Revision as of 12:37, 7 September 2017

Template:mpu Kirin 970 is a 64-bit octa-core high-performance mobile ARM LTE SoC introduced by HiSilicon in mid-2017 at the 2017 IFA. This chip, which is fabricated on a 10 nm process, features four Cortex-A73 big cores operating at up to 2.4 GHz along with four Cortex-A53 little cores operating at up to 1.8 GHz. The 970 incorporates ARM's Mali G72 (12 core) IGP operating at ? MHz and supports up to 6 GiB of dual-channel LPDDR4-1866 memory.

Introduced at the 2017 IFA, the overall core organization is identical to the Kirin 960 which was introduced the previous year, but features 20% power efficiency and 40% smaller die area due to the process shrink. The 970 adds many enhancements, including a more powerful Mali G72 GPU and incorporates a new Neural Network Processing Unit (NPU) designed for AI acceleration. The 970 has two improved ISPs and a more powerful LTE modem supporting up to User Equipment (UE) category 18 capable of reaching a maximum downlink of 1.2 Gbps (4x4 MIMO, 256 QAM, 3CC CA).

Cache

Main articles: Cortex-A53 § Cache and Cortex-A73 § Cache

[Edit/Modify Cache Info]

Cache Organization Cache is a hardware component containing a relatively small and extremely fast memory designed to speed up the performance of a CPU by preparing ahead of time the data it needs to read from a relatively slower medium such as main memory. The organization and amount of cache can have a large impact on the performance, power consumption, die size, and consequently cost of the IC. Cache is specified by its size, number of sets, associativity, block size, sub-block size, and fetch and write-back policies. Note: All units are in kibibytes and mebibytes.

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Memory controller

[Edit/Modify Memory Info]

	Integrated Memory Controller
	Max Type LPDDR4-1866 Supports ECC No Max Mem 6 GiB Controllers 1 Channels 2 Width 64 bit Max Bandwidth 27.82 GiB/s 28,487.68 MiB/s 29.871 GB/s 29,871.498 MB/s 0.0272 TiB/s 0.0299 TB/s Bandwidth Single 13.91 GiB/s Double 27.82 GiB/s