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Latest revision | Your text | ||
Line 8: | Line 8: | ||
|microarch=Steamroller | |microarch=Steamroller | ||
|tdp=35 W | |tdp=35 W | ||
− | |package name | + | |package name=BGA-854 |
− | |||
|package type=Organic Micro Ball Grid Array | |package type=Organic Micro Ball Grid Array | ||
|package contacts=854 | |package contacts=854 | ||
|package dimension=29 mm | |package dimension=29 mm | ||
|package dimension 2=32 mm | |package dimension 2=32 mm | ||
− | |package pitch=0.8 mm | + | |package pitch=0.8-1.2 mm |
}} | }} | ||
Facts about "Package FP3 - AMD"
designer | AMD + |
first launched | June 2014 + |
instance of | package + |
market segment | Mobile + and Embedded + |
microarchitecture | Steamroller + |
name | Package FP3 + |
package | BGA-854 + and FP3 + |
package contacts | 854 + |
package length | 29 mm (2.9 cm, 1.142 in) + |
package pitch | 0.8 mm (0.0315 in) + |
package type | Organic Micro Ball Grid Array + |
package width | 32 mm (3.2 cm, 1.26 in) + |
tdp | 35 W (35,000 mW, 0.0469 hp, 0.035 kW) + |