Editing renesas/r-car/h3 (sip)

{{renesas title|R-Car H3 (SiP)}}
{{mpu
|name=R-Car H3 (SiP)
|image=r-car h3 (sip).png
|image size=125px
|designer=Renesas
|designer 2=ARM Holdings
|manufacturer=TSMC
|model number=H3 (SiP)
|part number=R8J77950
|market=Embedded
|first announced=December 2, 2015
|first launched=March, 2018
|family=R-Car
|series=3rd Gen
|isa=ARMv8
|isa family=ARM
|microarch=Cortex-A53
|microarch 2=Cortex-A57
|microarch 3=Cortex-R7
|core name=Cortex-A53
|core name 2=Cortex-A57
|core name 3=Cortex-R7
|process=16 nm
|technology=CMOS
|die area=111.36 mm²
|die length=12.94 mm
|die width=8.61 mm
|word size=64 bit
|core count=9
|thread count=9
|max cpus=1
|v core=0.8 V
|v io=3.3 V
|package module 1={{packages/renesas/fcbga-1255}}
}}
'''R-Car H3''' is a {{arch|64}} [[nona-core]] [[ARM]] SoC designed by [[Renesas]] for the automotive industry and introduced in 2016. The H3 incorporates four {{armh|Cortex-A57}} cores, four {{armh|Cortex-A53}} cores, and a dual-core lock-step {{armh|Cortex-R7}} for real-time processing. This chip supports up to quad-channel LPDDR4-3200 memory. This chip incorporates the [[imagination technologies|Imagination]]'s {{imgtec|PowerVR GX6650}} [[GPU]].

This model is an [[SiP]] variant of the {{\\|H3}} which include the DDR memory on-package.

Samples for the H3 were available starting December 2015 with Renesas expecting mass production to begin in March 2018 and reach a volume of 100,000 units per month in March 2019.

== Cache ==
{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|arm holdings/microarchitectures/cortex-a57#Memory_Hierarchy|l1=Cortex-A53 § Cache|l2=Cortex-A57 § Cache}}
{{cache size
|l1 cache=640 KiB
|l1i cache=352 KiB
|l1i break=4x48+5x32 KiB
|l1d cache=288 KiB
|l1d break=9x32 KiB
|l2 cache=2.5 MiB
}}

== Memory controller ==
{{memory controller
|type=LPDDR4-3200
|ecc=No
|controllers=1
|channels=4
|width=32 bit
|max bandwidth=47.68 GiB/s
|bandwidth schan=11.92 GiB/s
|bandwidth dchan=23.84 GiB/s
|bandwidth qchan=47.68 GiB/s
}}

== Expansions ==
* PCI Express2.0 (1 lane) x 2 ch
* USB 3.0 Host interface (DRD) × 1 ports (wPHY)
* USB 2.0 Host/Function/OTG interface × 2 ports (wPHY)
* SD Host interface × 4 ch (SDR104)
* Multimedia card interface × 2 ch
* Serial ATA interface × 1 ch
* Media local bus (MLB) Interface × 1 ch (3 pin interface)
* Controller Area Network (CAN-FD support) Interface × 2ch
* Ethernet AVB 1.0-compatible MAC built in Interface: RGMII / Ethernet AVB (802.1BA)
* SYS-DMAC x 48 ch, Realtime-DMAC x 16 ch, 
* Audio-DMAC x 32 ch, Audio(peripheral)-DMAC x 29 ch
* 32bit timer x 26 ch
* PWM timer × 7 ch
* I2C bus interface × 7 ch
* Serial communication interface (SCIF) × 11 ch
* Quad serial peripheral interface (QSPI) x 2 ch (for boot, HyperFlash support)
* Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
* Ethernet controller (IEEE802.3u, RMII, without PHY)
* Digital radio interface (DRIF) × 4 ch

== Graphics ==
{{integrated graphics
| gpu                 = PowerVR GX6650
| designer            = Imagination Technologies
}}

== Features == 
{{arm features
|thumb=No
|thumb2=No
|thumbee=No
|vfpv1=No
|vfpv2=No
|vfpv3=No
|vfpv3-d16=No
|vfpv3-f16=No
|vfpv4=Yes
|vfpv4-d16=No
|vfpv5=No
|neon=Yes
|trustzone=Yes
|jazelle=No
|wmmx=No
|wmmx2=No
}}

== Block Diagram ==
:: [[File:r-car h3 block.png|750px]]

== Die Shot ==
* [[16 nm process]], CMOS FinFET
* 12.94 mm × 8.61 mm
* 111.36 mm² die size


:: [[File:r-car h3 die shot.png|650px]]

== References ==
* Takahashi, Chikafumi, et al. "4.5 A 16nm FinFET heterogeneous nona-core SoC complying with ISO26262 ASIL-B: Achieving 10− 7 random hardware failures per hour reliability." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	R-Car H3 (SiP) - Renesas#package +
core count	9 +
core name	Cortex-A53 +, Cortex-A57 + and Cortex-R7 +
core voltage	0.8 V (8 dV, 80 cV, 800 mV) +
designer	Renesas + and ARM Holdings +
die area	111.36 mm² (0.173 in², 1.114 cm², 111,360,000 µm²) +
die length	12.94 mm (1.294 cm, 0.509 in, 12,940 µm) +
die width	8.61 mm (0.861 cm, 0.339 in, 8,610 µm) +
family	R-Car +
first announced	December 2, 2015 +
first launched	March 2018 +
full page name	renesas/r-car/h3 (sip) +
has ecc memory support	false +
instance of	microprocessor +
integrated gpu	PowerVR GX6650 +
integrated gpu designer	Imagination Technologies +
io voltage	3.3 V (33 dV, 330 cV, 3,300 mV) +
isa	ARMv8 +
isa family	ARM +
l1$ size	640 KiB (655,360 B, 0.625 MiB) +
l1d$ size	288 KiB (294,912 B, 0.281 MiB) +
l1i$ size	352 KiB (360,448 B, 0.344 MiB) +
l2$ size	2.5 MiB (2,560 KiB, 2,621,440 B, 0.00244 GiB) +
ldate	March 2018 +
main image	+
manufacturer	TSMC +
market segment	Embedded +
max cpu count	1 +
max memory bandwidth	47.68 GiB/s (48,824.32 MiB/s, 51.196 GB/s, 51,196.01 MB/s, 0.0466 TiB/s, 0.0512 TB/s) +
max memory channels	4 +
microarchitecture	Cortex-A53 +, Cortex-A57 + and Cortex-R7 +
model number	H3 (SiP) +
name	R-Car H3 (SiP) +
package	FCBGA-1255 +
part number	R8J77950 +
process	16 nm (0.016 μm, 1.6e-5 mm) +
series	3rd Gen +
smp max ways	1 +
supported memory type	LPDDR4-3200 +
technology	CMOS +
thread count	9 +
word size	64 bit (8 octets, 16 nibbles) +