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Qualcomm announced the MSM6xxx family of [[system on chip]]s in March of [[2001]]. The chips offered key technologies such as [[2g|second-generation]] (2G) and [[3g|third-generation]] (3G) wireless technologies and wireless global roaming. These chips have various support levels for {{\\|gpsOne}} position location capabilities, [[Bluetooth]] connectivity capabilities, UMTS [[Subscriber Identity Module]] (SIM), [[Removable User Identity Module]] (R-UIM) and advanced multimedia features such as {{\\|Qtunes}} audio decoders, MPEG, MP3, and {{qualcomm|Compact Media Extension}} (CME) MIDI software support. | Qualcomm announced the MSM6xxx family of [[system on chip]]s in March of [[2001]]. The chips offered key technologies such as [[2g|second-generation]] (2G) and [[3g|third-generation]] (3G) wireless technologies and wireless global roaming. These chips have various support levels for {{\\|gpsOne}} position location capabilities, [[Bluetooth]] connectivity capabilities, UMTS [[Subscriber Identity Module]] (SIM), [[Removable User Identity Module]] (R-UIM) and advanced multimedia features such as {{\\|Qtunes}} audio decoders, MPEG, MP3, and {{qualcomm|Compact Media Extension}} (CME) MIDI software support. | ||
Facts about "MSM6xxx - Qualcomm"
designer | Qualcomm + and ARM Holdings + |
first announced | March 20, 2001 + |
first launched | 2002 + |
full page name | qualcomm/msm6xxx + |
instance of | system on a chip family + |
instruction set architecture | ARMv4 + and ARMv5 + |
main designer | Qualcomm + |
manufacturer | TSMC + and IBM + |
microarchitecture | ARM7TDMI + and ARM926EJ-S + |
name | Qualcomm MSM6xxx + |
package | FBGA-208 +, CSP-225 +, CSP-351 + and CSP-409 + |
process | 250 nm (0.25 μm, 2.5e-4 mm) +, 180 nm (0.18 μm, 1.8e-4 mm) +, 130 nm (0.13 μm, 1.3e-4 mm) +, 90 nm (0.09 μm, 9.0e-5 mm) + and 65 nm (0.065 μm, 6.5e-5 mm) + |
technology | CMOS + |
word size | 32 bit (4 octets, 8 nibbles) + |