Semiconductor & Computer Engineering
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Information for "amd/packages/sp4"
Basic information
| Display title | Package SP4 - AMD |
| Default sort key | Package SP4, AMD |
| Page length (in bytes) | 7,628 |
| Page ID | 36649 |
| Page content language | English (en) |
| Page content model | wikitext |
| Indexing by robots | Allowed |
| Number of redirects to this page | 0 |
| Counted as a content page | Yes |
| Number of subpages of this page | 0 (0 redirects; 0 non-redirects) |
Page protection
| Edit | Allow all users (infinite) |
| Move | Allow all users (infinite) |
Edit history
| Page creator | QuietRub (talk | contribs) |
| Date of page creation | 06:09, 6 April 2022 |
| Latest editor | QuietRub (talk | contribs) |
| Date of latest edit | 04:09, 24 March 2023 |
| Total number of edits | 2 |
| Total number of distinct authors | 1 |
| Recent number of edits (within past 90 days) | 0 |
| Recent number of distinct authors | 0 |
Page properties
| Transcluded templates (19) | Templates used on this page:
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Facts about "Package SP4 - AMD"
| designer | AMD + |
| first launched | February 21, 2018 + |
| instance of | package + |
| market segment | Embedded + |
| microarchitecture | Zen + |
| name | SP4 + |
| package | SP4 + |
| package length | 45 mm (4.5 cm, 1.772 in) + |
| package pitch | 0.8 mm (0.0315 in) + |
| package type | FC-OBGA + |
| package width | 45 mm (4.5 cm, 1.772 in) + |
| tdp | 100 W (100,000 mW, 0.134 hp, 0.1 kW) + |
