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|manufacturer 2=Samsung
 
|manufacturer 2=Samsung
 
|manufacturer 3=GlobalFoundries
 
|manufacturer 3=GlobalFoundries
|Max clock rate=2,45GHz boost
+
|manufacturer 4=SMIC
 
|introduction=October 30, 2012
 
|introduction=October 30, 2012
|process=40 nm
+
|process=28 nm
|process 2=28 nm
+
|process 2=20 nm
|process 3=20 nm
+
|process 3=16 nm
|process 4=16 nm
+
|process 4=14 nm
|process 5=14 nm
+
|process 5=10 nm
|process 6=10 nm
 
 
|cores=1
 
|cores=1
 
|cores 2=2
 
|cores 2=2
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|type=In-order
 
|type=In-order
 
|oooe=No
 
|oooe=No
|speculative=Yes
+
|speculative=No
 
|renaming=No
 
|renaming=No
 
|stages=8
 
|stages=8
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|pipeline=Yes
 
|pipeline=Yes
 
|issues=2
 
|issues=2
 +
|inst=Yes
 +
|cache=Yes
 
|core names=<!-- Yes if specify -->
 
|core names=<!-- Yes if specify -->
 +
|succession=Yes
 
}}
 
}}
 
'''Cortex-A53''' (formerly '''Apollo''') is an ultra-high efficiency [[microarchitecture]] designed by [[ARM Holdings]] as a successor to the {{armh|Cortex-A7|l=arch}}. The Cortex-A53, which implemented the {{arm|ARMv8}} ISA, is typically found in entry-level smartphone and other embedded devices. Often A53 cores are combined with higher performance processors (e.g. based on {{armh|Cortex-A57|l=arch}} or {{armh|Cortex-A72|l=arch}}) in {{armh|big.LITTLE}} configuration to achieve better energy/performance.
 
'''Cortex-A53''' (formerly '''Apollo''') is an ultra-high efficiency [[microarchitecture]] designed by [[ARM Holdings]] as a successor to the {{armh|Cortex-A7|l=arch}}. The Cortex-A53, which implemented the {{arm|ARMv8}} ISA, is typically found in entry-level smartphone and other embedded devices. Often A53 cores are combined with higher performance processors (e.g. based on {{armh|Cortex-A57|l=arch}} or {{armh|Cortex-A72|l=arch}}) in {{armh|big.LITTLE}} configuration to achieve better energy/performance.
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|}
 
|}
  
Note that for big.LITTLE systems it's possible to specify more specific performance tunes:
+
Note that for big.LITTLE system it's possible specify more specific performance tunes:
  
 
* <code>-mtune=cortex-a57.cortex-a53</code>
 
* <code>-mtune=cortex-a57.cortex-a53</code>
 
* <code>-mtune=cortex-a72.cortex-a53</code>
 
* <code>-mtune=cortex-a72.cortex-a53</code>
 
* <code>-mtune=cortex-a73.cortex-a53</code>
 
* <code>-mtune=cortex-a73.cortex-a53</code>
 
 
  
 
== Architecture ==
 
== Architecture ==
=== Key changes from {{\\|Cortex-A7}} ===
 
{{empty section}}
 
=== Block Diagram ===
 
{{empty section}}
 
=== Memory Hierarchy ===
 
 
{{empty section}}
 
{{empty section}}
 
== Licensees ==
 
Arm named the following companies as licensees.
 
 
{{collist
 
|count = 2
 
|
 
* [[Allwinner]] (A64, H5, H6, H64)
 
* [[Amlogic]] (S805X, S905, S912)
 
* [[AMD]]
 
* [[Broadcom]]
 
* [[Samsung]]
 
* [[Altera]]
 
* [[STMicroelectronics]]
 
* [[MediaTek]]
 
* [[Qualcomm]]
 
* [[Xilinx]]
 
}}
 
  
 
== Die ==
 
== Die ==
=== 20 nm ===
+
{{empty section}}
==== Samsung [[Exynos 5433]] ====
 
* Samsung [[20 nm process]]
 
* 113 mm² die size
 
* Mali-T760 (6 EU)
 
* Quad-core Cortex-A53 ([[small cores]])
 
** 32 KiB L1I$ and 32 KiB L1D$ per core, and a shared 256 KiB L2
 
** 4.4 mm² per cluster
 
*** ~1 mm² per core
 
*** ~0.55 mm² for 256 KiB L2 cache
 
* Quad-core {{\\|Cortex-A57}} ([[big cores]])
 
** 48KB L1I$ and 32KB L1D$ per core, and a shared 2 MiB L2
 
** 15.85 mm² per cluster
 
*** ~3 mm² per core
 
*** ~3.87 mm² for 2 MiB L2 cache
 
 
 
 
 
:[[File:exynos 5433 die.png|600px]]
 
 
 
==== MediaTek [[Helio X20]] ====
 
 
 
* TSMC [[20 nm process]]
 
* 100 mm² die size
 
* Quad-core ULP Cortex-A53
 
** ~21.81 mm² per cluster
 
*** ~4.23 mm² per core
 
* Quad-core efficient Cortex-A53
 
** ~29.73 mm² per cluster
 
*** ~5.41 mm² per core
 
* Dual-core High-performance {{\\|Cortex-A72}} +  1 MiB L2
 
** ~27.36 mm² per cluster
 
*** ~ 9.60 mm² per core
 
*** ~ 7.50 mm² for 1 MiB L2
 
 
 
 
 
:[[File:mt6797 die.png|600px]]
 
 
 
=== 16 nm ===
 
==== Renesas [[R-Car H3]] ====
 
* TSMC [[16 nm process]]
 
* 12.94 mm × 8.61 mm
 
* 111.36 mm² die size
 
* Quad-core Cortex-A53
 
** ~3.27 mm² cluster
 
** ~0.60 mm² core
 
** ~0.7`mm² L2 cache
 
* Quad-core {{\\|Cortex-A57}}
 
** ~10.21 mm² cluster
 
** ~1.66 mm² core
 
** ~3.28 mm² L2 cache
 
* {{\\|Cortex-R7}} (dual-core [[lock-step]])
 
** ~1.04 mm² cluster
 
* GX6650 GPU
 
** ~28.12 mm²
 
 
 
 
 
: [[File:r-car h3 die shot.png|650px]]
 
  
 
== All Cortex-A53 Chips ==
 
== All Cortex-A53 Chips ==
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</table>
 
</table>
 
{{comp table end}}
 
{{comp table end}}
 
== Bibliography ==
 
* Pyo, Jungyul, et al. "23.1 20nm high-K metal-gate heterogeneous 64b quad-core CPUs and hexa-core GPU for high-performance and energy-efficient mobile application processor." Solid-State Circuits Conference-(ISSCC), 2015 IEEE International. IEEE, 2015
 
* Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
 

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codenameCortex-A53 +
core count1 +, 2 +, 3 + and 4 +
designerARM Holdings +
first launchedOctober 30, 2012 +
full page namearm holdings/microarchitectures/cortex-a53 +
instance ofmicroarchitecture +
instruction set architectureARMv8 +
manufacturerTSMC +, Samsung + and GlobalFoundries +
microarchitecture typeCPU +
nameCortex-A53 +
pipeline stages8 +
process40 nm (0.04 μm, 4.0e-5 mm) +, 28 nm (0.028 μm, 2.8e-5 mm) +, 20 nm (0.02 μm, 2.0e-5 mm) +, 16 nm (0.016 μm, 1.6e-5 mm) +, 14 nm (0.014 μm, 1.4e-5 mm) + and 10 nm (0.01 μm, 1.0e-5 mm) +