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{{armh title|Cortex-A53|arch}}
 
{{armh title|Cortex-A53|arch}}
 
{{microarchitecture
 
{{microarchitecture
|atype=CPU
+
| atype         = CPU
|name=Cortex-A53
+
| name         = Cortex-A53
|designer=ARM Holdings
+
| designer     = ARM Holdings
|manufacturer=TSMC
+
| manufacturer = TSMC, Samsung
|manufacturer 2=Samsung
+
| introduction = July 2014
|manufacturer 3=GlobalFoundries
+
| phase-out    =
|Max clock rate=2,45GHz boost
+
| process       = 28 nm
|introduction=October 30, 2012
+
| process 2    = 20 nm
|process=40 nm
+
| process 3    = 16 nm
|process 2=28 nm
+
| process 4    = 14 nm
|process 3=20 nm
+
| process 5    = 10 nm
|process 4=16 nm
+
| cores         = 1
|process 5=14 nm
+
| cores 2       = 2
|process 6=10 nm
+
| cores 3       = 3
|cores=1
+
| cores 4       = 4
|cores 2=2
 
|cores 3=3
 
|cores 4=4
 
|type=In-order
 
|oooe=No
 
|speculative=Yes
 
|renaming=No
 
|stages=8
 
|decode=2-way
 
|isa=ARMv8
 
|feature=Hardware virtualization
 
|extension=FPU
 
|extension 2=NEON
 
|extension 3=TrustZone
 
|l1i=8-64 KiB
 
|l1i per=core
 
|l1i desc=2-way set associative
 
|l1d=8-64 KiB
 
|l1d per=core
 
|l1d desc=4-way set associative
 
|l2=128 KiB - 2 MiB
 
|l2 per=cluster
 
|l2 desc=16-way set associative
 
|predecessor=Cortex-A7
 
|predecessor link=arm_holdings/microarchitectures/cortex-a7
 
|successor=Cortex-A55
 
|successor link=arm_holdings/microarchitectures/cortex-a55
 
|pipeline=Yes
 
|issues=2
 
|core names=<!-- Yes if specify -->
 
}}
 
'''Cortex-A53''' (formerly '''Apollo''') is an ultra-high efficiency [[microarchitecture]] designed by [[ARM Holdings]] as a successor to the {{armh|Cortex-A7|l=arch}}. The Cortex-A53, which implemented the {{arm|ARMv8}} ISA, is typically found in entry-level smartphone and other embedded devices. Often A53 cores are combined with higher performance processors (e.g. based on {{armh|Cortex-A57|l=arch}} or {{armh|Cortex-A72|l=arch}}) in {{armh|big.LITTLE}} configuration to achieve better energy/performance.
 
  
Note that this microarchitecture is designed as a synthesizable [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips.
+
| pipeline      = Yes
 +
| type          =
 +
| type 2        =
 +
| type N        =
 +
| OoOE          = No
 +
| speculative  = No
 +
| renaming      =
 +
| isa          = ARMv8
 +
| stages        = 8
 +
| stages min    =
 +
| stages max    =
 +
| issues        = 2
  
== Process Technology ==
+
| inst          = Yes
{{empty section}}
+
| feature      = Hardware virtualization
 +
| extension    = NEON
 +
| extension 2  = TrustZone
 +
| extension N  =
  
== Compiler support ==
+
| cache        = Yes
{| class="wikitable"
+
| l1i          = 8-64 KiB
|-
+
| l1i per      = core
! Compiler !! Arch-Specific || Arch-Favorable || Arch-Target
+
| l1i desc      = 2-way set associative
|-
+
| l1d          = 8-64 KiB
| [[GCC]] || <code>-march=armv8-a</code> || <code>-mtune=cortex-a53</code> || <code>-mcpu=cortex-a53</code>
+
| l1d per      = core
|-
+
| l1d desc      = 4-way set associative
| [[LLVM]] || <code>-march=armv8-a</code> || <code>-mtune=cortex-a53</code> || <code>-mcpu=cortex-a53</code>
+
| l2            = 128 KiB - 2 MiB
|}
+
| l2 per        = cluster
 +
| l2 desc      = 16-way set associative
 +
| l3            =  
 +
| l3 per        =  
 +
| l3 desc      =
  
Note that for big.LITTLE systems it's possible to specify more specific performance tunes:
+
| core names      = <!-- Yes if specify -->
 +
| core name        =
 +
| core name 2      =
 +
| core name N      =
  
* <code>-mtune=cortex-a57.cortex-a53</code>
+
| succession      = Yes
* <code>-mtune=cortex-a72.cortex-a53</code>
+
| predecessor      = Cortex-A9
* <code>-mtune=cortex-a73.cortex-a53</code>
+
| predecessor link = arm_holdings/microarchitectures/cortex-a9
 +
| successor        =
 +
| successor link  =
 +
| successor 2      =
 +
| successor 2 link =
 +
}}
 +
'''Cortex-A53''' (formerly '''Apollo''') is an ultra-high efficiency [[microarchitecture]] designed by [[ARM Holdings]] as a successor to the {{armh|Cortex-A9|l=arch}}. The Cortex-A53, which implemented the {{arm|ARMv8}} ISA, is typically found in entry-level smartphone and other embedded devices. Often A53 cores are combined with higher performance processors (e.g. based on {{armh|Cortex-A57|l=arch}} or {{armh|Cortex-A72|l=arch}}) in {{armh|big.LITTLE}} configuration to achieve better energy/performance.
  
 +
Note that this microarchitecture is designed as a synthesizable [[IP core]] and is sold to other semiconductor companies to be implemented in their own chips.
  
 +
== Process Technology ==
 +
{{empty section}}
  
 
== Architecture ==
 
== Architecture ==
=== Key changes from {{\\|Cortex-A7}} ===
 
{{empty section}}
 
=== Block Diagram ===
 
{{empty section}}
 
=== Memory Hierarchy ===
 
 
{{empty section}}
 
{{empty section}}
 
== Licensees ==
 
Arm named the following companies as licensees.
 
 
{{collist
 
|count = 2
 
|
 
* [[Allwinner]] (A64, H5, H6, H64)
 
* [[Amlogic]] (S805X, S905, S912)
 
* [[AMD]]
 
* [[Broadcom]]
 
* [[Samsung]]
 
* [[Altera]]
 
* [[STMicroelectronics]]
 
* [[MediaTek]]
 
* [[Qualcomm]]
 
* [[Xilinx]]
 
}}
 
  
 
== Die ==
 
== Die ==
=== 20 nm ===
+
{{empty section}}
==== Samsung [[Exynos 5433]] ====
 
* Samsung [[20 nm process]]
 
* 113 mm² die size
 
* Mali-T760 (6 EU)
 
* Quad-core Cortex-A53 ([[small cores]])
 
** 32 KiB L1I$ and 32 KiB L1D$ per core, and a shared 256 KiB L2
 
** 4.4 mm² per cluster
 
*** ~1 mm² per core
 
*** ~0.55 mm² for 256 KiB L2 cache
 
* Quad-core {{\\|Cortex-A57}} ([[big cores]])
 
** 48KB L1I$ and 32KB L1D$ per core, and a shared 2 MiB L2
 
** 15.85 mm² per cluster
 
*** ~3 mm² per core
 
*** ~3.87 mm² for 2 MiB L2 cache
 
 
 
 
 
:[[File:exynos 5433 die.png|600px]]
 
 
 
==== MediaTek [[Helio X20]] ====
 
 
 
* TSMC [[20 nm process]]
 
* 100 mm² die size
 
* Quad-core ULP Cortex-A53
 
** ~21.81 mm² per cluster
 
*** ~4.23 mm² per core
 
* Quad-core efficient Cortex-A53
 
** ~29.73 mm² per cluster
 
*** ~5.41 mm² per core
 
* Dual-core High-performance {{\\|Cortex-A72}} +  1 MiB L2
 
** ~27.36 mm² per cluster
 
*** ~ 9.60 mm² per core
 
*** ~ 7.50 mm² for 1 MiB L2
 
 
 
 
 
:[[File:mt6797 die.png|600px]]
 
 
 
=== 16 nm ===
 
==== Renesas [[R-Car H3]] ====
 
* TSMC [[16 nm process]]
 
* 12.94 mm × 8.61 mm
 
* 111.36 mm² die size
 
* Quad-core Cortex-A53
 
** ~3.27 mm² cluster
 
** ~0.60 mm² core
 
** ~0.7`mm² L2 cache
 
* Quad-core {{\\|Cortex-A57}}
 
** ~10.21 mm² cluster
 
** ~1.66 mm² core
 
** ~3.28 mm² L2 cache
 
* {{\\|Cortex-R7}} (dual-core [[lock-step]])
 
** ~1.04 mm² cluster
 
* GX6650 GPU
 
** ~28.12 mm²
 
 
 
 
 
: [[File:r-car h3 die shot.png|650px]]
 
  
 
== All Cortex-A53 Chips ==
 
== All Cortex-A53 Chips ==
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           Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
 
           Missing a chip? please dump its name here: http://en.wikichip.org/wiki/WikiChip:wanted_chips
 
-->
 
-->
{{comp table start}}
+
<table class="wikitable sortable">
<table class="comptable sortable tc18 tc19 tc20 tc21 tc22 tc23">
+
<tr><th colspan="10" style="background:#D6D6FF;">Cortex-A53 Chips</th></tr>
<tr class="comptable-header"><th>&nbsp;</th><th colspan="25">List of all Cortex-A53 Chips</th></tr>
+
<tr><th colspan="8">Main processor</th><th colspan="2">IGP</th></tr>
<tr class="comptable-header"><th>&nbsp;</th><th colspan="10">Main processor</th><th colspan="3">IGP</th></tr>
+
<tr><th>Model</th><th>Designer</th><th>Family</th><th>Core</th><th>Launched</th><th>Cores</th><th>Frequency</th><th>Max Mem</th><th>Name</th><th>Freq</th></tr>
{{comp table header 1|cols=Launched, Designer, Family, Process, Core, C, T, L2$, L3$, Frequency, Max Mem, Designer, Name, Frequency}}
 
 
{{#ask: [[Category:all microprocessor models]] [[microarchitecture::Cortex-A53]]
 
{{#ask: [[Category:all microprocessor models]] [[microarchitecture::Cortex-A53]]
 
  |?full page name
 
  |?full page name
 
  |?model number
 
  |?model number
|?first launched
 
 
  |?designer
 
  |?designer
 
  |?microprocessor family
 
  |?microprocessor family
|?process
 
 
  |?core name
 
  |?core name
 +
|?first launched
 
  |?core count
 
  |?core count
|?thread count
 
|?l2$ size
 
|?l3$ size
 
 
  |?base frequency#GHz
 
  |?base frequency#GHz
 
  |?max memory#GiB
 
  |?max memory#GiB
|?integrated gpu designer
 
 
  |?integrated gpu
 
  |?integrated gpu
 
  |?integrated gpu base frequency
 
  |?integrated gpu base frequency
 +
|?has simultaneous multithreading
 
  |format=template
 
  |format=template
  |template=proc table 3
+
  |template=proc table 2
 
  |searchlabel=
 
  |searchlabel=
|sort=microprocessor family, model number
+
  |userparam=11
|order=asc,asc
 
  |userparam=15
 
 
  |mainlabel=-
 
  |mainlabel=-
|limit=100
 
|valuesep=,
 
 
}}
 
}}
{{comp table count|ask=[[Category:all microprocessor models]] [[microarchitecture::Cortex-A53]]}}
+
{{table count|col=11|ask=[[Category:all microprocessor models]] [[microarchitecture::Cortex-A53]]}}
 
</table>
 
</table>
{{comp table end}}
 
 
== Bibliography ==
 
* Pyo, Jungyul, et al. "23.1 20nm high-K metal-gate heterogeneous 64b quad-core CPUs and hexa-core GPU for high-performance and energy-efficient mobile application processor." Solid-State Circuits Conference-(ISSCC), 2015 IEEE International. IEEE, 2015
 
* Mair, Hugh T., et al. "4.3 A 20nm 2.5 GHz ultra-low-power tri-cluster CPU subsystem with adaptive power allocation for optimal mobile SoC performance." Solid-State Circuits Conference (ISSCC), 2016 IEEE International. IEEE, 2016.
 

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codenameCortex-A53 +
core count1 +, 2 +, 3 + and 4 +
designerARM Holdings +
first launchedOctober 30, 2012 +
full page namearm holdings/microarchitectures/cortex-a53 +
instance ofmicroarchitecture +
instruction set architectureARMv8 +
manufacturerTSMC +, Samsung + and GlobalFoundries +
microarchitecture typeCPU +
nameCortex-A53 +
pipeline stages8 +
process40 nm (0.04 μm, 4.0e-5 mm) +, 28 nm (0.028 μm, 2.8e-5 mm) +, 20 nm (0.02 μm, 2.0e-5 mm) +, 16 nm (0.016 μm, 1.6e-5 mm) +, 14 nm (0.014 μm, 1.4e-5 mm) + and 10 nm (0.01 μm, 1.0e-5 mm) +