Editing hisilicon/kirin/970

{{hisil title|Kirin 970}}
{{mpu
|name=Kirin 970
|image=kirin 970.png
|designer=HiSilicon
|designer 2=ARM Holdings
|manufacturer=TSMC
|model number=970
|market=Mobile
|first announced=September 1, 2017
|first launched=September 1, 2017
|family=Kirin
|series=900
|frequency=1,800 MHz
|frequency 2=2,400 MHz
|isa=ARMv8
|isa family=ARM
|microarch=Cortex-A53
|microarch 2=Cortex-A73
|core name=Cortex-A53
|core name 2=Cortex-A73
|process=10 nm
|transistors=5,500,000,000
|technology=CMOS
|word size=64 bit
|core count=8
|thread count=8
|max cpus=1
|max memory=6 GiB
}}
'''Kirin 970''' is a {{arch|64}} [[octa-core]] high-performance mobile [[ARM]] SoC introduced by [[HiSilicon]] in mid-2017 at the [[2017 IFA]]. This chip, which is fabricated on a [[10 nm process]], features four {{armh|Cortex-A73|l=arch}} [[big cores]] operating at up to 2.4 GHz along with four {{armh|Cortex-A53}} [[little cores]] operating at up to 1.8 GHz. The overall core organization is identical to the {{\\|960|Kirin 960}} which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the [[process shrink]]. The 970 incorporates [[ARM Holdings|ARM]]'s {{armh|Mali G72}} (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory.
base frequency	1,800 MHz (1.8 GHz, 1,800,000 kHz) + and 2,360 MHz (2.36 GHz, 2,360,000 kHz) +
core count	8 +
core name	Cortex-A53 + and Cortex-A73 +
designer	HiSilicon + and ARM Holdings +
die area	96.72 mm² (0.15 in², 0.967 cm², 96,720,000 µm²) +
die length	9.75 mm (0.975 cm, 0.384 in, 9,750 µm) +
die width	9.92 mm (0.992 cm, 0.391 in, 9,920 µm) +
family	Kirin +
first announced	September 1, 2017 +
first launched	September 1, 2017 +
full page name	hisilicon/kirin/970 +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	Mali-G72 +
integrated gpu base frequency	746 MHz (0.746 GHz, 746,000 KHz) +
integrated gpu designer	ARM Holdings +
integrated gpu execution units	12 +
isa	ARMv8 +
isa family	ARM +
l1$ size	256 KiB (262,144 B, 0.25 MiB) + and 512 KiB (524,288 B, 0.5 MiB) +
l1d$ size	128 KiB (131,072 B, 0.125 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l1i$ size	128 KiB (131,072 B, 0.125 MiB) + and 256 KiB (262,144 B, 0.25 MiB) +
l2$ size	1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + and 2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldate	September 1, 2017 +
main image	+
manufacturer	TSMC +
market segment	Mobile +
max cpu count	1 +
max memory	8,192 MiB (8,388,608 KiB, 8,589,934,592 B, 8 GiB, 0.00781 TiB) +
max memory bandwidth	27.82 GiB/s (28,487.68 MiB/s, 29.871 GB/s, 29,871.498 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels	4 +
microarchitecture	Cortex-A53 + and Cortex-A73 +
model number	970 +
name	Kirin 970 +
part number	Hi3670 +
process	10 nm (0.01 μm, 1.0e-5 mm) +
series	900 +
smp max ways	1 +
supported memory type	LPDDR4X-3732 +
technology	CMOS +
thread count	8 +
transistor count	5,500,000,000 +
used by	Huawei Mate 10 +, Huawei Mate 10 Pro +, Huawei Mate 10 Porsche Design +, Huawei P20 +, Huawei Mate RS Porsche Design +, Honor 10 +, Huawei Nova 3 +, Honor V10 (Honor View 10) +, Honor Note 10 +, Huawei P20 Pro +, Huawei Nova 4 +, HiKey 970 +, Honor 8 Pro +, Honor Play 2 + and Honor Play +
word size	64 bit (8 octets, 16 nibbles) +