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{{core
 
{{core
 
|name=Kaby Lake G
 
|name=Kaby Lake G
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|image=kaby lake g (front).png
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|no image=Yes
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|caption=Package front
 
 
|developer=Intel
 
|developer=Intel
 
|developer 2=AMD
 
|developer 2=AMD
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|manufacturer 2=GlobalFoundries
 
|manufacturer 2=GlobalFoundries
 
|first announced=November 6, 2017
 
|first announced=November 6, 2017
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|first launched=January 7, 2018
 
 
|isa=x86-64
 
|isa=x86-64
 
|isa family=x86
 
|isa family=x86
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|tech=CMOS
 
|tech=CMOS
 
}}
 
}}
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'''Kaby Lake G''' ('''KBL-G''') is the name of the core for [[Intel]]'s high-performance line of mobile processors based on the {{intel|Kaby Lake|l=arch}} microarchitecture and incorporate a discrete [[AMD]] {{amd|Vega|l=arch}} graphics processor. These chips are targeted towards ultimate mobile gaming experience. Kaby Lake G processors are fabricated on Intel's enhanced [[14 nm lithography process|14nm+ process]] and for graphics, GlobalFoundries [[14 nm process]].
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'''Kaby Lake G''' ('''KBL-G''') is the name of the core for [[Intel]]'s high-performance line of mobile processors based on the {{intel|Kaby Lake|l=arch}} microarchitecture integrating [[AMD]]'s {{amd|Vega|l=arch}} graphics processor. These chips are targeted towards ultimate mobile gaming experience. Kaby Lake G processors are fabricated on Intel's enhanced [[14 nm lithography process|14nm+ process]] and for graphics, GlobalFoundries [[14 nm process]].
  
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== Overview ==
 
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[[File:8th gen core i7 with radeon logo (2018).png|250px|right]]
 
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[[File:8th gen core i5 with radeon logo (2018).png|250px|right]]
 
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{{see also|intel/microarchitectures/kaby_lake#Kaby_Lake_G|l1=Kaby Lake § Kaby Lake G}}
 
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Kaby Lake G based processors are a 2-chip solution - the [[microprocessor]] and the [[chipset]]. Those parts are [[BGA]] and are soldered onto the motherboard. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane. The microprocessor itself is identical to one used for the {{intel|Kaby Lake H|l=core}} but is now packaged along with the Radeon GPU and [[HBM 2]].
 
  
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=== Graphics ===
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{{future information}}
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Those processors are unique in the fact that this is the first time Intel has integrated a discrete graphics processor into the same package as the microprocessor. This is also the first time they are using a competitor's graphics processor. Those parts incorporate an [[AMD]] [[GPU]] based on the {{amd|Vega|l=arch}} microarchitecture and incorporate their own 4 GiB of [[high-bandwidth memory]] 2 (HBM2). The HBM solution is connected to the graphics processor using Intel's [[EMIB]], a high-speed in-package interconnect solution.
 
  
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The CPU itself is connected to the GPU using 8 of the other PCIe lanes, leaving the 8 remaining lanes for other peripherals to communicate with the CPU directly.
 
  
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== Overview ==
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[[File:kaby lake g with amd radeon package.png|600px]]
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Kaby Lake S based processors are a 2-chip solution - the [[microprocessor]] and the [[chipset]]. Kaby Lake S are {{intel|LGA-1151|Socket LGA-1151}} and use {{intel|Union Point}} chipset ({{intel|Platform Controller Hub|HUB}}) but they may also use previous generation ({{intel|Skylake S|l=core}}) {{intel|Sunrise Point}} via a firmware upgrade. The microprocessor is connected to the chipset via 4 of the chip's 20 PCIe lanes using Intel's proprietary {{intel|Direct Media Interface}} 3.0 (DMI 3.0), allowing for 8 GT/s transfer rate per lane. Additionally, 8 of the other PCIe lanes are used for the discrete [[AMD]] GPU that is incorporated into the same package as the CPU itself.
  
 
=== Common Features ===
 
=== Common Features ===
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** Up to DDR3L-1600, DDR4-2400
 
** Up to DDR3L-1600, DDR4-2400
 
** Up to 64 GiB
 
** Up to 64 GiB
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* 8x PCIe
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* 8x PCIe (4 of the 20 are used by the bus and 8 for the GPU as described above)
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** 20x in total, 4 of the 20 are used by the bus and 8 for the GPU as described above
 
 
* [[quad-core]] with {{intel|Hyper-Threading}} (8 threads)
 
* [[quad-core]] with {{intel|Hyper-Threading}} (8 threads)
 
* Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, and AVX2)
 
* Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, and AVX2)
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* BGA package
 
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==== Graphics ====
 
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[[File:kbl-g graphics subsystem.png|thumb|right|400px|Graphics Subsystem]]
 
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Those processors have superior graphics capabilities as well as 4 GiB of [[HBM 2]] cache.
 
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* [[HBM 2]] (Intel calls "High Bandwidth Cache" or "HBC")
 
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** 4 GiB
 
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** 1,024 bit
 
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*** @ 800 MHz (204.8 GB/s peak bandwidth)
 
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*** @ 700 MHz (179.2 GB/s peak bandwidth)
 
 
* Graphics
 
* Graphics
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** 9 Display outputs available
 
 
** Integrated {{intel|HD Graphics 630}} ({{intel|Gen9.5|l=arch}} GT2)
 
** Integrated {{intel|HD Graphics 630}} ({{intel|Gen9.5|l=arch}} GT2)
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*** 3 Displays
 
 
*** Base frequency of 350 MHz
 
*** Base frequency of 350 MHz
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*** Burst frequency of 1.1 GHz
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*** Burst frequency of 1.15 GHz
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** Discrete {{amd|Vega|l=arch}}-based GPUs
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** Discrete {{amd|Vega|l=arch}} 20/24 GPU
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*** Custom Radeon RX Vega M Graphics
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*** Frequency 1-1.19 GHz
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**** 6 Displays
 
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**** [[Radeon RX Vega M GH]]
 
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***** 24 Compute Units
 
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***** 1,536 Stream processors, 64 pix/clk (ROPs), 96 texture units
 
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***** 3.7 TFLOPS peak performance
 
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**** [[Radeon RX Vega M GL]]
 
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***** 20 Compute Units
 
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***** 1,280 Stream processors, 32 pix/clk (ROPs), 80 texture units
 
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***** 2.6 TFLOPS peak performance
 
  
 
{{clear}}
 
{{clear}}
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== Kaby Lake G Processors ==
 
== Kaby Lake G Processors ==
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-->
 
-->
 
{{comp table start}}
 
{{comp table start}}
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<table class="comptable sortable tc4 tc5 tc13 tc14">
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<table class="comptable sortable tc4">
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{{comp table header|main|13:List of Kaby Lake G-based Processors}}
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{{comp table header|main|12:List of Kaby Lake G-based Processors}}
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{{comp table header|main|8:Main processor|3:Graphics Processors|2:Features}}
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{{comp table header|main|9:Main processor|3:Graphics Processors}}
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{{comp table header|cols|Launched|Family|C|T|L3$|TDP|%Frequency|%Turbo|GPU|Base|Burst|vPro|Locked}}
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{{comp table header|cols|Price|Launched|Family|C|T|L3$|TDP|%Frequency|%Turbo|GPU|Base|iGPU Burst}}
 
{{#ask: [[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Kaby Lake G]]
 
{{#ask: [[Category:microprocessor models by intel]] [[instance of::microprocessor]] [[core name::Kaby Lake G]]
 
  |?full page name
 
  |?full page name
 
  |?model number
 
  |?model number
 
  |?first launched
 
  |?first launched
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|?release price
 
  |?microprocessor family
 
  |?microprocessor family
 
  |?core count
 
  |?core count
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  |?integrated gpu base frequency
 
  |?integrated gpu base frequency
 
  |?integrated gpu max frequency
 
  |?integrated gpu max frequency
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|?has intel vpro technology
 
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|?has locked clock multiplier
 
 
  |format=template
 
  |format=template
 
  |template=proc table 3
 
  |template=proc table 3
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  |userparam=15:14
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  |userparam=14
 
  |mainlabel=-
 
  |mainlabel=-
 
  |valuesep=,
 
  |valuesep=,

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Facts about "Kaby Lake G - Cores - Intel"
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designerIntel + and AMD +
first announcedNovember 6, 2017 +
first launchedJanuary 7, 2018 +
instance ofcore +
isax86-64 +
isa familyx86 +
main imageFile:kaby lake g (front).png +
main image captionPackage front +
manufacturerIntel + and GlobalFoundries +
microarchitectureKaby Lake +
nameKaby Lake G +
process14 nm (0.014 μm, 1.4e-5 mm) +
technologyCMOS +
word size64 bit (8 octets, 16 nibbles) +