Revision as of 20:06, 23 March 2018

Zeppelin is a scalable system on a chip designed by AMD in order to satisfy the need of multiple market segments.

Overview

Zeppelin is an SoC designed by AMD capable of scaling from a single-die to a multi-chip package consisting of up to 4 dies interconnected together using AMD's proprietary Infinity Fabric. The die consists of two CPU Complexes, two DDR4 channels, USB, low-power I/O, and a series of IFOP and IFIS SerDes that are used to interlink multiple dies and sockets together.