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{{mediatek title|Helio X23 (MT6797D)}}
 
{{mediatek title|Helio X23 (MT6797D)}}
{{chip
+
{{mpu
|name=Helio X23
+
| name               = MediaTek Helio X23
|no image=Yes
+
| no image           = yes
|designer=MediaTek
+
| image              =
|designer 2=ARM Holdings
+
| image size          =
|manufacturer=TSMC
+
| caption            =  
|model number=Helio X23
+
| designer           = MediaTek
|part number=MT6797D
+
| designer 2         = ARM Holdings
|part number 2=MTK6797D
+
| manufacturer       = TSMC
|market=Mobile
+
| model number       = Helio X23
|market 2=Embedded
+
| part number         = MT6797D
|first announced=December 2, 2016
+
| part number 2       = MTK6797D
|first launched=December 2, 2016
+
| market             = Mobile
|family=Helio
+
| market 2           = Embedded
|series=Helio X
+
| first announced     = December 2, 2016
|frequency=2,300 MHz
+
| first launched     = December 2, 2016
|frequency 2=1,850 MHz
+
| last order          =
|frequency 3=1,400 MHz
+
| last shipment      =
|bus type=AMBA 4 AXI
+
| release price      =
|isa=ARMv8
+
 
|isa family=ARM
+
| family             = Helio
|microarch=Cortex-A53
+
| series             = Helio X
|microarch 2=Cortex-A72
+
| locked              =
|core name=Cortex-A53
+
| frequency           = 2,300 MHz
|core name 2=Cortex-A72
+
| frequency 2         = 1,850 MHz
|process=20 nm
+
| frequency 3         = 1,400 MHz
|technology=CMOS
+
| bus type           = AMBA 4 AXI
|word size=64 bit
+
| bus speed          =
|core count=10
+
| bus rate            =
|thread count=10
+
| bus links          =
|max cpus=1
+
| clock multiplier    =
|max memory=4 GiB
+
 
 +
| isa family         = ARM
 +
| isa                = ARMv8
 +
| microarch           = Cortex-A53
 +
| microarch 2         = Cortex-A72
 +
| platform            =
 +
| chipset            =
 +
| core name           = Cortex-A53
 +
| core name 2         = Cortex-A72
 +
| core family        =
 +
| core model          =
 +
| core stepping      =
 +
| process             = 20 nm
 +
| transistors        =
 +
| technology         = CMOS
 +
| die area            = <!-- XX mm² -->
 +
| die width          =
 +
| die length          =
 +
| word size           = 64 bit
 +
| core count         = 10
 +
| thread count       = 10
 +
| max cpus           = 1
 +
| max memory         =
 +
 
 +
| electrical          =
 +
| power              =
 +
| v core              =
 +
| v core tolerance    =
 +
| v io                =
 +
| v io 2              =
 +
| v io 3              =
 +
| sdp                =
 +
| tdp                =
 +
| tdp typical        =
 +
| ctdp down          =
 +
| ctdp down frequency =
 +
| ctdp up            =
 +
| ctdp up frequency  =
 +
| temp min            =
 +
| temp max            =
 +
| tjunc min          =
 +
| tjunc max          =
 +
| tcase min          =
 +
| tcase max          =
 +
| tstorage min        = <!-- °C -->
 +
| tstorage max        =
 +
| tambient min        =
 +
| tambient max        =
 +
 
 +
| packaging          =
 +
| package 0          =
 +
| package 0 type      =
 +
| package 0 pins      =
 +
| package 0 pitch    =
 +
| package 0 width    =
 +
| package 0 length    =
 +
| package 0 height    =  
 
}}
 
}}
'''Helio X23''' ('''MT6797D''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in late [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports up to 4 GiB of dual-channel LPDDR3-1600 memory. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
+
'''Helio X23''' ('''MT6797D''') is a {{arch|64}} [[deca-core]] [[ARM]] [[LTE]] system on a chip designed by [[MediaTek]] and introduced in early [[2016]]. This SoC incorporates 3 independent clusters of cores (called "Tri-Cluster" by MediaTek) operating at varying degrees of performance designed for certain workloads (operating at 1.4 GHz, 1.85 GHz, and 2.3 GHz) and supports dual-channel LPDDR3-933. This SoC also incorporates a {{armh|Mali-T800 MP4}} [[IGP]] operating at 780 MHz. The chip has a modem supporting [[LTE]] User Equipment (UE) category 6.
  
The Helio X23 is almost identical to {{\\|Helio X20}} but clocks a bit higher, provides additional support for a dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology.
+
The Helio X23 is identical to {{\\|Helio X20}} with the additional support for dual-camera setup[[has feature::Dual-Camera Setup| ]] and MiraVision's EnergySmart Screen technology.
 
== Architecture ==
 
== Architecture ==
The Helio X23 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
+
The Helio X20 is designed is composed of 3 individual clusters of CPU cores depending on the level of performance required by the active applications.
  
 
* Extreme Performance - 2x {{armh|Cortex-A72|l=arch}} @ 2.3 GHz
 
* Extreme Performance - 2x {{armh|Cortex-A72|l=arch}} @ 2.3 GHz
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== Memory controller ==
 
== Memory controller ==
 
{{memory controller
 
{{memory controller
|type=LPDDR3-1600
+
|type=LPDDR3-933
 
|ecc=No
 
|ecc=No
 
|max mem=4 GiB
 
|max mem=4 GiB
 
|controllers=1
 
|controllers=1
 
|channels=2
 
|channels=2
|max bandwidth=11.92 GiB/s
+
|max bandwidth=13.9 GiB/s
|bandwidth schan=5.96 GiB/s
+
|bandwidth schan=6.95 GiB/s
|bandwidth dchan=11.92 GiB/s
+
|bandwidth dchan=13.9 GiB/s
 
}}
 
}}
  
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* [[used by::LeEco Le 2 X620]]
 
* [[used by::LeEco Le 2 X620]]
 
* [[used by::Meizu MX6]]
 
* [[used by::Meizu MX6]]
* [[used by::Lenovo K8 note]]
+
* [[used by::Vernee Apollo Lite]]
* [[used by::LeEco Le Pro 3 Ai]]
+
* [[used by::Xiaomi Redmi Note 4]]
Chuwi hi9 air
 

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base frequency2,300 MHz (2.3 GHz, 2,300,000 kHz) +, 1,850 MHz (1.85 GHz, 1,850,000 kHz) + and 1,400 MHz (1.4 GHz, 1,400,000 kHz) +
bus typeAMBA 4 AXI +
core count10 +
core nameCortex-A53 + and Cortex-A72 +
designerMediaTek + and ARM Holdings +
familyHelio +
first announcedDecember 2, 2016 +
first launchedDecember 2, 2016 +
full page namemediatek/helio/mt6797d +
has 2g supporttrue +
has 3g supporttrue +
has 4g supporttrue +
has cdma2000 1x supporttrue +
has cdma2000 1xev-do supporttrue +
has cdma2000 supporttrue +
has csd supporttrue +
has dc-hsdpa supporttrue +
has e-utran supporttrue +
has ecc memory supportfalse +
has edge supporttrue +
has featureDual-Camera Setup +
has gprs supporttrue +
has gsm supporttrue +
has hsupa supporttrue +
has lte advanced supporttrue +
has td-scdma supporttrue +
has umts supporttrue +
instance ofmicroprocessor +
integrated gpuMali-T880 +
integrated gpu base frequency780 MHz (0.78 GHz, 780,000 KHz) +
integrated gpu designerARM Holdings +
integrated gpu execution units4 +
isaARMv8 +
isa familyARM +
ldateDecember 2, 2016 +
manufacturerTSMC +
market segmentMobile + and Embedded +
max cpu count1 +
max memory4,096 MiB (4,194,304 KiB, 4,294,967,296 B, 4 GiB, 0.00391 TiB) +
max memory bandwidth11.92 GiB/s (12,206.08 MiB/s, 12.799 GB/s, 12,799.003 MB/s, 0.0116 TiB/s, 0.0128 TB/s) +
max memory channels2 +
microarchitectureCortex-A53 + and Cortex-A72 +
model numberHelio X23 +
nameHelio X23 +
part numberMT6797D + and MTK6797D +
process20 nm (0.02 μm, 2.0e-5 mm) +
seriesHelio X +
smp max ways1 +
supported memory typeLPDDR3-1600 +
technologyCMOS +
thread count10 +
used byDoogee F7 +, Doogee F7 Pro +, Elephone R9 +, Elephone S7 +, HomTom HT10 +, LeEco Le 2 Pro X620 +, LeEco Le 2 X620 +, Meizu MX6 +, Lenovo K8 note + and LeEco Le Pro 3 Ai +
user equipment category6 +
word size64 bit (8 octets, 16 nibbles) +