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'''Atom Z612''' is an ultra-low power {{arch|32}} [[x86]] system on a chip designed by [[Intel]] and introduced in early [[2010]]. The Z612, which is based on the {{intel|Bonnell|l=arch}} microarchitecture ({{intel|Lincroft|l=core}} core), is fabricated on a [[45 nm process]]. This SoC incorporates a single core operating at 900 MHz with a low frequency mode of 600 MHz and a burst frequency of 1.5 GHz. The chip has a TDP of 1.3 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z612 incorporates a {{imgtec|PowerVR SGX 535|GMA 600}} [[IGP]] operating at 400 MHz.
 
'''Atom Z612''' is an ultra-low power {{arch|32}} [[x86]] system on a chip designed by [[Intel]] and introduced in early [[2010]]. The Z612, which is based on the {{intel|Bonnell|l=arch}} microarchitecture ({{intel|Lincroft|l=core}} core), is fabricated on a [[45 nm process]]. This SoC incorporates a single core operating at 900 MHz with a low frequency mode of 600 MHz and a burst frequency of 1.5 GHz. The chip has a TDP of 1.3 W and supporting up to a 2 GiB of single-channel DDR2-800 memory. Additionally, the Z612 incorporates a {{imgtec|PowerVR SGX 535|GMA 600}} [[IGP]] operating at 400 MHz.
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This chip communicates with the [[southbridge]] chipset (PCH MP30) over two buses: cDMI and cDVO. Both buses go from the SoC to the chipset. cDMI, which is used as the data interface link, operates at 100 MHz using a quad-pumped rate (i.e. 400 MT/s). That bus is composed of an 8-bit transmit and 8-bit receive. The cDVO, which is used as a unidirectional display data link is a quad-pumped 6-bit bus operating 100 MHz for a 400 MT/s effective rate. This model uses CMOS signaling for both buses.
 
  
 
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Retrieved from "https://en.wikichip.org/wiki/intel/atom/z612"
Facts about "Atom Z612 - Intel"
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Atom Z612 - Intel#package +
base frequency900 MHz (0.9 GHz, 900,000 kHz) +
bus rate400 MT/s (0.4 GT/s, 400,000 kT/s) +
bus speed100 MHz (0.1 GHz, 100,000 kHz) +
bus typecDMI +
chipsetLangwell +
clock multiplier9 +
core count1 +
core family6 +
core model38 +
core nameLincroft +
core stepping1 +
core voltage (max)1.2 V (12 dV, 120 cV, 1,200 mV) +
core voltage (min)0.75 V (7.5 dV, 75 cV, 750 mV) +
cpuid20661 +
designerIntel +
die area65.253 mm² (0.101 in², 0.653 cm², 65,252,600 µm²) +
die length8.89 mm (0.889 cm, 0.35 in, 8,890 µm) +
die width7.34 mm (0.734 cm, 0.289 in, 7,340 µm) +
familyAtom +
first announcedMay 4, 2010 +
first launchedMay 4, 2010 +
full page nameintel/atom/z612 +
has ecc memory supportfalse +
has featureHyper-Threading Technology +, Enhanced SpeedStep Technology + and Burst Performance Technology +
has intel burst performance technologytrue +
has intel enhanced speedstep technologytrue +
has locked clock multipliertrue +
has simultaneous multithreadingtrue +
instance ofmicroprocessor +
integrated gpuPowerVR SGX535 +
integrated gpu base frequency400 MHz (0.4 GHz, 400,000 KHz) +
integrated gpu designerImagination Technologies +
integrated gpu max memory256 MiB (262,144 KiB, 268,435,456 B, 0.25 GiB) +
isax86-32 +
isa familyx86 +
l1$ size56 KiB (57,344 B, 0.0547 MiB) +
l1d$ description6-way set associative +
l1d$ size24 KiB (24,576 B, 0.0234 MiB) +
l1i$ description8-way set associative +
l1i$ size32 KiB (32,768 B, 0.0313 MiB) +
l2$ description8-way set associative +
l2$ size0.5 MiB (512 KiB, 524,288 B, 4.882812e-4 GiB) +
ldateMay 4, 2010 +
main imageFile:lincroft chips.png +
manufacturerIntel +
market segmentMobile +
max cpu count1 +
max junction temperature363.15 K (90 °C, 194 °F, 653.67 °R) +
max memory2,048 MiB (2,097,152 KiB, 2,147,483,648 B, 2 GiB, 0.00195 TiB) +
max memory bandwidth2.98 GiB/s (3,051.52 MiB/s, 3.2 GB/s, 3,199.751 MB/s, 0.00291 TiB/s, 0.0032 TB/s) +
max memory channels1 +
max storage temperature398.15 K (125 °C, 257 °F, 716.67 °R) +
microarchitectureBonnell +
min junction temperature248.15 K (-25 °C, -13 °F, 446.67 °R) +
min storage temperature218.15 K (-55 °C, -67 °F, 392.67 °R) +
model numberZ612 +
nameAtom Z612 +
packageFCBGA-518 +
part numberAY80609003042AC +
platformMoorestown +
process45 nm (0.045 μm, 4.5e-5 mm) +
s-specSLBZN +
seriesZ612 +
smp max ways1 +
socketBGA-518 +
supported memory typeDDR-400 + and DDR2-800 +
tdp1.3 W (1,300 mW, 0.00174 hp, 0.0013 kW) +
technologyCMOS +
thread count2 +
transistor count140,000,000 +
turbo frequency (1 core)1,500 MHz (1.5 GHz, 1,500,000 kHz) +
word size32 bit (4 octets, 8 nibbles) +