) -->
* AMD C-Series codename "Ontario"
* AMD E-Series "Zacate"
* AMD G-Series
* AMD Z-Series "Desna"

<!-- NOTE:
           This table is generated automatically from the data in the actual articles.
           If a microprocessor is missing from the list, an appropriate article for it needs to be
           created and tagged accordingly.

           Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
-->
{{comp table start}}
<table class="comptable sortable tc13 tc14 tc15 tc16 tc17 tc18 tc19">
<tr class="comptable-header"><th>&nbsp;</th><th colspan="19">List of all FT1-based Processors</th></tr>
{{comp table header 1|cols=Price, Process, Launched, µarch, Family, Core, C, T, Freq, Turbo, TDP}}
{{#ask: [[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::FT1]]
 |?full page name
 |?model number
 |?release price
 |?process
 |?first launched
 |?microarchitecture
 |?microprocessor family
 |?core name
 |?core count
 |?thread count
 |?base frequency#GHz
 |?turbo frequency (1 core)#GHz
 |?tdp
 |format=template
 |template=proc table 3
 |userparam=13
 |mainlabel=-
}}
{{comp table count|ask=[[Category:microprocessor models by amd]] [[instance of::microprocessor]] [[package::FT1]]}}
</table>
{{comp table end}}

== Package Diagram ==
:[[File:BGA-413 diag.svg|800px]]

All dimensions in millimeters.

:[[File:BGA-413 pn.svg|800px]]

BGA-413 package pin (ball) numbering.

== Pin Map ==
:[[File:BGA-413 pinmap.svg|800px]]

=== Pin Description ===
{| class="wikitable"
!Signal!!Description
|-
|ALERT_L||Programmable pin that can indicate different events, including a SB-TSI interrupt
|-
|CLKIN_H/L||100 MHz PLL Differential Reference Clock
|-
|DAC_BLUE, DAC_BLUEB||Blue for Video Monitor Output
|-
|DAC_GREEN, DAC_GREENB||Green for Video Monitor Output
|-
|DAC_HSYNC, DAC_VSYNC||Display Horizontal, Vertical Sync
|-
|DAC_RED, DAC_REDB||Red for Video Monitor Output
|-
|DAC_SCL, DAC_SDA||I2C Clock, Data for Display (to video monitor)
|-
|DAC_ZVSS||Compensation Resistor to DAC Ground Pin
|-
|DBREQ_L/DBRDY||Debug Request/Ready
|-
|DISP_CLKIN_H/L||100 MHz Display Controller Reference Clock
|-
|DMAACTIVE_L||Indicated System DMA Activity
|-
|DP_BLON||Display Panel Backlight Enable
|-
|DP_DIGON||Display Panel Power Enable
|-
|DP_VARY_BL||Display Backlight Brightness Control
|-
|DP_ZVSS||Compensation Resistor to VSS
|-
|LTDP0/TDP1_AUXP/N||DisplayPort Auxiliary Channel
|-
|LTDP0/TDP1_HPD||DisplayPort Hot Plug Detect
|-
|LTDP0/TDP1_TXP/N[3:0]||DisplayPort Differential Transmitter
|-
|M0_CS_L[1:0], M1_CS_L[1:0]||DRAM Chip Selects
|-
|M0_ODT[1:0], M1_ODT[1:0]||DRAM Enable Pin for On Die Termination
|-
|M_ADD[15:0]||DRAM Column/Row Address
|-
|M_BANK[2:0]||DRAM Bank Address
|-
|M_CAS_L||DRAM Column Address Strobe
|-
|M_CKE[1:0]||DRAM Clock Enable
|-
|M_CLK_H/L[3:0]||DRAM Differential Clock
|-
|M_DATA[63:0]||DRAM Interface Data Bus
|-
|M_DM[7:0]||DRAM Data Mask
|-
|M_DQS_H/L[7:0]||DRAM Differential Data Strobe
|-
|M_EVENT_L||DRAM Thermal Event
|-
|M_RAS_L||DRAM Row Address Strobe
|-
|M_RESET_L||DRAM Reset Pin for Suspend-to-RAM Power Management Mode
|-
|M_VREF||Memory Interface Voltage Reference
|-
|M_WE_L||DRAM Write Enable
|-
|M_ZVDDIO_MEM_S||Compensation Resistor to VDDIO
|-
|PROCHOT_L||Processor in HTC-active state input/output
|-
|PWROK||Voltages and CLKIN have reached specified operation
|-
|P_GPP_TX/RXP/N[3:0]||General Purpose External PCIe Transmit/Receive Data Differential Pairs
|-
|P_UMI_TX/RXP/N[3:0]||Unified Media Interface Transmit/Receive Data Differential Pairs
|-
|P_ZVDD_10||Compensation Resistor to P_VDD_10 Power Supply
|-
|P_ZVSS||Compensation Resistor to VSS
|-
|RESET_L||Processor Reset
|-
|RSVD||Reserved
|-
|SIC, SID||Sideband Temperature Sensor Interface Clock, Data
|-
|SVC, SVD||Serial VID Interface Clock, Data
|-
|TCK, TDI, TDO, TMS, TRST_L||JTAG interface
|-
|TEST*||Test signal
|-
|THERMTRIP_L||Thermal Sensor Trip output
|-
|VDDCR_CPU_SENSE||VDDCR_CPU Voltage Monitor Pin
|-
|VDDCR_CPU||Core Power Supply
|-
|VDDCR_NB_SENSE||VDDCR_NB Voltage Monitor Pin
|-
|VDDCR_NB||Northbridge Power Supply
|-
|VDDIO_MEM_S_SENSE||VDDIO_MEM_S Voltage Monitor Pin
|-
|VDDIO_MEM_S||DDR SDRAM I/O Ring Power Supply
|-
|VDDPL_10||1.05 V Supply Pin for System PLL
|-
|VDD_10||1.05 V Supply Pins
|-
|VDD_18_DAC||1.8 V Supply Pin for DAC
|-
|VDD_18||1.8 V Supply Pins
|-
|VDD_33||3.3 V Supply Pin
|-
|VSSBG_DAC||DAC Ground
|-
|VSS_SENSE||VSS Voltage Monitor Pin
|-
|VSS||Ground
|}

== References ==
* "FT1 Processor Functional Data Sheet", AMD Publ. #44444, Rev. 2.05, November 2010
* "BIOS and Kernel Developer’s Guide (BKDG) for AMD Family 14h Models 00h-0Fh Processors", AMD Publ. 43170, Rev. 3.13, February 17, 2012
* "Revision Guide for AMD Family 14h Models 00h-0Fh Processors", AMD Publ. #47534, Rev. 3.18, February 2013

== See also ==
* {{\\|ASB2}}
* {{\\|FT3}}
* {{\\|Socket FS1}}
* {{\\|Socket FM1}}

[[Category:amd]]
designer	AMD +
first launched	January 4, 2011 +
instance of	package +
market segment	Mobile + and Embedded +
microarchitecture	Bobcat +
name	FT1 +
package	FT1 + and UOB413 +
package contacts	413 +
package height	1.92 mm (0.0756 in) +
package length	19 mm (1.9 cm, 0.748 in) +
package pitch	0.8 mm (0.0315 in) +
package type	FC-OBGA +
package width	19 mm (1.9 cm, 0.748 in) +
tdp	18 W (18,000 mW, 0.0241 hp, 0.018 kW) +