Editing yield

{{title|Yield}}
'''Yield''' is a quantitative measure of the quality of a semiconductor process. It is the fraction of [[dies]] on the yielding [[wafers]] that are not discarded during the manufacturing process.

== Overview == 
Although the goal of every fabrication process is to produce only working [[dies]], in practice the process is never perfect and not all dies work or operate as desired within specs. Yield is a quantitative measurement of the process quality in terms of working dies.

=== Measuring yield ===
The final die yield is the compounded yield of all the independent steps that are required to produce a functional die. Those include:

* [[Wafer Yield]] (Y<sub>W</sub>) - fraction of wafers that are not scraped
* [[Die Yield]] or wafer sort yield (Y<sub>D</sub>) - fraction of dies that are not scraped
* [[Assembly Yield]] (Y<sub>A</sub>) - fraction of chips that are not scrapped during the packaging stage
* [[Burn-in Yield]] (Y<sub>B</sub>) - fraction of chips that pass [[burn-in]]

The overall yield is therefore Y = Y<sub>W</sub> ⋅ Y<sub>D</sub> ⋅ Y<sub>A</sub> ⋅ Y<sub>B</sub>

=== Yield loss ===
Yield loss refers to the source that affects the final yield. Those usually fall into two categories:

* [[Parametric Yield Loss]] - Dies that function but not within the desired specifications
* [[Catastrophic Yield Loss]] - Dies that do not function due to a defect
@@ Line 1: / Line 1: @@
-{{title|Yield}}{{yield}}
+{{title|Yield}}
 '''Yield''' is a quantitative measure of the quality of a semiconductor process. It is the fraction of [[dies]] on the yielding [[wafers]] that are not discarded during the manufacturing process.
 == Overview ==
 Although the goal of every fabrication process is to produce only working [[dies]], in practice the process is never perfect and not all dies work or operate as desired within specs. Yield is a quantitative measurement of the process quality in terms of working dies.
-:<math>Y = \frac{N_\text{good}}{N_\text{total}}</math>
-Where,
-* N<sub>good</sub> - number of working dies per wafer
-* N<sub>total</sub> - number of dies per wafer
-For example, consider a process with a [[defect density|D<sub>0</sub>]] = 0.5/cm², for [[dies]] the size of 360 mm².
-: [[File:360mm2 wafer yield 0.05pcm2.svg|500px]]
-There are 150 dies per wafer and around 24 defective dies per wafer, therefore the yield is <math>\frac{126}{150} = 84%</math>.
 === Measuring yield ===
 The final die yield is the compounded yield of all the independent steps that are required to produce a functional die. Those include:
-* [[Wafer Yield]] (Y<sub>W</sub>) - fraction of wafers that are not scrapped
+* [[Wafer Yield]] (Y<sub>W</sub>) - fraction of wafers that are not scraped
-* [[Die Yield]] or wafer sort yield (Y<sub>D</sub>) - fraction of dies that are not scrapped
+* [[Die Yield]] or wafer sort yield (Y<sub>D</sub>) - fraction of dies that are not scraped
 * [[Assembly Yield]] (Y<sub>A</sub>) - fraction of chips that are not scrapped during the packaging stage
 * [[Burn-in Yield]] (Y<sub>B</sub>) - fraction of chips that pass [[burn-in]]
@@ Line 33: / Line 20: @@
 * [[Parametric Yield Loss]] - Dies that function but not within the desired specifications
 * [[Catastrophic Yield Loss]] - Dies that do not function due to a defect
-During a new process technology bring-up, yield loss can be very high (< 40% yield). The process of identifying yield losses, quantifying them, and improving them is referred to as [[yield learning]].
-== Yield modeling ==
-{{empty section}}
-== Design for Manufacturability ==
-{{empty section}}
-== See also ==
-* [[Chiplet]]