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|name=Skylake SP
 
|name=Skylake SP
 
|image=skylake sp (basic).png
 
|image=skylake sp (basic).png
 +
|caption=Skylake SP, Regular
 
|image 2=skylake-sp (hfi).png
 
|image 2=skylake-sp (hfi).png
 
|caption 2=Skylake SP, with HFI
 
|caption 2=Skylake SP, with HFI
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|first launched=July 11, 2017
 
|first launched=July 11, 2017
 
|isa=x86-64
 
|isa=x86-64
|microarch=Skylake (server)
+
|microarch=Skylake
 
|platform=Purley
 
|platform=Purley
 
|chipset=Lewisburg
 
|chipset=Lewisburg
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|clock min=2.0 GHz
 
|clock min=2.0 GHz
 
|clock max=3.6 GHz
 
|clock max=3.6 GHz
|package name 1=intel,fclga_3647
+
|package module 1={{packages/intel/fclga-3647}}
 
|predecessor=Broadwell EP
 
|predecessor=Broadwell EP
 
|predecessor link=intel/cores/broadwell ep
 
|predecessor link=intel/cores/broadwell ep
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|succession=Yes
 
|succession=Yes
 
}}
 
}}
'''Skylake SP''' ('''{{intel|Skylake|l=arch}} Scalable Performance''') is the code name for Intel's series of server [[multiprocessors]] based on the {{intel|Skylake (server)|Skylake|l=arch}} microarchitecture as part of the {{intel|Purley|l=platform}} platform serving as a successor to both {{intel|Broadwell EX|l=core}} and {{intel|Broadwell EP|l=core}}. These chips support up to 8-way multiprocessing, up to [[28 cores]], and incorporate a new {{x86|AVX-512}} [[x86]] {{x86|extension}}. Skylake SP-based chips are manufactured on an enhanced [[14 nm process|14nm+ process]] and utilize the {{intel|Lewisburg|l=chipset}} chipset. Skylake SP-based models are branded as the [[processor families]]: {{intel|Xeon Bronze}}, {{intel|Xeon Silver}}, {{intel|Xeon Gold}}, and {{intel|Xeon Platinum}}.
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'''Skylake SP''' ('''{{intel|Skylake|l=arch}} Scalable Performance''') is the code name for Intel's series of server [[multiprocessors]] based on the {{intel|Skylake|l=arch}} microarchitecture as part of the {{intel|Purley|l=platform}} platform serving as a successor to both {{intel|Broadwell EX|l=core}} and {{intel|Broadwell EP|l=core}}. These chips support up to 8-way multiprocessing, up to [[28 cores]], and incorporate a new {{x86|AVX-512}} [[x86]] {{x86|extension}}. Skylake SP-based chips are manufactured on an enhanced [[14 nm process|14nm+ process]] and utilize the {{intel|Lewisburg|l=chipset}} chipset. Skylake SP-based models are branded as the [[processor families]]: {{intel|Xeon Bronze}}, {{intel|Xeon Silver}}, {{intel|Xeon Gold}}, and {{intel|Xeon Platinum}}.
  
 
== Overview ==
 
== Overview ==
Skylake SP processors are based on Intel's {{intel|Skylake (server)|Skylake|l=arch}} server configuration which incorporates a very large number of enhancements and improvements over its predecessor. Those processors support between two and eight-way multi-processing (the exact support depends on the Xeon family) and with all models supporting hex-chanel 768 GiB of DDR4 ECC memory or 1.5 TiB for extended memory models.
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Skylake SP processors are based on Intel's {{intel|Skylake|l=arch}} server configuration which incorporates a very large number of enhancements and improvements over its predecessor. Those processors support between two and eight-way multi-processing (the exact support depends on the Xeon family) and with all models supporting hex-chanel 768 GiB of DDR4 ECC memory or 1.5 GiB for extended memory models.
  
Skylake SP processors utilize the new {{intel|FCLGA-3647}} package (which makes use of "Socket P"). Those use the {{intel|Lewisburg}} chipset ({{intel|Platform Controller Hub|HUB}}) via 4 PCIe3 lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane. When in multi-socket configuration, the microprocessor is connected to the other processors via the {{intel|Ultra Path Interconnect}} (UPI) links which Intel introduced with Skylake SP as well, replacing and obsoleting the older {{intel|QuickPath Interconnect}} (QPI) operating. Depending on the model, there may be either two or three UPI links inter-linking each socket (for more details see {{intel|skylake (server)#Scalability|Skylake § Scalability|l=arch}}).
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Skylake SP processors utilize the new {{intel|FCLGA-3647}} package (which makes use of "Socket P"). Those use the {{intel|Lewisburg}} chipset ({{intel|Platform Controller Hub|HUB}}) via 4 PCIe3 lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane. When in multi-socket configuration, the microprocessor is connected to the other processors via the {{intel|Ultra Path Interconnect}} (UPI) links which Intel introduced with Skylake SP as well, replacing and obsoleting the older {{intel|QuickPath Interconnect}} (QPI) operating. Depending on the model, there may be either two or three UPI links inter-linking each socket (for more details see {{intel|skylake#Scalability|Skylake § Scalability|l=arch}}).
  
 
=== Common Features ===
 
=== Common Features ===
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* Hexa-channel memory
 
* Hexa-channel memory
** 768 GiB / 1.5 TiB for extended memory variants (''M'' suffix)
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** 768 GiB / 1.5 GiB for extended memory variants (''M'' suffix)
 
** UP to DDR4-2666 MT/s
 
** UP to DDR4-2666 MT/s
 
** [[ECC]] support
 
** [[ECC]] support
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** Gold and up also have Node Controller Support and offer Integrated Omni-Path Fabric Interface options
 
** Gold and up also have Node Controller Support and offer Integrated Omni-Path Fabric Interface options
  
Models that are suffixed with "''T''" have extended lifetime (10 year use) guarantees and [[NEBS]]-friendly packing specification. Additionally, models that are suffixed with "''F''" (SKL-F) integrate the {{intel|Omni-Path}} Host Fabric Interface (HFI) die on-package.
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Models that are suffixed with "''T''" have extended lifetime (10 year use) guarantees and [[NEBS]]-friendly packing specification. Additionally, models that are suffixed with "''F''" integrate the {{intel|Omni-Path}} Host Fabric Interface (HFI) die on-package.
  
  

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chipsetLewisburg +
designerIntel +
first announcedMay 4, 2017 +
first launchedJuly 11, 2017 +
instance ofcore +
isax86-64 +
main imageFile:skylake sp (basic).png + and File:skylake-sp (hfi).png +
main image captionSkylake SP, with HFI +
manufacturerIntel +
microarchitectureSkylake (server) +
nameSkylake SP +
packageFCLGA-3647 +
platformPurley +
process14 nm (0.014 μm, 1.4e-5 mm) +
socketSocket P + and LGA-3647 +
technologyCMOS +
word size64 bit (8 octets, 16 nibbles) +