...] in [[Digital electronics|digital]] and [[Analogue electronics|analog]] [[integrated circuits]] (ICs),<ref name="Ashley" /> and the most common [[power device]] MOSFETs can either be manufactured as part of [[MOS integrated circuit]] chips or as discrete MOSFET devices (such as a [[power MOSFET]]), and can

...isbn=978-0-88275-382-9}}</ref> and the [[MOS transistor]] and [[integrated circuit]] chip in 1959. ...ce passivation]] process in 1957, [[MOSFET]] in 1959, and [[MOS integrated circuit]] chip in 1960.]]

{{title|Integrated Circuit (IC)}} ...ectronic components interconnected to form a complete electronic function. Integrated circuits are the most essential part of all electronic products.

...ook |last1=Lee |first1=Thomas H. |title=The Design of CMOS Radio-Frequency Integrated Circuits |date=2003 |publisher=[[Cambridge University Press]] |isbn=9781139 ...emiconductor industry]] as it made mass-production of silicon [[integrated circuit]]s possible.<ref name="atalla">{{cite article|title=Martin Atalla in Invent

...eld''' ('''LKF''') is a high-performance low-power [[3d integrated circuit|3D]] microarchitecture designed by Intel and introduced in [[2019]]. * [[3D integrated circuit]]

'''Foveros''' is a high-performance [[three-dimensional integrated circuit]] (3D IC) face-to-face-based packaging technology designed by [[Intel]]. First introduced in 2019, Foveros is an advanced 3D face-to-face die stacking packaging process technology. The technology is d

...5 PCnet™-FAST I I I Single-Chip 10/100 Mbps PCI Ethernet Controller with Integrated PHY]||2000-07-31|| ...m/system/files/TechDocs/23111.pdf Am186CC Microcontroller Power Management Circuit Application Note]||1999-11-01||