From WikiChip
Editing renesas/r-car/h3 (sip)
Revision as of 02:26, 23 July 2017 by BCD (talk | contribs)

Warning: You are editing an out-of-date revision of this page. If you save it, any changes made since this revision will be lost.

Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.

This page supports semantic in-text annotations (e.g. "[[Is specified as::World Heritage Site]]") to build structured and queryable content provided by Semantic MediaWiki. For a comprehensive description on how to use annotations or the #ask parser function, please have a look at the getting started, in-text annotation, or inline queries help pages.

Please note that all contributions to WikiChip may be edited, altered, or removed by other contributors. If you do not want your writing to be edited mercilessly, then do not submit it here.
You are also promising us that you wrote this yourself, or copied it from a public domain or similar free resource (see WikiChip:Copyrights for details). Do not submit copyrighted work without permission!

Cancel | Editing help (opens in new window)
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
R-Car H3 (SiP) - Renesas#package +
core count9 +
core nameCortex-A53 +, Cortex-A57 + and Cortex-R7 +
core voltage0.8 V (8 dV, 80 cV, 800 mV) +
designerRenesas + and ARM Holdings +
die area111.36 mm² (0.173 in², 1.114 cm², 111,360,000 µm²) +
die length12.94 mm (1.294 cm, 0.509 in, 12,940 µm) +
die width8.61 mm (0.861 cm, 0.339 in, 8,610 µm) +
familyR-Car +
first announcedDecember 2, 2015 +
first launchedMarch 2018 +
full page namerenesas/r-car/h3 (sip) +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuPowerVR GX6650 +
integrated gpu designerImagination Technologies +
io voltage3.3 V (33 dV, 330 cV, 3,300 mV) +
isaARMv8 +
isa familyARM +
l1$ size640 KiB (655,360 B, 0.625 MiB) +
l1d$ size288 KiB (294,912 B, 0.281 MiB) +
l1i$ size352 KiB (360,448 B, 0.344 MiB) +
l2$ size2.5 MiB (2,560 KiB, 2,621,440 B, 0.00244 GiB) +
ldateMarch 2018 +
main imageFile:r-car h3 (sip).png +
manufacturerTSMC +
market segmentEmbedded +
max cpu count1 +
max memory bandwidth47.68 GiB/s (48,824.32 MiB/s, 51.196 GB/s, 51,196.01 MB/s, 0.0466 TiB/s, 0.0512 TB/s) +
max memory channels4 +
microarchitectureCortex-A53 +, Cortex-A57 + and Cortex-R7 +
model numberH3 (SiP) +
nameR-Car H3 (SiP) +
packageFCBGA-1255 +
part numberR8J77950 +
process16 nm (0.016 μm, 1.6e-5 mm) +
series3rd Gen +
smp max ways1 +
supported memory typeLPDDR4-3200 +
technologyCMOS +
thread count9 +
word size64 bit (8 octets, 16 nibbles) +