From WikiChip
Difference between revisions of "mediatek/helio/mt6799"
< mediatek‎ | helio

Line 1: Line 1:
 
{{mediatek title|Helio X30 (MT6799)}}
 
{{mediatek title|Helio X30 (MT6799)}}
 
{{mpu
 
{{mpu
| name               = MediaTek Helio X30
+
|name=MediaTek Helio X30
| no image            = yes
+
|designer=MediaTek
| image              =
+
|designer 2=ARM Holdings
| image size          =
+
|manufacturer=TSMC
| caption            =
+
|model number=Helio X30
| designer           = MediaTek
+
|part number=MT6799
| designer 2         = ARM Holdings
+
|market=Mobile
| manufacturer       = TSMC
+
|market 2=Embedded
| model number       = Helio X30
+
|first announced=September 26, 2016
| part number         = MT6799
+
|first launched=February 27, 2017
| part number 2      =
+
|family=Helio
| market             = Mobile
+
|series=Helio X
| market 2           = Embedded
+
|frequency=2,500 MHz
| first announced     = September 26, 2016
+
|frequency 2=2,200 MHz
| first launched     = February 27, 2017
+
|frequency 3=1,900 MHz
| last order          =
+
|bus type=AMBA 4 AXI
| last shipment      =
+
|isa=ARMv8
| release price      =
+
|isa family=ARM
 
+
|microarch=Cortex-A53
| family             = Helio
+
|microarch 2=Cortex-A73
| series             = Helio X
+
|microarch 3=Cortex-A35
| locked              =
+
|core name=Cortex-A35
| frequency           = 2,500 MHz
+
|core name 2=Cortex-A53
| frequency 2         = 2,200 MHz
+
|core name 3=Cortex-A73
| frequency 3         = 1,900 MHz
+
|process=10 nm
| bus type           = AMBA 4 AXI
+
|technology=CMOS
| bus speed          =
+
|word size=64 bit
| bus rate            =  
+
|core count=10
| bus links          =
+
|thread count=10
| clock multiplier    =
+
|max cpus=1
 
+
|max memory=8 GiB
| isa family         = ARM
 
| isa                = ARMv8
 
| microarch           = Cortex-A53
 
| microarch 2         = Cortex-A73
 
| microarch 3         = Cortex-A35
 
| platform            =
 
| chipset            =
 
| core name           = Cortex-A35
 
| core name 2         = Cortex-A53
 
| core name 3         = Cortex-A73
 
| core family        =
 
| core model          =
 
| core stepping      =
 
| process             = 10 nm
 
| transistors        =
 
| technology         = CMOS
 
| die area            = <!-- XX mm² -->
 
| die width          =
 
| die length          =
 
| word size           = 64 bit
 
| core count         = 10
 
| thread count       = 10
 
| max cpus           = 1
 
| max memory         = 8 GiB
 
 
 
| electrical          =
 
| power              =
 
| v core              =
 
| v core tolerance    =
 
| v io                =
 
| v io 2              =
 
| v io 3              =
 
| sdp                =
 
| tdp                =
 
| tdp typical        =
 
| ctdp down          =
 
| ctdp down frequency =
 
| ctdp up            =
 
| ctdp up frequency  =
 
| temp min            =
 
| temp max            =
 
| tjunc min          =
 
| tjunc max          =
 
| tcase min          =
 
| tcase max          =
 
| tstorage min        = <!-- °C -->
 
| tstorage max        =
 
| tambient min        =
 
| tambient max        =
 
 
 
| packaging          =
 
| package 0          =
 
| package 0 type      =
 
| package 0 pins      =
 
| package 0 pitch    =
 
| package 0 width    =
 
| package 0 length    =
 
| package 0 height    =
 
 
}}
 
}}
 
'''Helio X30''' ('''MT6799''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a {{imgtec|PowerVR GT7400 Plus}} [[IGP]] operating at 800 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10.
 
'''Helio X30''' ('''MT6799''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and launched in early [[2017]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a {{imgtec|PowerVR GT7400 Plus}} [[IGP]] operating at 800 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 10.

Revision as of 17:08, 12 July 2017

Template:mpu Helio X30 (MT6799) is a 64-bit deca-core ARM LTE system on a chip designed by MediaTek and launched in early 2017. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.9 GHz, 2.2 GHz, and 2.5 GHz) and supports up to 8 GiB of quad-channel LPDDR4X-3732 memory. This SoC also incorporates a PowerVR GT7400 Plus IGP operating at 800 MHz. The chip has a modem supporting LTE User Equipment (UE) category 10.

Architecture

The Helio X30 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.

The three clusters are designed as a modified big.LITTLE configuration.

Cache

Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache
New text document.svg This section is empty; you can help add the missing info by editing this page.

Memory controller

[Edit/Modify Memory Info]

ram icons.svg
Integrated Memory Controller
Max TypeLPDDR4X-3732
Supports ECCNo
Max Mem8 GiB
Controllers1
Channels4
Width16 bit
Max Bandwidth27.81 GiB/s
28,477.44 MiB/s
29.861 GB/s
29,860.76 MB/s
0.0272 TiB/s
0.0299 TB/s
Bandwidth
Single 6.95 GiB/s
Double 13.9 GiB/s
Quad 27.81 GiB/s

Expansions

[Edit/Modify Expansions Info]

ide icon.svg
Expansion Options
USB
Revision2.0, 3.0
Ports8
UART

GP I/OYes


Graphics

[Edit/Modify IGP Info]

screen icon.svg
Integrated Graphics Information
GPUPowerVR GT7400 Plus
DesignerImagination Technologies
Frequency800 MHz
0.8 GHz
800,000 KHz
OutputDSI

Max Resolution
DSI3840x2160

Standards
Direct3D11.2
OpenGL3.3
OpenCL2.0
OpenGL ES3.2
Vulkan1.0

Wireless

Antu network-wireless-connected-100.svgWireless Communications
Wi-Fi
WiFi
802.11acYes
Cellular
2G
CSD Yes
GSM Yes
GPRS Yes
EDGE Yes
3G
UMTS
TD-SCDMAYes
DC-HSDPAYes
HSUPAYes
CDMA2000
1XYes
1xEV-DOYes
4G
LTE Advanced
E-UTRANYes
UE Cat10

Image

  • Integrated image signal processor supports 28 MP
  • Supports image stabilization
  • Supports video stabilization
  • Supports noise reduction
  • Supports lens shading correction
  • Supports AE/AWB/AF
  • Supports edge enhancement
  • Supports face detection and visual tracking
  • Hardware JPEG encoder

Video

  • Video encoding 4K2K @ 30fps with H.265 and HDR
  • Video decoding 4K2K @ 30fps, h.264, h.265 / HEVC, MPEG-1/2/4, VC-1, VP-8, VP-9

Audio

  • Audio content sampling rates 8kHz to 192kHz
  • Audio content sampling format 8-bit/16-bit/24-bit Mono/Stereo
  • I2S, PCM
  • Encode: AMR-NB, AMR-WB, AAC, OGG, ADPCM
  • Decode: WAV, MP3, MP2, AAC, AMR-NB, AMR-WB, MIDI, Vorbis, APE, AAC-plus v1, AAC-plus v2, FLAC, WMA, ADPCM
  • 7.1 channel MHL output

Utilizing devices

This list is incomplete; you can help by expanding it.