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R-Car M3 (SiP) - Renesas
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R-Car M3 (SiP) | |||||||||||
General Info | |||||||||||
Designer | Renesas, ARM Holdings | ||||||||||
Manufacturer | TSMC | ||||||||||
Model Number | M3 (SiP) | ||||||||||
Part Number | R8J77960 | ||||||||||
Market | Embedded | ||||||||||
Introduction | October 19, 2016 (announced) October, 2016 (launched) | ||||||||||
General Specs | |||||||||||
Family | R-Car | ||||||||||
Series | 3rd Gen | ||||||||||
Microarchitecture | |||||||||||
ISA | ARMv8 (ARM) | ||||||||||
Microarchitecture | Cortex-A53, Cortex-A57, Cortex-R7 | ||||||||||
Core Name | Cortex-A53, Cortex-A57, Cortex-R7 | ||||||||||
Process | 16 nm | ||||||||||
Technology | CMOS | ||||||||||
Word Size | 64 bit | ||||||||||
Cores | 7 | ||||||||||
Threads | 7 | ||||||||||
Multiprocessing | |||||||||||
Max SMP | 1-Way (Uniprocessor) | ||||||||||
Electrical | |||||||||||
Vcore | 0.9 V | ||||||||||
VI/O | 3.3 V | ||||||||||
Packaging | |||||||||||
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R-Car M3 is a 64-bit hepta-core ARM SoC designed by Renesas for the automotive industry and introduced in 2016. The M3 incorporates four Cortex-A53 cores, two Cortex-A57, and an additional Cortex-R7 core for real-time processing. This chip supports up to dual-channel LPDDR4-3200 memory. This chip incorporates the Imagination's PowerVR GX6250 GPU.
This model is an SiP variant of the M3 which include the DDR memory on-package.
Cache[edit]
- Main articles: Cortex-A53 § Cache and Cortex-A57 § Cache
Cache Organization
Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes. |
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Memory controller[edit]
Integrated Memory Controller
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Expansions[edit]
- USB 3.0 host interface (DRD) × 1 port (wPHY)
- USB 2.0 host interface × 1 port (wPHY)
- USB 2.0 host/function/OTG interface × 1 port (wPHY)
- SD host interface × 4 ch (SDR104)
- Multimedia card interface × 2 ch
- PCI Express 2.0 (1 lane) x 2 ch
- Media local bus (MLB) interface × 1 ch (3-pin interface)
- Controller area network (CAN-FD support) interface × 2ch
- Ethernet AVB 1.0-compatible MAC built in Interface: RGMII / Ethernet AVB (802.1BA)
- I2C bus interface × 8 ch
- Serial communication interface (SCIF) × 11 ch
- SPI multi I/O bus controller (RPC) × 1 ch (HyperFlashTM/QSPI support)
- Clock-synchronized serial interface (MSIOF) × 4 ch (SPI/IIS)
- Digital radio interface (DRIF) × 4 ch
Graphics[edit]
Integrated Graphics Information
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Features[edit]
[Edit/Modify Supported Features]
Supported ARM Extensions & Processor Features
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Block Diagram[edit]
Categories:
- all microprocessor models
- microprocessor models by renesas
- microprocessor models by renesas based on cortex-a53
- microprocessor models by renesas based on cortex-a57
- microprocessor models by renesas based on cortex-r7
- microprocessor models by arm holdings
- microprocessor models by arm holdings based on cortex-a53
- microprocessor models by arm holdings based on cortex-a57
- microprocessor models by arm holdings based on cortex-r7
- microprocessor models by tsmc
Facts about "R-Car M3 (SiP) - Renesas"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | R-Car M3 (SiP) - Renesas#package + |
core count | 7 + |
core name | Cortex-A53 +, Cortex-A57 + and Cortex-R7 + |
core voltage | 0.9 V (9 dV, 90 cV, 900 mV) + |
designer | ARM Holdings + and Renesas + |
family | R-Car + |
first announced | October 19, 2016 + |
first launched | October 2016 + |
full page name | renesas/r-car/m3 (sip) + |
has ecc memory support | false + |
instance of | microprocessor + |
integrated gpu | PowerVR GX6250 + |
integrated gpu designer | Imagination Technologies + |
io voltage | 3.3 V (33 dV, 330 cV, 3,300 mV) + |
isa | ARMv8 + |
isa family | ARM + |
l1$ size | 480 KiB (491,520 B, 0.469 MiB) + |
l1d$ size | 224 KiB (229,376 B, 0.219 MiB) + |
l1i$ size | 256 KiB (262,144 B, 0.25 MiB) + |
l2$ size | 1.5 MiB (1,536 KiB, 1,572,864 B, 0.00146 GiB) + |
ldate | October 2016 + |
main image | + |
manufacturer | TSMC + |
market segment | Embedded + |
max cpu count | 1 + |
max memory bandwidth | 11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) + |
max memory channels | 2 + |
microarchitecture | Cortex-A53 +, Cortex-A57 + and Cortex-R7 + |
model number | M3 (SiP) + |
name | R-Car M3 (SiP) + |
package | FCBGA-1255 + |
part number | R8J77960 + |
process | 16 nm (0.016 μm, 1.6e-5 mm) + |
series | 3rd Gen + |
smp max ways | 1 + |
supported memory type | LPDDR4-3200 + |
technology | CMOS + |
thread count | 7 + |
word size | 64 bit (8 octets, 16 nibbles) + |