Editing mediatek/helio/mt6795m

{{mediatek title|Helio X10 (MT6795M)}}
{{mpu
| name                = MediaTek Helio X10
| no image            = yes
| image               = 
| image size          = 
| caption             = 
| designer            = MediaTek
| designer 2          = ARM Holdings
| manufacturer        = TSMC
| model number        = Helio X10
| part number         = MT6795M
| market              = Mobile
| market 2            = Embedded
| first announced     = July 15, 2014
| first launched      = March 27, 2015
| last order          = 
| last shipment       = 
| release price       = 

| family              = Helio
| series              = Helio X
| locked              = 
| frequency           = 2,000 MHz
| bus type            = AMBA 4 AXI
| bus speed           = 
| bus rate            = 
| bus links           = 
| clock multiplier    =

| isa family          = ARM
| isa                 = ARMv8
| microarch           = Cortex-A53
| platform            = 
| chipset             = 
| core name           = Cortex-A53
| core family         = 
| core model          = 
| core stepping       = 
| process             = 28 nm
| transistors         = 
| technology          = CMOS
| die area            = <!-- XX mm² -->
| die width           = 
| die length          = 
| word size           = 64 bit
| core count          = 8
| thread count        = 8
| max cpus            = 1
| max memory          = 4 GiB

| electrical          = Yes
| power               = 
| v core              = 1 V
| v core tolerance    = 
| v io                = 1.8 V
| v io 2              = 2.8 V
| v io 3              = 3.3 V
| sdp                 = 
| tdp                 = 
| tdp typical         = 
| ctdp down           = 
| ctdp down frequency = 
| ctdp up             = 
| ctdp up frequency   = 
| temp min            = -20 °C
| temp max            = 80 °C
| tjunc min           = 
| tjunc max           = 125 °C 
| tcase min           = 
| tcase max           = 
| tstorage min        = 0 °C
| tstorage max        = 125 °C
| tambient min        = 
| tambient max        = 

| packaging           = Yes
| package 0           = MWPOP-1108
| package 0 type      = MWPOP
| package 0 pins      = 1108
| package 0 pitch     = 0.4 mm
| package 0 width     = 14 mm
| package 0 length    = 14 mm
| package 0 height    = 0.78 mm
}}
'''Helio X10''' ('''MT6795M''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early-[[2014]]. This SoC, which incorporates eight {{armh|Cortex-A53}} cores and is manufactured on TSMC's [[28 nm process]], operates at up to 2 GHz and supports dual-channel LPDDR3-933. This chip incorporates the {{imgtec|PowerVR G6200}} [[IGP]] operating at 550 MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 4.

This SoC is made of 2 clusters of 4-core each ({{armh|Cortex-A53}}) linked together via a {{armh|CCI-400}}, a {{armh|NEON}} engine, and {{armh|Cortex-R4}} core for the second MCU subsystem.

== Cache ==
{{main|arm holdings/microarchitectures/cortex-a53#Memory_Hierarchy|l1=Cortex-A53 § Cache}}
{{cache size
|l1 cache = 512 KiB
|l1i cache=256 KiB
|l1i break=8x32 KiB
|l1i desc=2-way set associative
|l1d cache=256 KiB
|l1d break=8x32 KiB
|l1d desc=4-way set associative
|l2 cache=2 MiB
|l2 break=2x1 MiB
|l2 desc=16-way set associative
}}

== Memory controller ==
{{memory controller
|type=DDR3-933
|ecc=No
|max mem=4 GiB
|controllers=1
|channels=2
|max bandwidth=13.9 GiB/s
|bandwidth schan=6.95 GiB/s
|bandwidth dchan=13.9 GiB/s
}}

== Expansions ==
{{expansions
|usb revision=2.0
|usb revision 2=3.0
|usb ports=8
|uart=4
|gp io=Yes
}}

== Graphics ==
{{integrated graphics
| gpu                 = PowerVR G6200
| device id           = 
| designer            = Imagination Technologies
| execution units     = 
| max displays        = 2
| max memory          = 
| frequency           = 550 MHz

| output dsi          = Yes

| max res dsi         = 1080x1920

| direct3d ver        = 10.0
| opencl ver          = 1.2
| opengl ver          = 3.2
| opencl es ver       = 3.1
| vulkan ver          = 1.0
}}

* OpenGL ES 3.0 3D graphic accelerator capable of processing 175M tri/sec and 2,800M pixel/sec  @ 700 MHz
* OpenVG 1.1 vector graphics accelerator

== Wireless ==
{{wireless links
| 2g                = Yes
| csd               = Yes
| gsm               = Yes
| gprs              = Yes
| edge              = Yes
| cdmaone           = 
| is-95a            = 
| is-95b            = 
| 3g                = Yes
| cdma2000          = 
| cdma2000 1x       = 
| cdma2000 1xev-do  = 
| cdma2000 1x adv   = 
| umts              = Yes
| wcdma             =  
| td-scdma          = Yes
| dc-hsdpa          = Yes
| hsdpa             = 
| hsupa             = Yes
| 4g                = Yes
| lte a             = Yes
| e-utran           = Yes
| ue cat            = 4
}}

== Image ==
* Integrated image signal processor supports 20 MP
* Supports image stabilization
* Supports video stabilization
* Supports noise reduction
* Supports lens shading correction
* Supports AE/AWB/AF
* Supports edge enhancement
* Supports face detection and visual tracking
* Hardware JPEG encoder

== Video == 
* HEVC decoder 4k2k @ 30fps
* H.264 decoder (30fps/40Mbps)
* Sorenson H.263/H.263 decoder (1080p @ 60fps/40Mbps)
* MPEG-4 SP/ASP decoder (1080p @ 60fps/40Mbps)
* DIVX4/DIVX5/DIVX6/DIVX HD/XVID decoder  (1080p @ 60fps/40Mbps)
* VP8 / VC-1 decoders 
* MPEG-4 / H.263 / H.264 / HEVC encoders

== Audio ==
* Audio content sampling rates 8kHz to 192kHz
* Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
* I2S, PCM
* Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
* Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
* 7.1 channel MHL output

== Utilizing devices ==
* [[used by::HTC One E9+]]

{{expand list}}
base frequency	2,000 MHz (2 GHz, 2,000,000 kHz) +
bus type	AMBA 4 AXI +
core count	8 +
core name	Cortex-A53 +
core voltage	1 V (10 dV, 100 cV, 1,000 mV) +
designer	MediaTek + and ARM Holdings +
family	Helio +
first announced	July 15, 2014 +
first launched	March 27, 2015 +
full page name	mediatek/helio/mt6795m +
has 2g support	true +
has 3g support	true +
has 4g support	true +
has csd support	true +
has dc-hsdpa support	true +
has e-utran support	true +
has ecc memory support	false +
has edge support	true +
has gprs support	true +
has gsm support	true +
has hsupa support	true +
has lte advanced support	true +
has td-scdma support	true +
has umts support	true +
instance of	microprocessor +
integrated gpu	PowerVR G6200 +
integrated gpu base frequency	550 MHz (0.55 GHz, 550,000 KHz) +
integrated gpu designer	Imagination Technologies +
io voltage	1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) +
isa	ARMv8 +
isa family	ARM +
l1$ size	512 KiB (524,288 B, 0.5 MiB) +
l1d$ description	4-way set associative +
l1d$ size	256 KiB (262,144 B, 0.25 MiB) +
l1i$ description	2-way set associative +
l1i$ size	256 KiB (262,144 B, 0.25 MiB) +
l2$ description	16-way set associative +
l2$ size	2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldate	March 27, 2015 +
manufacturer	TSMC +
market segment	Mobile + and Embedded +
max cpu count	1 +
max junction temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
max memory	4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory bandwidth	13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) +
max memory channels	2 +
max operating temperature	80 °C +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Cortex-A53 +
min operating temperature	-20 °C +
min storage temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
model number	Helio X10 M +
name	MediaTek Helio X10 M +
part number	MT6795M + and MTK6795M +
process	28 nm (0.028 μm, 2.8e-5 mm) +
series	Helio X +
smp max ways	1 +
supported memory type	LPDDR3-1866 +
technology	CMOS +
thread count	8 +
used by	HTC One E9 +, HTC One E9+ +, iOcean Z1 + and Xiaomi Redmi Note 2 +
user equipment category	4 +
word size	64 bit (8 octets, 16 nibbles) +