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17 bytes (2 words) - 18:31, 30 March 2018
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17 bytes (2 words) - 18:31, 30 March 2018
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- ...rs. The 5th valence electron is loosely bound to that group V element. The thermal vibrations is enough make that electron free to move - leaving positive ion ...or HIGH and LOW. The positive voltage of the transistor is called VDD (or POWER or PWR). VDD represents the logic 1 value in digital circuits. In TTL logic8 KB (1,362 words) - 23:38, 17 November 2015
- This is a '''[[has type::quantity]]''' property representing thermal design power of the device.273 bytes (34 words) - 16:47, 1 January 2016
- ...by [[Intel]] in early 2016. This ultra-low power SoC has a thermal design power of just 5 W and operates at a base frequency of 1.04 GHz with a burst up to4 KB (475 words) - 17:42, 27 March 2018
- ...irst x86-compatible [[microarchitecture]] designed to target the ultra-low power market. Bonnell (project Silverthorne then) was designed by a then-new low-power design team Intel created at their Texas Development Center in Austin in 2038 KB (5,468 words) - 20:29, 23 May 2019
- | power = ...nm process]]. The i7-920XM supports 8GB of memory and has a thermal design power of 55 W.4 KB (522 words) - 20:46, 4 October 2018
- | power = ...nm process]]. The i7-940XM supports 8GB of memory and has a thermal design power of 55 W.4 KB (537 words) - 15:01, 13 December 2019
- ...ture with a brand new core design which is both more highly performing and power efficient. The front-end has been entirely redesigned to incorporate a new ** New power management unit84 KB (13,075 words) - 00:54, 29 December 2020
- ** Lower-power I/O (eMMC, UFS, SDXC) ...nd efficiency in order to cover a large spectrum of devices from ultra-low power to high-performance computing. Additionally, a large number of improvements79 KB (11,922 words) - 06:46, 11 November 2022
- ...core. This chip supports up to 24 GiB of memory and has a thermal design power of 130 W.4 KB (415 words) - 16:24, 13 December 2017
- ...core. This chip supports up to 24 GiB of memory and has a thermal design power of 130 W.4 KB (415 words) - 16:24, 13 December 2017
- ...3.6 GHz. This MPU supports up to 24 GiB of memory and has a thermal design power of 130 W.4 KB (419 words) - 16:24, 13 December 2017
- ....73 GHz. This MPU supports up to 24 GiB of memory and has a thermal design power of 130 W.4 KB (414 words) - 16:24, 13 December 2017
- ...this chip supports up to 64 GiB (DDR3) of memory and has a Thermal Design Power of 130 W.5 KB (517 words) - 23:32, 22 September 2019
- ...this chip supports up to 64 GiB (DDR3) of memory and has a Thermal Design Power of 150 W.4 KB (456 words) - 16:24, 13 December 2017
- ...n on TBT-enabled processors when there is sufficient headroom - subject to power rating, temperature rating, and current limits. ...d on a number of factors such as: estimated current consumption, estimated power consumption, core temperature, and the number of active cores.7 KB (990 words) - 14:39, 23 July 2022
- ...[has type::quantity]]''' property representing configurable thermal design power down of the device.330 bytes (41 words) - 20:59, 9 May 2016
- ...[has type::quantity]]''' property representing configurable thermal design power up of the device.330 bytes (41 words) - 21:00, 9 May 2016
- ...ips they branded as "Enhanced Am486". Those processors had a number of new power saving features (e.g. SMM and Stop Clock Mode). The additional features fou === Thermal & Clock ===13 KB (1,897 words) - 09:30, 21 July 2021
- ...d|Am486#Enhanced Am486|Enhanced Am486s}} which included various system and power management features (e.g. SMM & Stop-clock control). Additionally the 5x86 === Thermal & Clock ===7 KB (1,043 words) - 16:50, 14 June 2020
- === Thermal & Clock === * [[:File:CPU Thermal Management (Am486, Am5x86, K5) (August 1995).pdf|CPU Thermal Management]]; Publication #18448 Revision D/0; August 1995.8 KB (1,002 words) - 22:19, 17 June 2022