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Latest revision | Your text | ||
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|package dimension=31 mm | |package dimension=31 mm | ||
|package dimension 2=27 mm | |package dimension 2=27 mm | ||
− | |package pitch=0.8 mm | + | |package pitch=0.8-1.2 mm |
}} | }} | ||
Facts about "Package FP2 - AMD"
designer | AMD + |
first launched | May 15, 2012 + |
instance of | package + |
market segment | Mobile + and Embedded + |
microarchitecture | Piledriver + |
name | Package FP2 + |
package | BGA-827 + and FP2 + |
package contacts | 827 + |
package length | 31 mm (3.1 cm, 1.22 in) + |
package pitch | 0.8 mm (0.0315 in) + |
package type | Organic Micro Ball Grid Array + |
package width | 27 mm (2.7 cm, 1.063 in) + |
tdp | 25 W (25,000 mW, 0.0335 hp, 0.025 kW) + |