Editing qualcomm/msm6xxx/msm6250

{{qualcomm title|MSM6250}}
{{mpu
| name                = Qualcomm MSM6250
| no image            = yes
| image               = 
| image size          = 
| caption             = 
| designer            = Qualcomm
| manufacturer        = TSMC
| manufacturer 2      = IBM
| model number        = MSM6250
| part number         = 
| market              = Mobile
| market 2            = Embedded
| first announced     = December 17, 2002
| first launched      = September, 2003
| last order          = 
| last shipment       = 
| release price       = 

| family              = MSM6xxx
| series              = MSM
| locked              = Yes
| frequency           = 146 MHz
| bus type            = AMBA 2
| bus speed           = 
| bus rate            = 
| bus links           = 
| clock multiplier    = 

| microarch           = ARM9
| platform            = 
| chipset             = MSM6xxx
| core name           = ARM926EJ-S
| core family         = 
| core model          = 
| core stepping       = 
| process             = 90 nm
| transistors         = 
| technology          = CMOS
| die area            = <!-- XX mm² -->
| die width           = 
| die length          = 
| word size           = 
| core count          = 1
| thread count        = 1
| max cpus            = 1
| max memory          = 4 GiB
| max memory addr     = 0xFFFFFFFF

| electrical          = <!-- put Yes if electrical info is added -->
| power               = <!-- power consumption  -->
| v core              = 
| v core tolerance    = 
| v io                = 
| v io tolerance      = 
| sdp                 = 
| tdp                 = 
| tdp typical         = 
| ctdp down           = 
| ctdp down frequency = 
| ctdp up             = 
| ctdp up frequency   = 
| temp min            = <!-- use TJ/TC whenever possible instead -->
| temp max            = 
| tjunc min           = <!-- .. °C -->
| tjunc max           = 
| tcase min           = 
| tcase max           = 
| tstorage min        = 
| tstorage max        = 
| tambient min        = 
| tambient max        = 

| packaging           = Yes
| package 0           = CSP-409
| package 0 type      = CSP
| package 0 pins      = 409
| package 0 pitch     = 0.5 mm
| package 0 width     = 14 mm
| package 0 length    = 14 mm
| package 0 height    = 0.7 mm
}}
'''MSM6250''' is a {{arch|32}} [[ARM]] [[system-on-chip]] with [[3G]] wireless capabilities developed by [[Qualcomm]] and introduced in [[2003]] for the mobile market. This SoC was part of the {{qualcomm|MSM6xxx}} [[part of::Multimedia Platform]] offering support for more advanced features such as position-location services, video, audio, and gaming.

== Cache ==
{{main|arm holdings/microarchitectures/ARM7#Memory_Hierarchy|l1=ARM9 § Cache}}
{{cache info
|l1i cache=16 KiB
|l1i break=1x16 KiB
|l1i desc=4-way set associative
|l1i extra=
|l1d cache=16 KiB
|l1d break=1x16 KiB
|l1d desc=4-way set associative
|l1d extra=
}}

== Wireless ==
{{wireless links
| 2g                = true
| gsm               = true
| gprs              = true
| edge              = 
| cdmaone           = 
| is-95a            = 
| is-95b            = 
| umts              =
| 3g                = true
| cdma2000          = 
| cdma2000 1x       = 
| cdma2000 1xev-do  = 
| cdma2000 1x adv   = 
| umts              = true
| wcdma             = true 
| hsdpa             = 
| hsupa             = 
}}
base frequency	146 MHz (0.146 GHz, 146,000 kHz) +
bus type	AMBA 2 +
chipset	MSM6xxx +
core count	1 +
core name	ARM926EJ-S +
designer	Qualcomm + and ARM Holdings +
dsp	QDSP4000 +
dsp base frequency	73 MHz (0.073 GHz, 73,000 kHz) +
family	MSM6xxx +
first announced	December 17, 2002 +
first launched	September 2003 +
full page name	qualcomm/msm6xxx/msm6250 +
has 2g support	true +
has 3g support	true +
has gprs support	true +
has gsm support	true +
has locked clock multiplier	true +
has umts support	true +
has wcdma support	true +
instance of	microprocessor +
l1d$ description	4-way set associative +
l1d$ size	16 KiB (16,384 B, 0.0156 MiB) +
l1i$ description	4-way set associative +
l1i$ size	16 KiB (16,384 B, 0.0156 MiB) +
ldate	September 2003 +
main image	+
manufacturer	TSMC + and IBM +
market segment	Mobile + and Embedded +
max cpu count	1 +
max memory	4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory address	0xFFFFFFFF +
microarchitecture	ARM9 +
model number	MSM6250 +
name	Qualcomm MSM6250 +
part of	Multimedia Platform +
process	130 nm (0.13 μm, 1.3e-4 mm) +
series	MSM +
smp max ways	1 +
technology	CMOS +
thread count	1 +
used by	LG U880 +, Samsung Z500 +, Sanyo SA700iS +, Toshiba V903T +, Samsung Z150 +, Huawei U636 +, LG V900 +, ZTE F608 +, Sanyo SA800i +, Siemens SXG75 + and Samsung ZV10 +