Editing intel/core i3/i3-7100h

{{intel title|Core i3-7100H}}
{{mpu
| name                = Core i3-7100H
| no image            = Yes
| image               = 
| image size          = 
| caption             = 
| designer            = Intel
| manufacturer        = Intel
| model number        = i3-7100H
| part number         = 
| part number 1       = 
| part number 2       = 
| s-spec              = 
| s-spec 2            = 
| market              = Mobile
| first announced     = January 3, 2017
| first launched      = January 3, 2017
| last order          = 
| last shipment       = 
| release price       = 

| family              = Core i3
| series              = i3-7100
| locked              = Yes
| frequency           = 3,000 MHz
| bus type            = DMI 3.0
| bus speed           = 
| bus rate            = 8 GT/s
| clock multiplier    = 30
| cpuid               = 

| isa family          = x86
| isa                 = x86-64
| microarch           = Kaby Lake
| platform            = Kaby Lake
| chipset             = Sunrise Point
| chipset 2           = Union Point
| core name           = Kaby Lake S
| core family         = Core i3
| core model          = 158
| core stepping       = 
| core stepping 2     = 
| process             = 14 nm
| transistors         = 
| technology          = CMOS
| die area            = 
| die width           = 
| die length          = 
| word size           = 64 bit
| core count          = 2
| thread count        = 4
| max cpus            = 1
| max memory          = 64 GiB

| electrical          = Yes
| v core min          = 0.55 V
| v core max          = 1.52 V
| sdp                 = 
| tdp                 = 35 W
| tjunc min           = 0 °C
| tjunc max           = 100 °C
| tcase min           = 
| tcase max           = 
| tstorage min        = -25 °C
| tstorage max        = 125 °C
| tambient min        = 
| tambient max        = 

| packaging          = Yes
| package            = FCBGA-1356
| package type       = FCBGA
| package pitch      = 0.65 mm
| package size       = 42 mm x 24 mm
| socket             = BGA-1356
| socket type        = BGA
}}
'''Core i3-7100H''' is a {{arch|64}} [[dual-core]] low-end performance [[x86]] mobile microprocessor introduced by [[Intel]] in early [[2017]]. This chip, which is based on the {{intel|Kaby Lake|l=arch}} microarchitecture, is fabricated on Intel's improved [[14 nm|14 nm+ process]]. This processor, which has a base frequency of 3 GHz with a TDP of 35 Watts, supports up to 64 GiB of dual-channel DDR4-2400. The i3-7100H incorporates Intel's {{intel|HD Graphics 630}} [[IGP]] operating at 350 MHz with burst frequency of 950 MHz.
Has subobject "Has subobject" is a predefined property representing a container construct and is provided by Semantic MediaWiki.	Core i3-7100H - Intel#package + and Core i3-7100H - Intel#io +
base frequency	3,000 MHz (3 GHz, 3,000,000 kHz) +
bus rate	8,000 MT/s (8 GT/s, 8,000,000 kT/s) +
bus type	DMI 3.0 +
chipset	Sunrise Point +
clock multiplier	30 +
core count	2 +
core family	6 +
core model	158 +
core name	Kaby Lake H +
core stepping	B0 +
core voltage (max)	1.52 V (15.2 dV, 152 cV, 1,520 mV) +
core voltage (min)	0.55 V (5.5 dV, 55 cV, 550 mV) +
designer	Intel +
device id	0x591B +
family	Core i3 +
first announced	January 3, 2017 +
first launched	January 3, 2017 +
full page name	intel/core i3/i3-7100h +
has advanced vector extensions	true +
has advanced vector extensions 2	true +
has ecc memory support	false +
has extended page tables support	true +
has feature	Advanced Vector Extensions 2 +, Advanced Encryption Standard Instruction Set Extension +, Hyper-Threading Technology +, Speed Shift Technology +, Intel VT-x +, Intel VT-d +, Secure Key Technology +, Flex Memory Access +, Smart Response Technology +, Small Business Advantage +, My WiFi Technology +, Identity Protection Technology +, Advanced Vector Extensions +, Enhanced SpeedStep Technology +, OS Guard +, Extended Page Tables +, Memory Protection Extensions + and Software Guard Extensions +
has intel enhanced speedstep technology	true +
has intel flex memory access support	true +
has intel identity protection technology support	true +
has intel my wifi technology support	true +
has intel secure key technology	true +
has intel small business advantage support	true +
has intel smart response technology support	true +
has intel speed shift technology	true +
has intel supervisor mode execution protection	true +
has intel vt-d technology	true +
has intel vt-x technology	true +
has locked clock multiplier	true +
has second level address translation support	true +
has simultaneous multithreading	true +
has x86 advanced encryption standard instruction set extension	true +
instance of	microprocessor +
integrated gpu	HD Graphics 630 +
integrated gpu base frequency	350 MHz (0.35 GHz, 350,000 KHz) +
integrated gpu designer	Intel +
integrated gpu execution units	24 +
integrated gpu max frequency	950 MHz (0.95 GHz, 950,000 KHz) +
integrated gpu max memory	65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB) +
isa	x86-64 +
isa family	x86 +
l1$ size	128 KiB (131,072 B, 0.125 MiB) +
l1d$ description	8-way set associative +
l1d$ size	64 KiB (65,536 B, 0.0625 MiB) +
l1i$ description	8-way set associative +
l1i$ size	64 KiB (65,536 B, 0.0625 MiB) +
l2$ description	4-way set associative +
l2$ size	0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
l3$ description	16-way set associative +
l3$ size	3 MiB (3,072 KiB, 3,145,728 B, 0.00293 GiB) +
ldate	January 3, 2017 +
main image	+
main image caption	package, front +
manufacturer	Intel +
market segment	Mobile +
max cpu count	1 +
max junction temperature	373.15 K (100 °C, 212 °F, 671.67 °R) +
max memory	65,536 MiB (67,108,864 KiB, 68,719,476,736 B, 64 GiB, 0.0625 TiB) +
max memory bandwidth	35.76 GiB/s (36,618.24 MiB/s, 38.397 GB/s, 38,397.008 MB/s, 0.0349 TiB/s, 0.0384 TB/s) +
max memory channels	2 +
max pcie lanes	16 +
max storage temperature	398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitecture	Kaby Lake +
min junction temperature	273.15 K (0 °C, 32 °F, 491.67 °R) +
min storage temperature	248.15 K (-25 °C, -13 °F, 446.67 °R) +
model number	i3-7100H +
name	Core i3-7100H +
package	FCBGA-1440 +
platform	Kaby Lake +
process	14 nm (0.014 μm, 1.4e-5 mm) +
release price	$ 225.00 (€ 202.50, £ 182.25, ¥ 23,249.25) +
s-spec	SR32T +
series	i3-7100 +
smp max ways	1 +
supported memory type	LPDDR3-2133 +, DDR3L-1600 + and DDR4-2400 +
tdp	35 W (35,000 mW, 0.0469 hp, 0.035 kW) +
technology	CMOS +
thread count	4 +
word size	64 bit (8 octets, 16 nibbles) +
x86/has memory protection extensions	true +
x86/has software guard extensions	true +