|
|
| Line 1: |
Line 1: |
| − | {{qualcomm title|Snapdragon 845}}
| |
| − | {{chip
| |
| − | |name=Snapdragon 845
| |
| − | |image=sdm845 (front).png
| |
| − | |back image=sdm845 (back).png
| |
| − | |caption=Chip package, front
| |
| − | |designer=Qualcomm
| |
| − | |designer 2=ARM Holdings
| |
| − | |manufacturer=Samsung
| |
| − | |model number=SDM845
| |
| − | |part number=SDM845
| |
| − | |first announced=December 6, 2017
| |
| − | |first launched=February, 2018
| |
| − | |family=Snapdragon 800
| |
| − | |series=800
| |
| − | |frequency=2,800 MHz
| |
| − | |frequency 2=1,700 MHz
| |
| − | |isa=ARMv8.2
| |
| − | |isa family=ARM
| |
| − | |microarch=Cortex-A75
| |
| − | |microarch 2=Cortex-A55
| |
| − | |core name=Kryo 385 Gold
| |
| − | |core name 2=Kryo 385 Silver
| |
| − | |process=10 nm
| |
| − | |transistors=5,300,000,000
| |
| − | |technology=CMOS
| |
| − | |die area=95 mm²
| |
| − | |word size=64 bit
| |
| − | |core count=8
| |
| − | |thread count=8
| |
| − | |max cpus=1
| |
| − | |max memory=8 GiB
| |
| − | |predecessor=Snapdragon 835
| |
| − | |predecessor link=qualcomm/snapdragon_800/835
| |
| − | |successor=Snapdragon 855
| |
| − | |successor link=qualcomm/snapdragon_800/855
| |
| − | }}
| |
| − | [[File:sdm845 block diagram.jpg|thumb|right|Block diagram]]
| |
| − | '''Snapdragon 845''' is a high-performance {{arch|64}} [[ARM]] [[LTE]] [[system on a chip]] designed by [[Qualcomm]] and introduced in late [[2017]]. Fabricated on Samsung's [[10nm process|10nm 10LPP]], the 845 features four [[Kryo 385 Silver]] high-efficiency cores operating at 1.7 GHz along with four high-performance [[Kryo 385 Gold]] cores operating at 2.8 GHz. The Snapdragon 845 integrates the {{qualcomm|Adreno 630}} [[GPU]] operation at ? MHz and features an X20 LTE modem supporting Cat 13 uplink and Cat 18 downlink. This chip supports up to 8 GiB of quad-channel LPDDR4X-3733 memory.
| |
| | | | |
| − | == Cache ==
| |
| − | {{main|arm_holdings/microarchitectures/cortex-a75#Memory_Hierarchy|arm_holdings/microarchitectures/cortex-a55#Memory_Hierarchy|l1=Cortex-A75 § Cache|l2=Cortex-A55 § Cache}}
| |
| − |
| |
| − | Quad-core cluster {{armh|Cortex-A75|l=arch}}:
| |
| − | {{cache size
| |
| − | |l1 cache=512 KiB
| |
| − | |l1i cache=256 KiB
| |
| − | |l1i break=4x64 KiB
| |
| − | |l1i desc=4-way set associative
| |
| − | |l1d cache=256 KiB
| |
| − | |l1d break=4x64 KiB
| |
| − | |l1d desc=4-way set associative
| |
| − | |l2 cache=1 MiB
| |
| − | |l2 break=4x256 KiB
| |
| − | |l2 desc=8-way set associative
| |
| − | }}
| |
| − |
| |
| − | Quad-core cluster {{armh|Cortex-A55|l=arch}}:
| |
| − | {{cache size
| |
| − | |l1 cache=512 KiB
| |
| − | |l1i cache=256 KiB
| |
| − | |l1i break=4x64 KiB
| |
| − | |l1i desc=2-way set associative
| |
| − | |l1d cache=256 KiB
| |
| − | |l1d break=4x64 KiB
| |
| − | |l1d desc=4-way set associative
| |
| − | |l2 cache=512 KiB
| |
| − | |l2 break=4x128 KiB
| |
| − | |l2 desc=8-way set associative
| |
| − | }}
| |
| − |
| |
| − | * 2 MiB L3
| |
| − |
| |
| − | == Memory controller ==
| |
| − | {{memory controller
| |
| − | |type=LPDDR4X-3833
| |
| − | |ecc=No
| |
| − | |max mem=8 GiB
| |
| − | |controllers=1
| |
| − | |channels=4
| |
| − | |width=16 bit
| |
| − | |max bandwidth=29.87 GiB/s
| |
| − | |frequency=1866 MHz
| |
| − | |bandwidth schan=7.47 GiB/s
| |
| − | |bandwidth dchan=14.93 GiB/s
| |
| − | |bandwidth qchan=29.87 GiB/s
| |
| − | }}
| |
| − |
| |
| − | == DSP ==
| |
| − | {{#set: dsp|Hexagon 685 DSP}}
| |
| − | This chip features [[Qualcomm]]'s {{qualcomm|Hexagon}} {{qualcomm|Hexagon 685|685}} DSP.
| |
| − |
| |
| − | == Graphics ==
| |
| − | {{integrated graphics
| |
| − | | gpu = Adreno 630 GPU
| |
| − | | designer = Qualcomm
| |
| − | | execution units =
| |
| − | | max displays = 2
| |
| − | | max memory =
| |
| − | | frequency =
| |
| − | | max frequency =
| |
| − |
| |
| − | | output crt =
| |
| − | | output sdvo =
| |
| − | | output dsi =
| |
| − | | output edp =
| |
| − | | output dp =
| |
| − | | output hdmi =
| |
| − | | output vga =
| |
| − | | output dvi =
| |
| − |
| |
| − | | directx ver = 12
| |
| − | | opengl ver =
| |
| − | | opengl es ver = 3.2
| |
| − | | opencl ver = 2.0
| |
| − | | vulkan ver = 1.0
| |
| − | | hdmi ver =
| |
| − | | dp ver =
| |
| − | | edp ver =
| |
| − | | max res hdmi =
| |
| − | | max res hdmi freq =
| |
| − | | max res dp =
| |
| − | | max res dp freq =
| |
| − | | max res edp =
| |
| − | | max res edp freq =
| |
| − | | max res vga =
| |
| − | | max res vga freq =
| |
| − | }}
| |
| − |
| |
| − | * UHD video playback/encoding @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
| |
| − | * Slow motion HEVC video encoding of either HD (720p) video up to 480fps or FHD (1080p) up to 240fps
| |
| − | * H.264 (AVC), H.265 (HEVC), VP9, DisplayPort over USB Type-C support
| |
| − |
| |
| − | == Audio ==
| |
| − | * Qualcomm Aqstic audio codec and speaker amplifier
| |
| − | * Qualcomm aptX audio playback with support for aptX Classic and HD
| |
| − | * Native DSD support, PCM up to 384kHz/32bit
| |
| − |
| |
| − | == Camera ==
| |
| − | * Image Signal Processor
| |
| − | ** Qualcomm Spectra 280
| |
| − | ** New architecture for 14-bit image signal processing, with support for up to:
| |
| − | *** Single HFR 16 MPix camera at 60fps ZSL
| |
| − | *** Dual 16 MPix cameras at 30fps ZSL
| |
| − | *** Single 32 MPix camera at 30fps ZSL
| |
| − | ** Can connect up to 7 different cameras (many configurations possible)
| |
| − | *** Multi-frame Noise Reduction (MFNR) with accelerated image stabilization
| |
| − | *** Hybrid Autofocus with support for dual phase detection (2PD) sensors
| |
| − | *** Ultra HD Premium video capture @ 4K (3840x2160) 60fps, 10bit HDR, Rec 2020 color gamut
| |
| − | *** Higher quality video capture with Motion Compensated Temporal Filtering (MCTF)
| |
| − | *** 3D structured light active depth sensing, with accelerated face detection/recognition
| |
| − |
| |
| − | == Connectivity ==
| |
| − | * X20 LTE Modem
| |
| − | ** Downlink:
| |
| − | *** LTE Cat 18 up to 1.2 Gbps, 5x20 MHz carrier aggregation, up to 256-QAM, up to 4x4 MIMO on three carriers
| |
| − | ** Uplink:
| |
| − | *** LTE Cat 13 up to 150 Mbps, Upload+ (2x20 MHz carrier aggregation, up to 64-QAM)
| |
| − | ** License Assisted Access (LAA)
| |
| − | ** Citizens Broadband Radio Service (CBRS) shared radio spectrum
| |
| − | ** Dual SIM Dual VoLTE (DSDV)
| |
| − | ** All Mode with support for all major cellular modes plus LAA.
| |
| − | *** VoLTE with SRVCC to 3G and 2G, HD and Ultra HD Voice (EVS), CSFB to 3G and 2G
| |
| − | *** Voice over Wi-Fi (VoWiFi) with LTE call continuity
| |
| − |
| |
| − | * Wi-Fi
| |
| − | ** 802.11ad Multi-gigabit with 60 GHz diversity module
| |
| − | ** 802.11ac 2x2 with MU-MIMO
| |
| − | ** Tri-band Wi-Fi: 2.4 GHz and 5 GHz with Dual-Band Simultaneous (DBS) + 60 GHz
| |
| − | ** 11k/r/v: Enhanced mobility, fast acquisition and congestion mitigation for Carrier Wi-Fi
| |
| − |
| |
| − | * Bluetooth
| |
| − | ** Bluetooth 5.0
| |
| − | *** Proprietary enhancements
| |
| − | **** Ultra-low power wireless earbuds
| |
| − | **** Direct audio broadcast to multiple devices
| |
| − |
| |
| − | == Location ==
| |
| − | * Systems: GPS, Glonass, BeiDou, Galileo, QZSS, and SBAS
| |
| − | * Low Power Geofencing and Tracking, Sensor-assisted Navigation
| |
| − |
| |
| − | == Utilizing devices ==
| |
| − |
| |
| − | * [[used by::Asus Zenfone 5Z]]
| |
| − | * [[used by::Comma Three]]
| |
| − | * [[used by::Google Pixel 3]]
| |
| − | * [[used by::Google Pixel 3 XL]]
| |
| − | * [[used by::HTC U12+]]
| |
| − | * [[used by::LG G7 ThinQ]]
| |
| − | * [[used by::LG V35 ThinQ]]
| |
| − | * [[used by::LG V40 ThinQ]]
| |
| − | * [[used by::Nokia 9 PureView]]
| |
| − | * [[used by::OnePlus 6]]
| |
| − | * [[used by::OnePlus 6T]]
| |
| − | * [[used by::Oppo Find X]]
| |
| − | * [[used by::Razer Phone 2]]
| |
| − | * [[used by::Samsung Galaxy Note9]]
| |
| − | * [[used by::Samsung Galaxy S9]]
| |
| − | * [[used by::Samsung Galaxy S9+]]
| |
| − | * [[used by::Shift 6mq]]
| |
| − | * [[used by::Sony Xperia XZ2]]
| |
| − | * [[used by::Sony Xperia XZ2 compact]]
| |
| − | * [[used by::Sony Xperia XZ2 Premium]]
| |
| − | * [[used by::Sony Xperia XZ3]]
| |
| − | * [[used by::Xiaomi Mi Mix 3]]
| |
| − | * [[used by::Xiaomi Mi Mix 2s]]
| |
| − | * [[used by::Xiaomi Mi 8]]
| |
| − | * [[used by::Xiaomi Pocophone F1]]
| |
| − | * [[used by::ZTE Axon 9 Pro]]
| |
| − | {{expand list}}
| |
| − |
| |
| − | == Die ==
| |
| − | * Samsung [[10LPP|10nm 10LPP]]
| |
| − | * 95 mm²
| |
| − |
| |
| − |
| |
| − | :''Die photo by [https://www.techinsights.com/blog/apple-iphone-11-pro-max-teardown TechInsights]''
| |
| − | :[[File:845 die shot.png|500px]]
| |
| − |
| |
| − | == Documents ==
| |
| − | * [[:File:sdm845pb.pdf|SDM845 Product Brief]]
| |
| − | * [[:File:snapdragon-845-connectivity-pillar-presentation-by-peter-carson.pdf|SDM 845 connectivity presentation]]
| |
| − | * [[:File:snapdragon-845-performance-pillar-presentation-by-travis-lanier.pdf|Architecture deep dive]]
| |
| − | * [[:File:snapdragon-845-security-pillar-presentation-by-sy-choudhury.pdf|Mobile security experiences with Snapdragon 845]]
| |
.png)
+.png)
+
.png){kind=link}
.png){kind=link}