Editing nervana/nnp/nnp-t 1300

{{nervana title|NNP-T 1300}}
{{chip
|name=NNP-T 1300
|image=spring crest package (front).png
|back image=spring crest package (back).png
|caption=NPU with 4 HBM2 stacks
|designer=Intel
|manufacturer=TSMC
|model number=NNP-T 1300
|market=Server
|first announced=November 12, 2019
|first launched=November 12, 2019
|family=NNP
|series=NNP-T
|frequency=950 MHz
|microarch=Spring Crest
|process=16 nm
|transistors=27,000,000,000
|technology=CMOS
|die area=680 mm²
|core count=22
|max memory=32 GiB
|smp interconnect=InterChip Link
|smp interconnect links=16
|smp interconnect rate=28 GT/s
|power=150 W
|tdp=300 W
|package name 1=intel,fcbga_3325
}}
'''NNP-T 1300''' is a [[neural processor]] designed by [[Intel Nervana]] and introduced in late 2019. Fabricated on TSMC [[16 nm process]] based on the {{nervana|Spring Crest|l=arch}} microarchitecture, the NNP-T 1300 has 22 {{nervana|Spring Crest#Tensor Processing Cluster (TPC)|TPCs|l=arch}} along with 55 MiB of scratchpad memory and operates at up to 950 MHz. This chip comes in a PCIe 4.0 [[accelerator card]] form factor and incorporates 32 GiB of [[HBM2]] memory. This NPU exposes 16 {{nervana|Spring Crest#InterChip Link (ICL)|inter-chip links|l=arch}} for scale-out capabilities.
back image	+
base frequency	950 MHz (0.95 GHz, 950,000 kHz) +
core count	22 +
designer	Intel +
die area	680 mm² (1.054 in², 6.8 cm², 680,000,000 µm²) +
family	NNP +
first announced	November 12, 2019 +
first launched	November 12, 2019 +
full page name	nervana/nnp/nnp-t 1300 +
has ecc memory support	true +
instance of	microprocessor +
ldate	November 12, 2019 +
main image	+
main image caption	NPU with 4 HBM2 stacks +
manufacturer	TSMC +
market segment	Server +
max memory	32,768 MiB (33,554,432 KiB, 34,359,738,368 B, 32 GiB, 0.0313 TiB) +
max memory bandwidth	1,144.409 GiB/s (1,171,875 MiB/s, 1,228.8 GB/s, 1,228,800 MB/s, 1.118 TiB/s, 1.229 TB/s) +
max memory channels	32 +
microarchitecture	Spring Crest +
model number	NNP-T 1300 +
name	NNP-T 1300 +
package	FCBGA-3325 +
peak flops (half-precision)	93,390,000,000,000 FLOPS (93,390,000,000 KFLOPS, 93,390,000 MFLOPS, 93,390 GFLOPS, 93.39 TFLOPS, 0.0934 PFLOPS, 9.339e-5 EFLOPS, 9.339e-8 ZFLOPS) +
power dissipation	150 W (150,000 mW, 0.201 hp, 0.15 kW) +
process	16 nm (0.016 μm, 1.6e-5 mm) +
series	NNP-T +
smp interconnect	InterChip Link +
smp interconnect links	16 +
smp interconnect rate	28 GT/s +
supported memory type	HBM2-2400 +
tdp	300 W (300,000 mW, 0.402 hp, 0.3 kW) +
technology	CMOS +
transistor count	27,000,000,000 +