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{{intel title|Core M3-7Y30}}
 
{{intel title|Core M3-7Y30}}
{{chip
+
{{mpu
|name=Core M3-7Y30
+
| name               = Core M3-7Y30
|image=kaby lake y (front).png
+
| no image           = Yes
|image size=250px
+
| image               =  
|designer=Intel
+
| image size         =  
|manufacturer=Intel
+
| caption            =  
|model number=M3-7Y30
 
|part number=HE8067702739824
 
|s-spec=SR2ZY
 
|s-spec 2=SR347
 
|market=Mobile
 
|first announced=August 30, 2016
 
|first launched=August 30, 2016
 
|release price=$281.00
 
|family=Core M3
 
|series=m3-7Y
 
|locked=Yes
 
|frequency=1,000 MHz
 
|turbo frequency1=2,600 MHz
 
|turbo frequency=Yes
 
|bus type=OPI
 
|bus rate=4 GT/s
 
|clock multiplier=10
 
|isa=x86-64
 
|isa family=x86
 
|microarch=Kaby Lake
 
|platform=Kaby Lake
 
|core name=Kaby Lake Y
 
|core family=6
 
|core model=142
 
|core stepping=H0
 
|process=14 nm
 
|technology=CMOS
 
|word size=64 bit
 
|core count=2
 
|thread count=4
 
|max cpus=1
 
|max memory=16 GiB
 
|v core min=0.55 V
 
|v core max=1.52 V
 
|tdp=4.5 W
 
|ctdp down=3.75 W
 
|ctdp down frequency=600 MHz
 
|ctdp up=7 W
 
|ctdp up frequency=1,600 MHz
 
|tjunc min=0 °C
 
|tjunc max=100 °C
 
|tstorage min=-25 °C
 
|tstorage max=125 °C
 
|package name 1=intel,fcbga_1515
 
}}
 
'''Core M3-7Y30''' is a {{arch|64}} [[dual-core]] low-end performance ultra-low power [[x86]] mobile microprocessor introduced by [[Intel]] in mid-[[2016]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's [[14 nm process|14nm+ process]]. The M3-7Y30 operates at 1 GHz with a TDP of 4.5 W supporting a {{intel|Turbo Boost}} frequency of 2.6 GHz. The processor supports up to 16 GiB of dual-channel non-ECC LPDDR3-1866 memory and incorporates Intel's {{intel|HD Graphics 615}} [[IGP]] operating at 300 MHz with a burst frequency of 900 MHz.
 
 
 
This specific model has a configurable TDP-down of 3.75 W with a frequency of 600 MHz and a configurable TDP-up of 7 W with a frequency of 1.6 GHz.
 
== Cache ==
 
{{main|intel/microarchitectures/kaby_lake#Memory_Hierarchy|l1=Kaby Lake § Cache}}
 
{{cache size
 
|l1 cache=128 KiB
 
|l1i cache=64 KiB
 
|l1i break=2x32 KiB
 
|l1i desc=8-way set associative
 
|l1d cache=64 KiB
 
|l1d break=2x32 KiB
 
|l1d desc=8-way set associative
 
|l1d policy=write-back
 
|l2 cache=512 KiB
 
|l2 break=2x256 KiB
 
|l2 desc=4-way set associative
 
|l2 policy=write-back
 
|l3 cache=4 MiB
 
|l3 break=2x2 MiB
 
|l3 desc=12-way set associative
 
|l3 policy=write-back
 
}}
 
 
 
== Memory controller ==
 
{{memory controller
 
|type=DDR3L-1600
 
|type 2=LPDDR3-1866
 
|ecc=No
 
|max mem=16 GiB
 
|controllers=1
 
|channels=2
 
|max bandwidth=27.81 GiB/s
 
|bandwidth schan=13.9 GiB/s
 
|bandwidth dchan=27.81 GiB/s
 
}}
 
 
 
== Expansions ==
 
{{expansions
 
| pcie revision      = 3.0
 
| pcie lanes        = 10
 
| pcie config        = 1x4
 
| pcie config 2      = 2x2
 
| pcie config 3      = 1x2+2x1
 
| pcie config 4      = 4x1
 
}}
 
 
 
== Graphics ==
 
{{integrated graphics
 
| gpu                = HD Graphics 615
 
| device id          = 0x591E
 
 
| designer            = Intel
 
| designer            = Intel
| execution units    = 24
+
| manufacturer        = Intel
| max displays       = 3
+
| model number       = M3-7Y30
| max memory          = 16 GiB
+
| part number        =
| frequency          = 300 MHz
+
| market              = Mobile
| max frequency       = 900 MHz
+
| first announced    =
 +
| first launched      = August 30, 2016
 +
| last order          =  
 +
| last shipment       =  
  
| output crt          =  
+
| family              = Core M3
| output sdvo        =  
+
| series              = 7000
| output dsi          =  
+
| locked              = Yes
| output edp          = Yes
+
| frequency          = 1000 MHz
| output dp           = Yes
+
| turbo frequency    = Yes
| output hdmi        = Yes
+
| turbo frequency1    = 2600 MHz
| output vga          =  
+
| turbo frequency2    =
| output dvi          = Yes
+
| bus type            = DMI 3.0
 +
| bus speed           =  
 +
| bus rate            =
 +
| clock multiplier    = 10
 +
| s-spec              =
 +
| s-spec es          =  
 +
| s-spec qs          =  
 +
| cpuid              =  
  
| directx ver        = 12
+
| microarch          = Kaby Lake
| opengl ver        = 4.4
+
| platform            =  
| opencl ver        = 2.0
+
| chipset            =  
| hdmi ver           = 1.4a
+
| core name           = Kaby Lake Y
| dp ver            = 1.2
+
| core family        =  
| edp ver            = 1.4
+
| core model          =  
| max res hdmi       = 4096x2304
+
| core stepping       =  
| max res hdmi freq  = 24 Hz
+
| process            = 14 nm
| max res dp         = 4096x2304
+
| transistors         =  
| max res dp freq    = 60 Hz
+
| technology          = CMOS
| max res edp        = 4096x2304
+
| die size            =  
| max res edp freq  = 60 Hz
+
| word size          = 64 bit
| max res vga        =  
+
| core count          = 2
| max res vga freq  =
+
| thread count       = 4
 
+
| max cpus           = 1
| features            = Yes
+
| max memory          = 16 GB
| intel quick sync    = Yes
 
| intel intru 3d      = Yes
 
| intel insider       =  
 
| intel widi          =
 
| intel fdi           =  
 
| intel clear video    = Yes
 
| intel clear video hd = Yes
 
}}
 
{{kaby lake hardware accelerated video table|col=1}}
 
  
== Features ==
+
| electrical          = Yes
{{x86 features
+
| v core              =  
|real=Yes
+
| v core tolerance    =  
|protected=Yes
+
| sdp                =  
|smm=Yes
+
| tdp                = 4.5 W
|fpu=Yes
+
| ctdp down          = 3.5 W
|x8616=Yes
+
| ctdp down frequency = 600 MHz
|x8632=Yes
+
| ctdp up            = 7 W
|x8664=Yes
+
| ctdp up frequency  = 1600 MHz
|nx=Yes
+
| temp max            =  
|3dnow=No
+
| temp min            =  
|e3dnow=No
+
| temp max            =  
|mmx=Yes
+
| tjunc min          = 0 °C
|emmx=Yes
+
| tjunc max          = 100 °C
|sse=Yes
+
| tcase min          =  
|sse2=Yes
+
| tcase max          =  
|sse3=Yes
+
| tstorage min        =  
|ssse3=Yes
+
| tstorage max        =  
|sse41=Yes
 
|sse42=Yes
 
|sse4a=Yes
 
|avx=Yes
 
|avx2=Yes
 
  
|abm=Yes
+
| packaging          = Yes
|tbm=No
+
| package            = FCBGA-1515
|bmi1=Yes
+
| package type        = FCBGA
|bmi2=Yes
+
| package pitch      = 0.4 mm
|fma3=Yes
+
| package size        = 20 mm x 16.5 mm
|fma4=No
+
| socket              = BGA-1515
|aes=Yes
+
| socket type        = BGA
|rdrand=Yes
 
|sha=No
 
|xop=No
 
|adx=Yes
 
|clmul=Yes
 
|f16c=Yes
 
|tbt1=No
 
|tbt2=Yes
 
|tbmt3=No
 
|bpt=No
 
|eist=Yes
 
|sst=Yes
 
|flex=Yes
 
|fastmem=No
 
|isrt=Yes
 
|sba=No
 
|mwt=Yes
 
|sipp=No
 
|att=No
 
|ipt=No
 
|tsx=No
 
|txt=No
 
|ht=Yes
 
|vpro=No
 
|vtx=Yes
 
|vtd=Yes
 
|ept=Yes
 
|mpx=Yes
 
|sgx=Yes
 
|securekey=Yes
 
|osguard=Yes
 
|smartmp=No
 
|powernow=No
 
|amdv=No
 
|rvi=No
 
 
}}
 
}}
 +
The '''Core M3-7Y30''' is an ultra-low power dual-core {{arch|64}} [[x86]] microprocessor introduced by [[Intel]] in mid-2016. This MPU operates at 1 GHz with a max turbo frequency of 2.6 GHz. This chip, which is manufactured in [[14 nm process]] based on the {{intel|Kaby Lake}} microarchitecture and incorporates Intel's {{intel|HD Graphics 615}} GPU clocked at 300 MHz with turbo frequency of 900 MHz.

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Facts about "Core M3-7Y30 - Intel"
Has subobject
"Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.
Core M3-7Y30 - Intel#io +
base frequency1,000 MHz (1 GHz, 1,000,000 kHz) +
bus rate4,000 MT/s (4 GT/s, 4,000,000 kT/s) +
bus typeOPI +
clock multiplier10 +
core count2 +
core family6 +
core model142 +
core nameKaby Lake Y +
core steppingH0 +
core voltage (max)1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)0.55 V (5.5 dV, 55 cV, 550 mV) +
designerIntel +
device id0x591E +
familyCore M3 +
first announcedAugust 30, 2016 +
first launchedAugust 30, 2016 +
full page nameintel/core m/m3-7y30 +
has advanced vector extensionstrue +
has advanced vector extensions 2true +
has ecc memory supportfalse +
has extended page tables supporttrue +
has featureAdvanced Encryption Standard Instruction Set Extension +, Advanced Vector Extensions +, Advanced Vector Extensions 2 +, Enhanced SpeedStep Technology +, Extended Page Tables +, Flex Memory Access +, Hyper-Threading Technology +, Intel VT-d +, Intel VT-x +, Memory Protection Extensions +, My WiFi Technology +, OS Guard +, Secure Key Technology +, Smart Response Technology +, Software Guard Extensions +, Speed Shift Technology + and Turbo Boost Technology 2.0 +
has intel enhanced speedstep technologytrue +
has intel flex memory access supporttrue +
has intel my wifi technology supporttrue +
has intel secure key technologytrue +
has intel smart response technology supporttrue +
has intel speed shift technologytrue +
has intel supervisor mode execution protectiontrue +
has intel turbo boost technology 2 0true +
has intel vt-d technologytrue +
has intel vt-x technologytrue +
has locked clock multipliertrue +
has second level address translation supporttrue +
has simultaneous multithreadingtrue +
has x86 advanced encryption standard instruction set extensiontrue +
instance ofmicroprocessor +
integrated gpuHD Graphics 615 +
integrated gpu base frequency300 MHz (0.3 GHz, 300,000 KHz) +
integrated gpu designerIntel +
integrated gpu execution units24 +
integrated gpu max frequency900 MHz (0.9 GHz, 900,000 KHz) +
integrated gpu max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB) +
isax86-64 +
isa familyx86 +
l1$ size128 KiB (131,072 B, 0.125 MiB) +
l1d$ description8-way set associative +
l1d$ size64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description8-way set associative +
l1i$ size64 KiB (65,536 B, 0.0625 MiB) +
l2$ description4-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description12-way set associative +
l3$ size4 MiB (4,096 KiB, 4,194,304 B, 0.00391 GiB) +
ldateAugust 30, 2016 +
main imageFile:kaby lake y (front).png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory16,384 MiB (16,777,216 KiB, 17,179,869,184 B, 16 GiB, 0.0156 TiB) +
max memory bandwidth27.81 GiB/s (28,477.44 MiB/s, 29.861 GB/s, 29,860.76 MB/s, 0.0272 TiB/s, 0.0299 TB/s) +
max memory channels2 +
max pcie lanes10 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureKaby Lake +
min junction temperature273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
model numberM3-7Y30 +
nameCore M3-7Y30 +
packageFCBGA-1515 +
part numberHE8067702739824 +
platformKaby Lake +
process14 nm (0.014 μm, 1.4e-5 mm) +
release price$ 281.00 (€ 252.90, £ 227.61, ¥ 29,035.73) +
s-specSR2ZY + and SR347 +
seriesm3-7Y +
smp max ways1 +
supported memory typeDDR3L-1600 + and LPDDR3-1866 +
tdp4.5 W (4,500 mW, 0.00603 hp, 0.0045 kW) +
tdp down3.75 W (3,750 mW, 0.00503 hp, 0.00375 kW) +
tdp down frequency600 MHz (0.6 GHz, 600,000 kHz) +
tdp up7 W (7,000 mW, 0.00939 hp, 0.007 kW) +
tdp up frequency1,600 MHz (1.6 GHz, 1,600,000 kHz) +
technologyCMOS +
thread count4 +
turbo frequency (1 core)2,600 MHz (2.6 GHz, 2,600,000 kHz) +
word size64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensionstrue +
x86/has software guard extensionstrue +