Editing intel/core m/m3-7y32

{{intel title|Core M3-7Y32}}
{{mpu
| name                = Core M3-7Y32
| no image            = Yes
| image               = 
| image size          = 
| caption             = 
| designer            = Intel
| manufacturer        = Intel
| model number        = M3-7Y32
| part number         = HE8067702739830
| part number 1       = 
| part number 2       = 	
| s-spec              = SR346
| s-spec 2            = 
| market              = Mobile
| first announced     = 
| first launched      = April 10, 2017
| last order          = 
| last shipment       = 
| release price       = $281.00

| family              = Core M3
| series              = m3-7Y
| locked              = Yes
| frequency           = 1,100 MHz
| turbo frequency     = Yes
| turbo frequency1    = 3,000 MHz
| turbo frequency2    = 
| turbo frequency3    = 
| turbo frequency4    = 
| bus type            = OPI
| bus speed           = 
| bus rate            = 4 GT/s
| bus links           = 
| clock multiplier    = 11
| cpuid               = 

| isa family          = x86
| isa                 = x86-64
| microarch           = Kaby Lake
| platform            = Kaby Lake
| chipset             = 
| core name           = Kaby Lake Y
| core family         = 6
| core model          = 142
| core stepping       = H0
| core stepping 2     = 
| process             = 14 nm
| transistors         = 
| technology          = CMOS
| die area            = 
| die width           = 
| die length          = 
| word size           = 64 bit
| core count          = 2
| thread count        = 4
| max cpus            = 1
| max memory          = 16 GiB

| electrical          = Yes
| v core min          = 0.55 V
| v core max          = 1.52 V
| sdp                 = 
| tdp                 = 4.5 W
| tdp typical         = 
| ctdp down           = 3.75 W
| ctdp down frequency = 600 MHz
| ctdp up             = 7 W
| ctdp up frequency   = 1,600 MHz
| tjunc min           = 0 °C
| tjunc max           = 100 °C
| tcase min           = 
| tcase max           = 
| tstorage min        = -25 °C
| tstorage max        = 125 °C
| tambient min        = 
| tambient max        = 

| packaging           = Yes
| package 0           = FCBGA-1515
| package 0 type      = FCBGA
| package 0 pins      = 1515
| package 0 pitch     = 0.4 mm
| package 0 width     = 20 mm
| package 0 length    = 16.5 mm
| package 0 height    = 
| socket 0            = BGA-1515
| socket 0 type       = BGA
}}
'''Core M3-7Y32''' is a {{arch|64}} [[dual-core]] low-end performance ultra-low power [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The M3-7Y32 operates at 1.1 GHz with a TDP of 4.5 W supporting a {{intel|Turbo Boost}} frequency of 3 GHz. The processor supports up to 16 GiB of dual-channel non-ECC LPDDR3-1866 memory and incorporates Intel's {{intel|HD Graphics 615}} [[IGP]] operating at 300 MHz with a burst frequency of 900 MHz.

This specific model has a configurable TDP-down of 3.75 W with a frequency of 600 MHz and a configurable TDP-up of 7 W with a frequency of 1.6 GHz.

The Core M3-7Y32 superceeds the {{\\|M3-7Y30}} which was released in August 2016, offering 100 MHz higher base clock and 400 MHz higher turbo frequency for the exact same price.
== Cache ==
{{main|intel/microarchitectures/kaby_lake#Memory_Hierarchy|l1=Kaby Lake § Cache}}
{{cache size
|l1 cache=128 KiB
|l1i cache=64 KiB
|l1i break=2x32 KiB
|l1i desc=8-way set associative
|l1d cache=64 KiB
|l1d break=2x32 KiB
|l1d desc=8-way set associative
|l1d policy=write-back
|l2 cache=512 KiB
|l2 break=2x256 KiB
|l2 desc=4-way set associative
|l2 policy=write-back
|l3 cache=4 MiB
|l3 break=2x2 MiB
|l3 desc=12-way set associative
|l3 policy=write-back
}}

== Memory controller ==
{{memory controller
|type=DDR3L-1600
|type 2=LPDDR3-1866
|ecc=No
|max mem=16 GiB
|controllers=1
|channels=2
|max bandwidth=27.81 GiB/s
|bandwidth schan=13.9 GiB/s
|bandwidth dchan=27.81 GiB/s
}}

== Expansions ==
{{expansions
| pcie revision      = 3.0
| pcie lanes         = 10
| pcie config        = 1x4
| pcie config 2      = 2x2
| pcie config 3      = 1x2+2x1
| pcie config 4      = 4x1
}}

== Graphics ==
{{integrated graphics
| gpu                 = HD Graphics 615
| device id           = 0x591E
| designer            = Intel
| execution units     = 24
| max displays        = 3
| max memory          = 16 GiB
| frequency           = 300 MHz
| max frequency       = 900 MHz

| output crt          = 
| output sdvo         = 
| output dsi          = 
| output edp          = Yes
| output dp           = Yes
| output hdmi         = Yes
| output vga          = 
| output dvi          = Yes

| directx ver        = 12
| opengl ver         = 4.4
| opencl ver         = 2.0
| hdmi ver           = 1.4a
| dp ver             = 1.2
| edp ver            = 1.4
| max res hdmi       = 4096x2304
| max res hdmi freq  = 24 Hz
| max res dp         = 4096x2304
| max res dp freq    = 60 Hz
| max res edp        = 4096x2304
| max res edp freq   = 60 Hz
| max res vga        = 
| max res vga freq   = 

| features             = Yes
| intel quick sync     = Yes
| intel intru 3d       = Yes
| intel insider        = 
| intel widi           = 
| intel fdi            = 
| intel clear video    = Yes
| intel clear video hd = Yes
}}
{{kaby lake hardware accelerated video table|col=1}}

== Features == 
{{x86 features
|real=Yes
|protected=Yes
|smm=Yes
|fpu=Yes
|x8616=Yes
|x8632=Yes
|x8664=Yes
|nx=Yes
|3dnow=No
|e3dnow=No
|mmx=Yes
|emmx=Yes
|sse=Yes
|sse2=Yes
|sse3=Yes
|ssse3=Yes
|sse41=Yes
|sse42=Yes
|sse4a=Yes
|avx=Yes
|avx2=Yes
|avx512=No
|abm=Yes
|tbm=No
|bmi1=Yes
|bmi2=Yes
|fma3=Yes
|fma4=No
|aes=Yes
|rdrand=Yes
|sha=No
|xop=No
|adx=Yes
|clmul=Yes
|f16c=Yes
|tbt1=No
|tbt2=Yes
|tbmt3=No
|bpt=No
|eist=Yes
|sst=Yes
|flex=Yes
|fastmem=No
|isrt=Yes
|sba=No
|mwt=Yes
|sipp=No
|att=No
|ipt=No
|tsx=No
|txt=No
|ht=Yes
|vpro=No
|vtx=Yes
|vtd=Yes
|ept=Yes
|mpx=Yes
|sgx=Yes
|securekey=Yes
|osguard=Yes
|smartmp=No
|powernow=No
|amdv=No
|rvi=No
}}
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Core M3-7Y32 - Intel#io +
base frequency	1,100 MHz (1.1 GHz, 1,100,000 kHz) +
bus rate	4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus type	OPI +
clock multiplier	11 +
core count	2 +
core family	6 +
core model	142 +
core name	Kaby Lake Y +
core stepping	H0 +
core voltage (max)	1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)	0.55 V (5.5 dV, 55 cV, 550 mV) +
designer	Intel +
device id	0x591E +
family	Core M3 +
first launched	April 10, 2017 +
full page name	intel/core m/m3-7y32 +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has ecc memory support	false +
has extended page tables support	true +
has feature	Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Turbo Boost Technology 2.0 +, Enhanced SpeedStep Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Secure Key Technology +, Flex Memory Access +, Smart Response Technology +, My WiFi Technology +, OS Guard +, Extended Page Tables +, Memory Protection Extensions + and Software Guard Extensions +
has intel enhanced speedstep technology	true +
has intel flex memory access support	true +
has intel my wifi technology support	true +
has intel secure key technology	true +
has intel smart response technology support	true +
has intel speed shift technology	true +
has intel supervisor mode execution protection	true +
has intel turbo boost technology 2 0	true +
has intel vt-d technology	true +
has intel vt-x technology	true +
has locked clock multiplier	true +
has second level address translation support	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	HD Graphics 615 +
integrated gpu base frequency	300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designer	Intel +
integrated gpu execution units	24 +
integrated gpu max frequency	900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory	16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) +
isa	x86-64 +
isa family	x86 +
l1$ size	128 KiB (131,072 B, 0.125 MiB) +
l1d$ description	8-way set associative +
l1d$ size	64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description	8-way set associative +
l1i$ size	64 KiB (65,536 B, 0.0625 MiB) +
l2$ description	4-way set associative +
l2$ size	0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description	12-way set associative +
l3$ size	4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldate	April 10, 2017 +
main image	+
manufacturer	Intel +
market segment	Mobile +
max cpu count	1 +
max junction temperature	373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory	16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth	27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels	2 +
max pcie lanes	10 +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Kaby Lake +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number	M3-7Y32 +
name	Core M3-7Y32 +
package	FCBGA-1515 +
part number	HE8067702739830 +
platform	Kaby Lake +
process	14 nm (0.014 μm, 1.4e-5 mm) +
release price	$ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) +
s-spec	SR346 +
series	m3-7Y +
smp max ways	1 +
supported memory type	DDR3L-1600 + and LPDDR3-1866 +
tdp	4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) +
tdp down	3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) +
tdp down frequency	600 MHz (0.6 GHz, 600,000 kHz) +
tdp up	7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
tdp up frequency	1,600 MHz (1.6 GHz, 1,600,000 kHz) +
technology	CMOS +
thread count	4 +
turbo frequency (1 core)	3,000 MHz (3 GHz, 3,000,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensions	true +
x86/has software guard extensions	true +