Editing mediatek/helio/mt6795m

{{mediatek title|Helio X10 (MT6795M)}}
{{mpu
| name                = MediaTek Helio X10
| no image            = yes
| image               = 
| image size          = 
| caption             = 
| designer            = MediaTek
| designer 2          = ARM Holdings
| manufacturer        = TSMC
| model number        = Helio X10
| part number         = MT6795M
| market              = Mobile
| market 2            = Embedded
| first announced     = July 15, 2014
| first launched      = March 27, 2015
| last order          = 
| last shipment       = 
| release price       = 

| family              = Helio
| series              = Helio X
| locked              = 
| frequency           = 2,000 MHz
| bus type            = AMBA 4 AXI
| bus speed           = 
| bus rate            = 
| bus links           = 
| clock multiplier    =

| isa family          = ARM
| isa                 = ARMv8
| microarch           = Cortex-A53
| platform            = 
| chipset             = 
| core name           = Cortex-A53
| core family         = 
| core model          = 
| core stepping       = 
| process             = 28 nm
| transistors         = 
| technology          = CMOS
| die area            = <!-- XX mm² -->
| die width           = 
| die length          = 
| word size           = 64 bit
| core count          = 8
| thread count        = 8
| max cpus            = 1
| max memory          = 4 GiB

| electrical          = Yes
| power               = 
| v core              = 1 V
| v core tolerance    = 
| v io                = 1.8 V
| v io 2              = 2.8 V
| v io 3              = 3.3 V
| sdp                 = 
| tdp                 = 
| tdp typical         = 
| ctdp down           = 
| ctdp down frequency = 
| ctdp up             = 
| ctdp up frequency   = 
| temp min            = -20 °C
| temp max            = 80 °C
| tjunc min           = 
| tjunc max           = 125 °C 
| tcase min           = 
| tcase max           = 
| tstorage min        = 
| tstorage max        = 
| tambient min        = 
| tambient max        = 

| packaging           = Yes
| package 0           = MWPOP-1108
| package 0 type      = MWPOP
| package 0 pins      = 1108
| package 0 pitch     = 0.4 mm
| package 0 width     = 14 mm
| package 0 length    = 14 mm
| package 0 height    = 0.78 mm
}}
'''Helio X10''' ('''MT6795M''') is a {{arch|64}} [[octa-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late-[[2014]]. This SoC, which incorporates eight {{armh|Cortex-A53}} cores and is manufactured on TSMC's [[28 nm process]], operates at up to 2 GHz and supports dual-channel LPDDR3-933. This chip incorporates the {{imgtec|PowerVR G6200}} [[IGP]] operating at 550 MHz. This SoC has a modem supporting [[LTE]] User Equipment (UE) category 4.
base frequency	2,000 MHz (2 GHz, 2,000,000 kHz) +
bus type	AMBA 4 AXI +
core count	8 +
core name	Cortex-A53 +
core voltage	1 V (10 dV, 100 cV, 1,000 mV) +
designer	MediaTek + and ARM Holdings +
family	Helio +
first announced	July 15, 2014 +
first launched	March 27, 2015 +
full page name	mediatek/helio/mt6795m +
has 2g support	true +
has 3g support	true +
has 4g support	true +
has csd support	true +
has dc-hsdpa support	true +
has e-utran support	true +
has ecc memory support	false +
has edge support	true +
has gprs support	true +
has gsm support	true +
has hsupa support	true +
has lte advanced support	true +
has td-scdma support	true +
has umts support	true +
instance of	microprocessor +
integrated gpu	PowerVR G6200 +
integrated gpu base frequency	550 MHz (0.55 GHz, 550,000 KHz) +
integrated gpu designer	Imagination Technologies +
io voltage	1.8 V (18 dV, 180 cV, 1,800 mV) +, 2.8 V (28 dV, 280 cV, 2,800 mV) + and 3.3 V (33 dV, 330 cV, 3,300 mV) +
isa	ARMv8 +
isa family	ARM +
l1$ size	512 KiB (524,288 B, 0.5 MiB) +
l1d$ description	4-way set associative +
l1d$ size	256 KiB (262,144 B, 0.25 MiB) +
l1i$ description	2-way set associative +
l1i$ size	256 KiB (262,144 B, 0.25 MiB) +
l2$ description	16-way set associative +
l2$ size	2 MiB (2,048 KiB, 2,097,152 B, 0.00195 GiB) +
ldate	March 27, 2015 +
manufacturer	TSMC +
market segment	Mobile + and Embedded +
max cpu count	1 +
max junction temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
max memory	4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory bandwidth	13.91 GiB/s (14,243.84 MiB/s, 14.936 GB/s, 14,935.749 MB/s, 0.0136 TiB/s, 0.0149 TB/s) +
max memory channels	2 +
max operating temperature	80 °C +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Cortex-A53 +
min operating temperature	-20 °C +
min storage temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
model number	Helio X10 M +
name	MediaTek Helio X10 M +
part number	MT6795M + and MTK6795M +
process	28 nm (0.028 μm, 2.8e-5 mm) +
series	Helio X +
smp max ways	1 +
supported memory type	LPDDR3-1866 +
technology	CMOS +
thread count	8 +
used by	HTC One E9 +, HTC One E9+ +, iOcean Z1 + and Xiaomi Redmi Note 2 +
user equipment category	4 +
word size	64 bit (8 octets, 16 nibbles) +