From WikiChip
Editing amd/packages/fp2
Warning: You are not logged in. Your IP address will be publicly visible if you make any edits. If you log in or create an account, your edits will be attributed to your username, along with other benefits.
The edit can be undone.
Please check the comparison below to verify that this is what you want to do, and then save the changes below to finish undoing the edit.
This page supports semantic in-text annotations (e.g. "[[Is specified as::World Heritage Site]]") to build structured and queryable content provided by Semantic MediaWiki. For a comprehensive description on how to use annotations or the #ask parser function, please have a look at the getting started, in-text annotation, or inline queries help pages.
Latest revision | Your text | ||
Line 8: | Line 8: | ||
|microarch=Piledriver | |microarch=Piledriver | ||
|tdp=25 W | |tdp=25 W | ||
− | |package name | + | |package name=BGA-827 |
− | |||
|package type=Organic Micro Ball Grid Array | |package type=Organic Micro Ball Grid Array | ||
|package contacts=827 | |package contacts=827 |
Facts about "Package FP2 - AMD"
designer | AMD + |
first launched | May 15, 2012 + |
instance of | package + |
market segment | Mobile + and Embedded + |
microarchitecture | Piledriver + |
name | Package FP2 + |
package | BGA-827 + and FP2 + |
package contacts | 827 + |
package length | 31 mm (3.1 cm, 1.22 in) + |
package pitch | 0.8 mm (0.0315 in) + |
package type | Organic Micro Ball Grid Array + |
package width | 27 mm (2.7 cm, 1.063 in) + |
tdp | 25 W (25,000 mW, 0.0335 hp, 0.025 kW) + |