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{{mediatek title|Helio X25 (MT6797T)}} | {{mediatek title|Helio X25 (MT6797T)}} | ||
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|name=MediaTek Helio X25 | |name=MediaTek Helio X25 | ||
|no image=Yes | |no image=Yes | ||
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|max memory=6 GiB | |max memory=6 GiB | ||
}} | }} | ||
− | '''Helio X25''' ('''MT6797T''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.5 GHz) and supports up to 6 GiB of dual-channel LPDDR4X-3200 memory. This SoC also incorporates a {{armh|Mali- | + | '''Helio X25''' ('''MT6797T''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.5 GHz) and supports up to 6 GiB of dual-channel LPDDR4X-3200 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 850 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6. |
The Helio X25 is identical to {{\\|Helio X20}} except for the higher clocked {{armh|Cortex-A72|A72|l=arch}} cores and the higher clocked GPU. | The Helio X25 is identical to {{\\|Helio X20}} except for the higher clocked {{armh|Cortex-A72|A72|l=arch}} cores and the higher clocked GPU. | ||
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|width=32 bit | |width=32 bit | ||
− | |max bandwidth= | + | |max bandwidth=23.84 GiB/s |
− | |bandwidth schan= | + | |bandwidth schan=11.92 GiB/s |
− | |bandwidth dchan= | + | |bandwidth dchan=23.84 GiB/s |
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* [[used by::LeEco Le 2 X625]] | * [[used by::LeEco Le 2 X625]] | ||
* [[used by::Xiaomi Redmi Pro]] | * [[used by::Xiaomi Redmi Pro]] | ||
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{{expand list}} | {{expand list}} |
Facts about "Helio X25 (MT6797T) - MediaTek"
base frequency | 2,500 MHz (2.5 GHz, 2,500,000 kHz) +, 2,000 MHz (2 GHz, 2,000,000 kHz) + and 1,550 MHz (1.55 GHz, 1,550,000 kHz) + |
bus type | AMBA 4 AXI + |
core count | 10 + |
core name | Cortex-A53 + and Cortex-A72 + |
designer | ARM Holdings + and MediaTek + |
family | Helio + |
first announced | May 12, 2015 + |
first launched | March 16, 2016 + |
full page name | mediatek/helio/mt6797t + |
has 2g support | true + |
has 3g support | true + |
has 4g support | true + |
has cdma2000 1x support | true + |
has cdma2000 1xev-do support | true + |
has cdma2000 support | true + |
has csd support | true + |
has dc-hsdpa support | true + |
has e-utran support | true + |
has ecc memory support | false + |
has edge support | true + |
has gprs support | true + |
has gsm support | true + |
has hsupa support | true + |
has lte advanced support | true + |
has td-scdma support | true + |
has umts support | true + |
instance of | microprocessor + |
integrated gpu | Mali-T880 + |
integrated gpu base frequency | 850 MHz (0.85 GHz, 850,000 KHz) + |
integrated gpu designer | ARM Holdings + |
integrated gpu execution units | 4 + |
isa | ARMv8 + |
isa family | ARM + |
ldate | March 16, 2016 + |
manufacturer | TSMC + |
market segment | Embedded + and Mobile + |
max cpu count | 1 + |
max memory | 6,144 MiB (6,291,456 KiB, 6,442,450,944 B, 6 GiB, 0.00586 TiB) + |
max memory channels | 2 + |
microarchitecture | Cortex-A53 + and Cortex-A72 + |
model number | Helio X25 + |
name | MediaTek Helio X25 + |
part number | MT6797T + and MTK6797T + |
process | 20 nm (0.02 μm, 2.0e-5 mm) + |
series | Helio X + |
smp max ways | 1 + |
supported memory type | LPDDR3-1600 + |
technology | CMOS + |
thread count | 10 + |
used by | BMXC S10 +, Brandt Bprime S +, Elephone P11 3D +, Elephone S7 +, Elephone S8 +, Elephone Soldier +, LeEco Le 2 X625 +, Meizu Pro 6 +, Meizu Pro 6S +, Planet Computers Gemini (early versions) + and Xiaomi Redmi Pro + |
user equipment category | 6 + |
word size | 64 bit (8 octets, 16 nibbles) + |