From WikiChip
Editing hisilicon/k3/k3v1
Revision as of 03:28, 6 September 2017 by Inject (talk | contribs) (Features)

Warning: You are editing an out-of-date revision of this page. If you save it, any changes made since this revision will be lost.

Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.

This page supports semantic in-text annotations (e.g. "[[Is specified as::World Heritage Site]]") to build structured and queryable content provided by Semantic MediaWiki. For a comprehensive description on how to use annotations or the #ask parser function, please have a look at the getting started, in-text annotation, or inline queries help pages.

Please note that all contributions to WikiChip may be edited, altered, or removed by other contributors. If you do not want your writing to be edited mercilessly, then do not submit it here.
You are also promising us that you wrote this yourself, or copied it from a public domain or similar free resource (see WikiChip:Copyrights for details). Do not submit copyrighted work without permission!

Cancel | Editing help (opens in new window)
Facts about "K3V1 - HiSilicon"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
K3V1 - HiSilicon#package +
base frequency460 MHz (0.46 GHz, 460,000 kHz) +
core count1 +
core nameARM926EJ-S +
designerHiSilicon + and ARM Holdings +
familyK3 +
first announcedJune 2008 +
first launchedJune 2008 +
full page namehisilicon/k3/k3v1 +
has ecc memory supportfalse +
instance ofmicroprocessor +
io voltage1.8 V (18 dV, 180 cV, 1,800 mV) + and 2.5 V (25 dV, 250 cV, 2,500 mV) +
isaARMv5 +
isa familyARM +
l1$ size32 KiB (32,768 B, 0.0313 MiB) +
l1d$ description4-way set associative +
l1d$ size16 KiB (16,384 B, 0.0156 MiB) +
l1i$ description4-way set associative +
l1i$ size16 KiB (16,384 B, 0.0156 MiB) +
ldateJune 2008 +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory channels1 +
microarchitectureARM9 +
model numberK3V1 +
nameK3V1 +
packageTFBGA-460 +
part numberHi3611 +
process180 nm (0.18 μm, 1.8e-4 mm) +
smp max ways1 +
supported memory typeDDR +
technologyCMOS +
thread count1 +
transistor count200,000,000 +
word size32 bit (4 octets, 8 nibbles) +