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Retrieved from "https://en.wikichip.org/wiki/amd/packages/asb1"
Facts about "Package ASB1 - AMD"
designer | AMD + |
first launched | January 8, 2009 + |
instance of | package + |
market segment | Mobile + |
microarchitecture | K8 + |
name | ASB1 + |
package | ASB1 + |
package contacts | 812 + |
package length | 27 mm (2.7 cm, 1.063 in) + |
package pitch | 0.8 mm (0.0315 in) + |
package type | Organic Micro Ball Grid Array + |
package width | 27 mm (2.7 cm, 1.063 in) + |
tdp | 18 W (18,000 mW, 0.0241 hp, 0.018 kW) + |