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Facts about "Package FP2 - AMD"
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designerAMD +
first launchedMay 15, 2012 +
instance ofpackage +
market segmentMobile + and Embedded +
microarchitecturePiledriver +
namePackage FP2 +
packageFP2 + and BGA-827 +
package contacts827 +
package length31 mm (3.1 cm, 1.22 in) +
package pitch0.8 mm (0.0315 in) +
package typeOrganic Micro Ball Grid Array +
package width27 mm (2.7 cm, 1.063 in) +
tdp25 W (25,000 mW, 0.0335 hp, 0.025 kW) +