Editing intel/core m/m3-7y30

{{intel title|Core M3-7Y30}}
{{mpu
| name                = Core M3-7Y30
| no image            = Yes
| image               = 
| image size          = 
| caption             = 
| designer            = Intel
| manufacturer        = Intel
| model number        = M3-7Y30
| part number         = 
| market              = Mobile
| first announced     = August 30, 2016
| first launched      = August 30, 2016
| last order          = 
| last shipment       = 

| family              = Core M3
| series              = 7000
| locked              = Yes
| frequency           = 1000 MHz
| turbo frequency     = Yes
| turbo frequency1    = 2600 MHz
| turbo frequency2    = 
| bus type            = DMI 3.0
| bus speed           = 
| bus rate            = 
| clock multiplier    = 10
| s-spec              = 
| s-spec es           = 
| s-spec qs           = 
| cpuid               = 

| microarch           = Kaby Lake
| platform            = 
| chipset             = 
| core name           = Kaby Lake Y
| core family         = 
| core model          = 
| core stepping       = 
| process             = 14 nm
| transistors         = 
| technology          = CMOS
| die size            = 
| word size           = 64 bit
| core count          = 2
| thread count        = 4
| max cpus            = 1
| max memory          = 16 GB

| electrical          = Yes
| v core              = 
| v core tolerance    = 
| sdp                 = 
| tdp                 = 4.5 W
| ctdp down           = 3.5 W
| ctdp down frequency = 600 MHz
| ctdp up             = 7 W
| ctdp up frequency   = 1600 MHz
| temp min            = 
| temp max            = 
| tjunc min           = 0 °C
| tjunc max           = 100 °C
| tcase min           = 
| tcase max           = 
| tstorage min        = 
| tstorage max        = 

| packaging           = Yes
| package             = FCBGA-1515
| package type        = FCBGA
| package pitch       = 0.4 mm
| package size        = 20 mm x 16.5 mm
| socket              = BGA-1515
| socket type         = BGA
}}
The '''Core M3-7Y30''' is an ultra-low power dual-core {{arch|64}} [[x86]] microprocessor introduced by [[Intel]] in mid-2016. This MPU operates at 1 GHz with a max turbo frequency of 2.6 GHz. This chip, which is manufactured in [[14 nm process]] based on the {{intel|Kaby Lake}} microarchitecture and incorporates Intel's {{intel|HD Graphics 615}} GPU clocked at 300 MHz with turbo frequency of 900 MHz.

== Cache ==
{{main|intel/microarchitectures/skylake#Memory_Hierarchy|l1=Skylake § Cache}}
{{cache info
|l1i cache=
|l1i break=
|l1i desc=
|l1i extra=
|l1d cache=
|l1d break=
|l1d desc=
|l1d extra=
|l2 cache=
|l2 break=
|l2 desc=
|l2 extra=
|l3 cache=4 MB
|l3 break=2x2 MB
|l3 desc=
|l3 extra=(shared LLC)
}}

== Graphics ==
{{integrated graphic
| gpu                 = Intel HD Graphics 615
| device id           = 0x591E
| execution units     = 24
| displays            = 3
| frequency           = 300 MHz
| max frequency       = 900 MHz
| max memory          = 16 GB

| output crt          = 
| output sdvo         = 
| output dsi          = 
| output edp          = Yes
| output dp           = Yes
| output hdmi         = Yes
| output vga          = 
| output dvi          = Yes

| directx ver         = 12
| opengl ver          = 4.4
| opencl ver          = 2.0
| opengl es ver       = 
| hdmi ver            = 1.4a
| dvi ver             = 
| dsi ver             = 
| vulkan ver          = 
| dp ver              = 1.2
| edp ver             = 1.3

| max res hdmi        = 4096x2304
| max res hdmi freq   = 24 Hz
| max res dvi         = 
| max res dvi freq    = 
| max res dsi         = 
| max res dsi freq    = 
| max res dp          = 3840x2160
| max res dp freq     = 60 Hz
| max res dp 2        = 2880x1800
| max res dp 2 freq   = 60 Hz
| max res edp         = 3840x2160
| max res edp freq    = 60 Hz
| max res edp 2       = 3840x2160
| max res edp 2 freq  = 60 Hz
| max res vga         = 
| max res vga freq    =

| intel quick sync   = Yes
| intel intru 3d     = Yes
| intel insider      = Yes
| intel widi         = Yes
| intel fdi          = 
| intel clear video  = Yes
}}

== Memory controller ==
{{integrated memory controller
| type               = LPDDR3-1866
| type 1             = LPDDR3-1600
| controllers        = 1
| channels           = 2
| ecc support        = No
| max bandwidth      = 29.8 GB/s
| max memory         = 16 GB
}}

== Expansions ==
{{mpu expansions
| pcie revision      = 3.0
| pcie lanes         = 10
| pcie config        = 1x4
| pcie config 1      = 2x2
| pcie config 2      = 1x2+2x1
| pcie config 3      = 4x16x1
}}

== Features == 
{{mpu features
| em64t       = Yes
| nx          = Yes
| txt         = 
| tsx         = 
| vpro        = 
| ht          = Yes
| tbt1        =
| tbt2        = Yes
| bpt         = 
| vt-x        = Yes
| vt-d        = Yes
| ept         = Yes
| mmx         = Yes
| sse         = Yes
| sse2        = Yes
| sse3        = Yes
| ssse3       = Yes
| sse4        = Yes
| sse4.1      = Yes
| sse4.2      = Yes
| aes         = Yes
| pclmul      = Yes
| avx         = Yes
| avx2        = Yes
| bmi         = Yes
| bmi1        = Yes
| bmi2        = Yes
| f16c        = Yes
| fma3        = Yes
| mpx         = Yes
| sgx         = Yes
| eist        = Yes
| secure key  = Yes
| os guard    = Yes
| intel at    = 
}}
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Core M3-7Y30 - Intel#io +
base frequency	1,000 MHz (1 GHz, 1,000,000 kHz) +
bus rate	4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus type	OPI +
clock multiplier	10 +
core count	2 +
core family	6 +
core model	142 +
core name	Kaby Lake Y +
core stepping	H0 +
core voltage (max)	1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)	0.55 V (5.5 dV, 55 cV, 550 mV) +
designer	Intel +
device id	0x591E +
family	Core M3 +
first announced	August 30, 2016 +
first launched	August 30, 2016 +
full page name	intel/core m/m3-7y30 +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has ecc memory support	false +
has extended page tables support	true +
has feature	Advanced Encryption Standard Instruction Set Extension +, Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Enhanced SpeedStep Technology +, Extended Page Tables +, Flex Memory Access +, Hyper-Threading Technology +, Intel VT-d +, Intel VT-x +, Memory Protection Extensions +, My WiFi Technology +, OS Guard +, Secure Key Technology +, Smart Response Technology +, Software Guard Extensions +, Speed Shift Technology + and Turbo Boost Technology 2.0 +
has intel enhanced speedstep technology	true +
has intel flex memory access support	true +
has intel my wifi technology support	true +
has intel secure key technology	true +
has intel smart response technology support	true +
has intel speed shift technology	true +
has intel supervisor mode execution protection	true +
has intel turbo boost technology 2 0	true +
has intel vt-d technology	true +
has intel vt-x technology	true +
has locked clock multiplier	true +
has second level address translation support	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	HD Graphics 615 +
integrated gpu base frequency	300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designer	Intel +
integrated gpu execution units	24 +
integrated gpu max frequency	900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory	16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) +
isa	x86-64 +
isa family	x86 +
l1$ size	128 KiB (131,072 B, 0.125 MiB) +
l1d$ description	8-way set associative +
l1d$ size	64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description	8-way set associative +
l1i$ size	64 KiB (65,536 B, 0.0625 MiB) +
l2$ description	4-way set associative +
l2$ size	0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description	12-way set associative +
l3$ size	4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldate	August 30, 2016 +
main image	+
manufacturer	Intel +
market segment	Mobile +
max cpu count	1 +
max junction temperature	373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory	16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth	27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels	2 +
max pcie lanes	10 +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Kaby Lake +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number	M3-7Y30 +
name	Core M3-7Y30 +
package	FCBGA-1515 +
part number	HE8067702739824 +
platform	Kaby Lake +
process	14 nm (0.014 μm, 1.4e-5 mm) +
release price	$ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) +
s-spec	SR2ZY + and SR347 +
series	m3-7Y +
smp max ways	1 +
supported memory type	DDR3L-1600 + and LPDDR3-1866 +
tdp	4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) +
tdp down	3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) +
tdp down frequency	600 MHz (0.6 GHz, 600,000 kHz) +
tdp up	7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
tdp up frequency	1,600 MHz (1.6 GHz, 1,600,000 kHz) +
technology	CMOS +
thread count	4 +
turbo frequency (1 core)	2,600 MHz (2.6 GHz, 2,600,000 kHz) +
word size	64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensions	true +
x86/has software guard extensions	true +