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{{intel title|Core M3-7Y30}} | {{intel title|Core M3-7Y30}} | ||
− | {{ | + | {{mpu |
− | |name=Core M3-7Y30 | + | | name = Core M3-7Y30 |
− | |image= | + | | no image = Yes |
− | |image size= | + | | image = |
− | |designer=Intel | + | | image size = |
− | |manufacturer=Intel | + | | caption = |
− | |model number=M3-7Y30 | + | | designer = Intel |
− | |part number=HE8067702739824 | + | | manufacturer = Intel |
− | |s-spec=SR2ZY | + | | model number = M3-7Y30 |
− | |s-spec 2=SR347 | + | | part number = HE8067702739824 |
− | |market=Mobile | + | | part number 1 = |
− | |first announced=August 30, 2016 | + | | part number 2 = |
− | |first launched=August 30, 2016 | + | | s-spec = SR2ZY |
− | |release price=$281.00 | + | | s-spec 2 = SR347 |
− | |family=Core M3 | + | | market = Mobile |
− | |series=m3-7Y | + | | first announced = August 30, 2016 |
− | |locked=Yes | + | | first launched = August 30, 2016 |
− | |frequency=1,000 MHz | + | | last order = |
− | |turbo frequency1=2,600 MHz | + | | last shipment = |
− | |turbo | + | | release price = $281.00 |
− | |bus type=OPI | + | |
− | |bus rate=4 GT/s | + | | family = Core M3 |
− | |clock multiplier=10 | + | | series = m3-7Y |
− | |isa=x86 | + | | locked = Yes |
− | |isa | + | | frequency = 1,000 MHz |
− | |microarch=Kaby Lake | + | | turbo frequency = Yes |
− | |platform=Kaby Lake | + | | turbo frequency1 = 2,600 MHz |
− | |core name=Kaby Lake Y | + | | turbo frequency2 = |
− | |core family=6 | + | | turbo frequency3 = |
− | |core model=142 | + | | turbo frequency4 = |
− | |core stepping=H0 | + | | bus type = OPI |
− | |process=14 nm | + | | bus speed = |
− | |technology=CMOS | + | | bus rate = 4 GT/s |
− | |word size=64 bit | + | | bus links = |
− | |core count=2 | + | | clock multiplier = 10 |
− | |thread count=4 | + | | cpuid = |
− | |max cpus=1 | + | |
− | |max memory=16 GiB | + | | isa family = x86 |
− | |v core min=0.55 V | + | | isa = x86-64 |
− | |v core max=1.52 V | + | | microarch = Kaby Lake |
− | |tdp=4.5 W | + | | platform = Kaby Lake |
− | |ctdp down=3.75 W | + | | chipset = |
− | |ctdp down frequency=600 MHz | + | | core name = Kaby Lake Y |
− | |ctdp up=7 W | + | | core family = 6 |
− | |ctdp up frequency=1,600 MHz | + | | core model = 142 |
− | |tjunc min=0 °C | + | | core stepping = H0 |
− | |tjunc max=100 °C | + | | core stepping 2 = |
− | |tstorage min=-25 °C | + | | process = 14 nm |
− | |tstorage max=125 °C | + | | transistors = |
− | |package | + | | technology = CMOS |
+ | | die area = | ||
+ | | die width = | ||
+ | | die length = | ||
+ | | word size = 64 bit | ||
+ | | core count = 2 | ||
+ | | thread count = 4 | ||
+ | | max cpus = 1 | ||
+ | | max memory = 16 GiB | ||
+ | |||
+ | | electrical = Yes | ||
+ | | v core min = 0.55 V | ||
+ | | v core max = 1.52 V | ||
+ | | sdp = | ||
+ | | tdp = 4.5 W | ||
+ | | tdp typical = | ||
+ | | ctdp down = 3.75 W | ||
+ | | ctdp down frequency = 600 MHz | ||
+ | | ctdp up = 7 W | ||
+ | | ctdp up frequency = 1,600 MHz | ||
+ | | tjunc min = 0 °C | ||
+ | | tjunc max = 100 °C | ||
+ | | tcase min = | ||
+ | | tcase max = | ||
+ | | tstorage min = -25 °C | ||
+ | | tstorage max = 125 °C | ||
+ | | tambient min = | ||
+ | | tambient max = | ||
+ | |||
+ | | packaging = Yes | ||
+ | | package 0 = FCBGA-1515 | ||
+ | | package 0 type = FCBGA | ||
+ | | package 0 pins = 1515 | ||
+ | | package 0 pitch = 0.4 mm | ||
+ | | package 0 width = 20 mm | ||
+ | | package 0 length = 16.5 mm | ||
+ | | package 0 height = | ||
+ | | socket 0 = BGA-1515 | ||
+ | | socket 0 type = BGA | ||
}} | }} | ||
− | '''Core M3-7Y30''' is a {{arch|64}} [[dual-core]] low-end performance | + | '''Core M3-7Y30''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in mid-[[2016]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The M3-7Y30 operates at 1 GHz with a TDP of 4.5 W supporting a {{intel|Turbo Boost}} frequency of 2.6 GHz. The processor supports up to 16 GiB of dual-channel non-ECC LPDDR3-1866 memory and incorporates Intel's {{intel|HD Graphics 615}} [[IGP]] operating at 300 MHz with a burst frequency of 900 MHz. |
This specific model has a configurable TDP-down of 3.75 W with a frequency of 600 MHz and a configurable TDP-up of 7 W with a frequency of 1.6 GHz. | This specific model has a configurable TDP-down of 3.75 W with a frequency of 600 MHz and a configurable TDP-up of 7 W with a frequency of 1.6 GHz. | ||
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|l1i break=2x32 KiB | |l1i break=2x32 KiB | ||
|l1i desc=8-way set associative | |l1i desc=8-way set associative | ||
+ | |l1i policy=write-back | ||
|l1d cache=64 KiB | |l1d cache=64 KiB | ||
|l1d break=2x32 KiB | |l1d break=2x32 KiB | ||
Line 167: | Line 206: | ||
|avx=Yes | |avx=Yes | ||
|avx2=Yes | |avx2=Yes | ||
− | + | |avx512=No | |
|abm=Yes | |abm=Yes | ||
|tbm=No | |tbm=No |
Facts about "Core M3-7Y30 - Intel"
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki. | Core M3-7Y30 - Intel#io + |
base frequency | 1,000 MHz (1 GHz, 1,000,000 kHz) + |
bus rate | 4,000 MT/s (4 GT/s, 4,000,000 kT/s) + |
bus type | OPI + |
clock multiplier | 10 + |
core count | 2 + |
core family | 6 + |
core model | 142 + |
core name | Kaby Lake Y + |
core stepping | H0 + |
core voltage (max) | 1.52 V (15.2 dV, 152 cV, 1,520 mV) + |
core voltage (min) | 0.55 V (5.5 dV, 55 cV, 550 mV) + |
designer | Intel + |
device id | 0x591E + |
family | Core M3 + |
first announced | August 30, 2016 + |
first launched | August 30, 2016 + |
full page name | intel/core m/m3-7y30 + |
has advanced vector extensions | true + |
has advanced vector extensions 2 | true + |
has ecc memory support | false + |
has extended page tables support | true + |
has feature | Advanced Encryption Standard Instruction Set Extension +, Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Enhanced SpeedStep Technology +, Extended Page Tables +, Flex Memory Access +, Hyper-Threading Technology +, Intel VT-d +, Intel VT-x +, Memory Protection Extensions +, My WiFi Technology +, OS Guard +, Secure Key Technology +, Smart Response Technology +, Software Guard Extensions +, Speed Shift Technology + and Turbo Boost Technology 2.0 + |
has intel enhanced speedstep technology | true + |
has intel flex memory access support | true + |
has intel my wifi technology support | true + |
has intel secure key technology | true + |
has intel smart response technology support | true + |
has intel speed shift technology | true + |
has intel supervisor mode execution protection | true + |
has intel turbo boost technology 2 0 | true + |
has intel vt-d technology | true + |
has intel vt-x technology | true + |
has locked clock multiplier | true + |
has second level address translation support | true + |
has simultaneous multithreading | true + |
has x86 advanced encryption standard instruction set extension | true + |
instance of | microprocessor + |
integrated gpu | HD Graphics 615 + |
integrated gpu base frequency | 300 MHz (0.3 GHz, 300,000 KHz) + |
integrated gpu designer | Intel + |
integrated gpu execution units | 24 + |
integrated gpu max frequency | 900 MHz (0.9 GHz, 900,000 KHz) + |
integrated gpu max memory | 16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) + |
isa | x86-64 + |
isa family | x86 + |
l1$ size | 128 KiB (131,072 B, 0.125 MiB) + |
l1d$ description | 8-way set associative + |
l1d$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l1i$ description | 8-way set associative + |
l1i$ size | 64 KiB (65,536 B, 0.0625 MiB) + |
l2$ description | 4-way set associative + |
l2$ size | 0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) + |
l3$ description | 12-way set associative + |
l3$ size | 4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) + |
ldate | August 30, 2016 + |
main image | + |
manufacturer | Intel + |
market segment | Mobile + |
max cpu count | 1 + |
max junction temperature | 373.15 K (100 °C, 212 °F, 671.67 °R) + |
max memory | 16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) + |
max memory bandwidth | 27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) + |
max memory channels | 2 + |
max pcie lanes | 10 + |
max storage temperature | 398.15 K (125 °C, 257 °F, 716.67 °R) + |
microarchitecture | Kaby Lake + |
min junction temperature | 273.15 K (0 °C, 32 °F, 491.67 °R) + |
min storage temperature | 248.15 K (-25 °C, -13 °F, 446.67 °R) + |
model number | M3-7Y30 + |
name | Core M3-7Y30 + |
package | FCBGA-1515 + |
part number | HE8067702739824 + |
platform | Kaby Lake + |
process | 14 nm (0.014 μm, 1.4e-5 mm) + |
release price | $ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) + |
s-spec | SR2ZY + and SR347 + |
series | m3-7Y + |
smp max ways | 1 + |
supported memory type | DDR3L-1600 + and LPDDR3-1866 + |
tdp | 4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) + |
tdp down | 3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) + |
tdp down frequency | 600 MHz (0.6 GHz, 600,000 kHz) + |
tdp up | 7 W (7,000 mW, 0.00939 hp, 0.007 kW) + |
tdp up frequency | 1,600 MHz (1.6 GHz, 1,600,000 kHz) + |
technology | CMOS + |
thread count | 4 + |
turbo frequency (1 core) | 2,600 MHz (2.6 GHz, 2,600,000 kHz) + |
word size | 64 bit (8 octets, 16 nibbles) + |
x86/has memory protection extensions | true + |
x86/has software guard extensions | true + |