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{{qualcomm title|Snapdragon 855 Plus}}
 
{{qualcomm title|Snapdragon 855 Plus}}
 
{{chip
 
{{chip
|name=Snapdragon 855 Plus/Snapdragon 860
+
|name=Snapdragon 855 Plus
 
|no image=Yes
 
|no image=Yes
 
|back image=sd 855 (back).png
 
|back image=sd 855 (back).png
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}}
 
}}
 
[[File:snapdragon-855-block-diagram.png|thumb|right|Block Diagram|200px]]
 
[[File:snapdragon-855-block-diagram.png|thumb|right|Block Diagram|200px]]
'''Snapdragon 855 Plus''' ('''855+''') is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in mid [[2019]]. Fabricated on TSMC's [[N7|7nm process]], the 855+ features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.96 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at 700 MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.
+
'''Snapdragon 855 Plus''' ('''855+''') is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in mid [[2019]]. Fabricated on TSMC's [[N7|7nm process]], the 855+ features four [[Kryo 485 Silver]] high-efficiency cores operating at 1.8 GHz along with three high-performance [[Kryo 485 Gold]] operating at 2.42 GHz and another higher-performance [[Kryo 485 Gold]] core operating at 2.84 GHz. The Snapdragon 855 integrates the {{qualcomm|Adreno 640}} [[GPU]] operation at 700 MHz and features an X24 LTE modem supporting Cat 20 uplink and Cat 20 downlink. This chip supports up to 16 GiB of quad-channel LPDDR4X-4266 memory.
  
 
The Snapdragon 855+ can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.
 
The Snapdragon 855+ can be paired with Qualcomm's X50 5G modem (an external chip) and an RF front-end interface chip (RFFE) to bring 5G NR, sub-6 GHz and mmWave, support.
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== Utilizing devices ==
 
== Utilizing devices ==
 
* [[used by::Asus ROG Phone II]]
 
* [[used by::Asus ROG Phone II]]
* [[used by::LG G8X]]
 
 
* [[used by::Meizu 16s Pro]]
 
* [[used by::Meizu 16s Pro]]
 
* [[used by::OPPO Reno Ace]]
 
* [[used by::OPPO Reno Ace]]
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* [[used by::Realme X2 Pro]]
 
* [[used by::Realme X2 Pro]]
 
* [[used by::Samsung Galaxy Z Flip]]
 
* [[used by::Samsung Galaxy Z Flip]]
* [[used by::Samsung Galaxy Tab S6 5G]]
 
* [[used by::Samsung Galaxy Quantum 2 (A82 5G)]]
 
* [[used by::Realme X3]]
 
* [[used by::Realme X3 Superzoom]]
 
* [[used by:: Xiaomi Poco X3 Pro (Snapdragon 860)]]
 
 
{{expand list}}
 
{{expand list}}
  

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back imageFile:sd 855 (back).png +
base frequency1,800 MHz (1.8 GHz, 1,800,000 kHz) +, 2,420 MHz (2.42 GHz, 2,420,000 kHz) + and 2,960 MHz (2.96 GHz, 2,960,000 kHz) +
core count8 +
core nameKryo 485 Gold + and Kryo 485 Silver +
designerQualcomm + and ARM Holdings +
die area73.27 mm² (0.114 in², 0.733 cm², 73,270,000 µm²) +
die length8.48 mm (0.848 cm, 0.334 in, 8,480 µm) +
die width8.64 mm (0.864 cm, 0.34 in, 8,640 µm) +
dspHexagon 690 DSP +
familySnapdragon 800 +
first announcedJuly 15, 2019 +
first launchedMarch 2019 +
full page namequalcomm/snapdragon 800/855 plus +
has ecc memory supportfalse +
instance ofmicroprocessor +
integrated gpuAdreno 640 GPU +
integrated gpu base frequency250 MHz (0.25 GHz, 250,000 KHz) +
integrated gpu designerQualcomm +
integrated gpu max frequency700 MHz (0.7 GHz, 700,000 KHz) +
isaARMv8 +
isa familyARM +
l1$ size512 KiB (524,288 B, 0.5 MiB) +
l1d$ description4-way set associative +
l1d$ size256 KiB (262,144 B, 0.25 MiB) +
l1i$ description4-way set associative + and 2-way set associative +
l1i$ size256 KiB (262,144 B, 0.25 MiB) +
l2$ description8-way set associative +
l2$ size1 MiB (1,024 KiB, 1,048,576 B, 9.765625e-4 GiB) + and 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
ldateMarch 2019 +
manufacturerTSMC +
market segmentMobile +
max cpu count1 +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth31.79 GiB/s (32,552.96 MiB/s, 34.134 GB/s, 34,134.253 MB/s, 0.031 TiB/s, 0.0341 TB/s) +
max memory channels8 +
microarchitectureCortex-A76 + and Cortex-A55 +
model numberSDM855AC +
nameSnapdragon 855 Plus/Snapdragon 860 +
part numberSM8150-AC +
process7 nm (0.007 μm, 7.0e-6 mm) +
series800 +
smp max ways1 +
supported memory typeLPDDR4X-4266 +
technologyCMOS +
thread count8 +
transistor count6,700,000,000 +
used byXiaomi Black Shark 2 +, Asus ROG Phone II +, Vivo iQOO Pro +, OnePlus 7T +, OnePlus 7T Pro +, Meizu 16s Pro +, OPPO Reno Ace +, Realme X2 Pro +, Vivo NEX 3 +, Xiaomi K20 Pro Premium +, Xiaomi Mi 9 Pro 5G +, Xiaomi Mix Alpha +, ZTE Nubia Red Magic 3s +, ZTE Nubia Z20 +, Smartisan Pro 3 +, Samsung Galaxy Z Flip +, Vivo iQOO Neo 855 Racing +, Realme X3 +, Realme X3 Superzoom +, Samsung Galaxy Tab S6 5G +, Samsung Galaxy Quantum 2 (A82 5G) +, LG G8X + and Xiaomi Poco X3 Pro (Snapdragon 860) +
word size64 bit (8 octets, 16 nibbles) +