Semiconductor & Computer Engineering
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- | die size = 89 mm²2 KB (218 words) - 15:18, 13 December 2017
- | die size = 89 mm²2 KB (227 words) - 15:18, 13 December 2017
- | die size = 89 mm²3 KB (270 words) - 15:18, 13 December 2017
- | tcase max = 89 °C5 KB (567 words) - 00:55, 29 April 2018
- |tcase max=89 °C9 KB (1,297 words) - 01:46, 29 December 2019
- |tcase max=89 °C9 KB (1,357 words) - 02:38, 29 December 2019
- |tcase max=89 °C5 KB (796 words) - 14:23, 8 May 2019
- |tcase max=89 °C11 KB (1,509 words) - 02:38, 29 December 2019
- |tcase max=89 °C6 KB (834 words) - 02:38, 29 December 2019
- |dts max=89 °C |bandwidth schan=15.89 GiB/s4 KB (614 words) - 23:21, 28 December 2019
- |dts max=89 °C |bandwidth schan=15.89 GiB/s4 KB (622 words) - 23:23, 28 December 2019
- |dts max=89 °C7 KB (1,027 words) - 12:16, 29 December 2019
- |dts max=89 °C7 KB (993 words) - 12:16, 29 December 2019
- |tcase max=89 °C4 KB (593 words) - 01:12, 15 August 2019
- |tcase max=89 °C3 KB (563 words) - 01:44, 15 August 2019
- |tcase max=89 °C4 KB (588 words) - 02:32, 28 February 2020
