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Difference between revisions of "cea-leti/microarchitectures/tsarlet"
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m (David moved page cea-leti/96-core 6-chiplet mips processor to cea-leti/tsarlet without leaving a redirect: CEA told me there's a name for it...)
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{{cealeti title|96-core 6-chiplet 3D stacked MIPS processor|arch}}
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{{cealeti title|TSARLET|arch}}
 
{{microarchitecture}}
 
{{microarchitecture}}
'''96-Core 6-Chiplet 3D stacked MIPS processor''' (''no actual name was given to the project'') was a large-scale high-performance SoC technology demonstration by [[CEA-Leti]]. The project comprised 96 [[MIPS]] cores built using 6 [[chiplets]] [[3D stack]] on an active interposer in order to demonstarte in-package silicon [[scale-out]] capabilities with superior inter-chip capabilities while reducing the overall power and production cost.
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'''TSARLET''' is a large-scale high-performance 3D stacked [[chiplets]]-based SoC technology demonstration by [[CEA-Leti]]. The project comprised 96 [[MIPS]] cores built using 6 [[chiplets]] [[3D stack]] on an active interposer in order to demonstarte in-package silicon [[scale-out]] capabilities with superior inter-chip capabilities while reducing the overall power and production cost.

Revision as of 02:09, 29 February 2020

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* ERROR: "name" is missing!

TSARLET is a large-scale high-performance 3D stacked chiplets-based SoC technology demonstration by CEA-Leti. The project comprised 96 MIPS cores built using 6 chiplets 3D stack on an active interposer in order to demonstarte in-package silicon scale-out capabilities with superior inter-chip capabilities while reducing the overall power and production cost.