Editing hisilicon/kirin/970

{{hisil title|Kirin 970}}
{{mpu
|name=Kirin 970
|image=kirin 970.png
|designer=HiSilicon
|designer 2=ARM Holdings
|manufacturer=TSMC
|model number=970
|market=Mobile
|first announced=September 1, 2017
|first launched=September 1, 2017
|family=Kirin
|series=900
|frequency=1,800 MHz
|frequency 2=2,400 MHz
|isa=ARMv8
|isa family=ARM
|microarch=Cortex-A53
|microarch 2=Cortex-A73
|core name=Cortex-A53
|core name 2=Cortex-A73
|process=10 nm
|transistors=5,500,000,000
|technology=CMOS
|word size=64 bit
|core count=8
|thread count=8
|max cpus=1
|max memory=6 GiB
}}
'''Kirin 970''' is a {{arch|64}} [[octa-core]] high-performance mobile [[ARM]] [[LTE]] SoC introduced by [[HiSilicon]] in mid-2017 at the [[2017 IFA]]. This chip, which is fabricated on a [[10 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.4 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.8 GHz. The 970 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G72}} (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory.

Introduced at the 2017 IFA, the overall core organization is identical to the {{\\|960|Kirin 960}} which was introduced the previous year, but features 20% power efficiency and 40% smaller [[die area]] due to the [[process shrink]]. The 970 ballooned to over 37.5% more transistors from 4 billion in the {{\\|960}} to 5.5 billion. The 970 adds many enhancements, including a more powerful {{armh|Mali G72}} GPU and incorporates a new Neural Network Processing Unit (NPU) designed for [[AI]] acceleration. The 970 has two improved [[image signal processor|ISP]]s and a more powerful LTE modem supporting up to [[User Equipment]] (UE) category 18 capable of reaching a maximum downlink of 1.2 Gbps (4x4 MIMO, 256 QAM, 3CC CA).

== Cache ==
{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a73#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A73 § Cache}}
{{cache size}}
{{expand section}}

== Memory controller ==
{{memory controller
|type=LPDDR4-1866
|ecc=No
|max mem=6 GiB
|controllers=1
|channels=2
|width=64 bit
|max bandwidth=27.82 GiB/s
|bandwidth schan=13.91 GiB/s
|bandwidth dchan=27.82 GiB/s
}}

== Graphics ==
{{integrated graphics
| gpu                 = Mali-G72
| designer            = ARM Holdings
| execution units     = 12
| max displays        = 2
| max memory          = 
| frequency           = 850 MHz
| max frequency       = 

| output crt          = 
| output sdvo         = 
| output dsi          = Yes
| output edp          = 
| output dp           = 
| output hdmi         = 
| output vga          = 
| output dvi          = 

| directx ver        = 12
| opengl es ver      = 3.2
| openvg ver         = 1.1
| opencl ver         = 2.0
| vulkan ver         = 1.0
}}

== Neural Network Processing Unit (NPU) ==
[[File:kirin 970 npu.png|right|350px]]
The Kirin 970 incorporates a new Neural Network Processing Unit (NPU) designed specifically to be used as an AI accelerator. According to CEO Mr. Richard Yu who introduced the Kirin 970 at 2017 IFA, the NPU uses up the die area of roughly half of the CPU while consuming 50% less power and performing around 25 times faster than a traditional CPU for tasks such as photo recognition. The exact architectural detials of the NPU have been withheld. The NPU is said to deliver 1.92 [[TFLOP]]s (HP 16-bit).
base frequency	1,800 MHz (1.8 GHz, 1,800,000 kHz) + and 2,360 MHz (2.36 GHz, 2,360,000 kHz) +
core count	8 +
core name	Cortex-A53 + and Cortex-A73 +
designer	HiSilicon + and ARM Holdings +
die area	96.72 mm² (0.15 in², 0.967 cm², 96,720,000 µm²) +
die length	9.75 mm (0.975 cm, 0.384 in, 9,750 µm) +
die width	9.92 mm (0.992 cm, 0.391 in, 9,920 µm) +
family	Kirin +
first announced	September 1, 2017 +
first launched	September 1, 2017 +
full page name	hisilicon/kirin/970 +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	Mali-G72 +
integrated gpu base frequency	746 MHz (0.746 GHz, 746,000 KHz) +
integrated gpu designer	ARM Holdings +
integrated gpu execution units	12 +
isa	ARMv8 +
isa family	ARM +
l1$ size	256 KiB (262,144 B, 0.25 MiB) + and 512 KiB (524,288 B, 0.5 MiB) +
l1d$ size	128 KiB (131,072 B, 0.125 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l1i$ size	128 KiB (131,072 B, 0.125 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l2$ size	1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + and 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldate	September 1, 2017 +
main image	+
manufacturer	TSMC +
market segment	Mobile +
max cpu count	1 +
max memory	8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth	27.82 GiB/s (28,487.68 MiB/s, 29.871 GB/s, 29,871.498 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels	4 +
microarchitecture	Cortex-A53 + and Cortex-A73 +
model number	970 +
name	Kirin 970 +
part number	Hi3670 +
process	10 nm (0.01 μm, 1.0e-5 mm) +
series	900 +
smp max ways	1 +
supported memory type	LPDDR4X-3732 +
technology	CMOS +
thread count	8 +
transistor count	5,500,000,000 +
used by	Huawei Mate 10 +, Huawei Mate 10 Pro +, Huawei Mate 10 Porsche Design +, Huawei P20 +, Huawei Mate RS Porsche Design +, Honor 10 +, Huawei Nova 3 +, Honor V10 (Honor View 10) +, Honor Note 10 +, Huawei P20 Pro +, Huawei Nova 4 +, HiKey 970 +, Honor 8 Pro +, Honor Play 2 + and Honor Play +
word size	64 bit (8 octets, 16 nibbles) +